200-V high-side thick-layer-SOI field PLDMOS for HV switching IC

Abstract

A novel high-voltage (HV) thick layer silicon-on-insulator (SOI) field p-channel lateral double-diffused metal-oxide semiconductor (pLDMOS) with single trench isolation is developed for HV switching IC based on 11-µm-thick silicon layer and 1-µm-thick buried oxide layer. The thick gate oxide layer is formed by field oxide process to endure the high voltage between the source and gate electrodes. The deep trench is adopted to realize the compatibility between HV pLDMOS and LV CMOS. The device parameters T, Y for the HV SOI field pLDMOS are optimized to reduce the device size and satisfy the off-state breakdown voltage (BV). The HV SOI field pLDMOS with a BV over 200V is experimentally realized and successfully applied to a 96-bit output driver integrated circuit (IC).