Thermoelectric technologies can be used for waste heat power generation, and for solid-state cooling without environmentally hazardous refrigerants or moving parts. Thermoelectric cooling materials like the Bismuth Tellurides have been intensively investigated for several decades, but to date, thermoelectric cooling device applications have been limited to niche markets, because of their low cooling efficiency and high power consumption. Here, we demonstrate a thermoelectric module with significantly enhanced cooling performance and low power consumption, with fast cooling, using state-of-the-art p-/n-type Bi2Te3 based thermoelectric materials. Small grain size and anisotropic texture were achieved an exceptional high performance in the p-type Ag0.0006Bi0.46Sb1.5Te3.07 and n-type (CuI)0.002Bi2Te2.7Se0.3 compounds through rapid solidification and hot extrusion processes, resulting in significantly improved thermoelectric performance over a wide temperature range (zTmax = 1.45 for the p-type and 1.40 for the n-type compounds). The observed temperature-dependent thermoelectric properties in the n-type (CuI)0.002Bi2Te2.7Se0.3 compound could be explained in terms of Rashba band splitting rather than the multiband Boltzmann transport equations. We suggest that the enhancement of thermoelectric performance is due to the increase in chemical potential by Ag- (p-type) and CuI-doping (n-type) which suppresses bipolar diffusion, while the anisotropic texture and micro grains decreases lattice thermal conductivity. The thermoelectric module using these state-of-the-art thermoelectric materials demonstrated a reduction in power consumption by 38% and an increase of cooling speed by 170% compared with commercial single crystal-based TE devices, which is promising for practical applications.
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