Wafer bonding can be adapted from the silicon processing industry and applied to assembly of fuel cells, which traditionally suffer from low manufacturability readiness and lack of high-volume production methods. The requirements for the bond when used in fuel cells are different than for typical electronic products and new evaluation standards have to be developed. In response, a comprehensive methodology has been proposed for assessing suitability of wafer bonding techniques for use in silicon-based fuel cell. The first part of this protocol, which includes electrical measurements of the quality of the wafer bond using Electrochemical Impedance Spectroscopy, is presented here, while the complete testing methodology will be reported elsewhere. Five different bonding compounds were tested at room temperature and atmospheric relative humidity conditions. Subsequent testing steps will examine behavior of these bonds under typical fuel cell voltage, elevated temperature and pressure, high relative humidity, and presence of electrolyte.