Thermal Management Of Electronic Components Research Articles

MXene-modified lemon peel-based composite phase change material with excellent photo-thermal conversion efficiency, thermal storage capacity and thermal conductivity for thermal management of electronic components

The preparation of multifunctional composite phase change materials using green technology to achieve an efficient energy storage and conversion remains an issue of concern. In this paper, a lemon peel-based porous carbon (LPC) composite phase change material (CPCM) was prepared by using polyethylene glycol (PEG) 6000 as a phase change medium and MXene nanosheet-modified carbonized lemon peel as a support carrier. MXene nanosheets were bonded to a lemon peel-based porous carbon skeleton to construct an excellent continuous three-dimensional thermally conductive grid system. What makes it noteworthy is that the presence of MXene nanosheets substantially improves the thermal conductivity (0.66 W/mK) and photo-thermal conversion efficiency (θ = 96.4 %) of MXene-modified lemon peel-based porous carbon/polyethylene glycol composite phase change materials (PEG/LPC@M). It is noteworthy that PEG/LPC@M has remarkable thermal stability and still has high enthalpy after 100 cycles, which further proves the recyclability of PEG/LPC@M and PEG/LPC@M embodies great potential in the field of thermal management of electronic components. In conclusion, a novel multifunctional CPCM was prepared by a simple and green process method in this study, which provides a new idea for waste recycling and reuse, and also has a wide range of applications in thermal management of electronic devices.

Evaporation characteristics of cis-1,1,1,4,4,4-hexafluoro-2-butene (R1336mzz(Z)) droplet in high pressure and temperature environments

Cis-1,1,1,4,4,4-hexafluoro-2-butene (R1336mzz(Z)) has emerged as an exceptionally promising low-global-warming-potential (GWP) refrigerant, ideal for spray cooling systems in the thermal management of electronic components. Research on the evaporation characteristics of an individual isolated cryogen droplet excludes uncertainties caused by droplet collisions and fusion, thereby laying the foundation for spray cooling. In this paper, a theoretical model for single R1336mzz (Z) droplet evaporation considering the effect of natural convection in a high pressure and temperature environment is proposed. The newly proposed model is validated by comparing the predicted results of the R1336mzz(Z) droplet evaporation with experimental data. Then, the effects of environmental temperature (323–523 K) and pressure (1–20 bar) on the R1336mzz(Z) droplet evaporation are investigated. The results reveal that the effect of increasing the ambient pressure on the droplet lifetime of R1336mzz(Z) undergoes a transition from deceleration to acceleration. Elevated temperature can promote droplet evaporation; however, the promoting effect of increasing the ambient temperature on droplet evaporation will be weakened in high-pressure cases. Increasing the ambient pressure and temperature both can enhance the heat transfer from the environment to the droplet through natural convection, while increasing the pressure greatly inhibits the molecular diffusion during droplet evaporation. Thus, the total evaporation rate depends on the competing effects of these two factors. In addition, the trend of the droplet temperature variation could differ based on droplet initial temperatures, ambient temperatures, and pressures. An increase in the ambient temperature or pressure corresponds to an increase in the droplet equilibrium temperature (Tequ). However, Tequ is almost independent of the droplet initial size and temperature.

Numerical study and multi-optimization of heat transfer performance in counter flow minichannel heat sink with slots on ribs using NSGA-Ⅱ

High temperature and nonuniformity temperature cause thermal failure and thermal deformation for high-heat flux electronic devices. To address this issue, a counter flow minichannel heat sink with slots on ribs is designed. A 3D conjugated heat transfer model based on computational fluid dynamics (CFD) was developed to investigate effect of slots number (i) and growth rate of slot width (j) on average Nusselt number (Nu), local temperature distribution and temperature standard deviation (σ). The results show that design parameters i and j significantly influence heat transfer capability and temperature uniformity. However, there is no clear pattern between design parameters (i and j) and heat transfer performance (Nu and σ) to guide design. Furthermore, a non-dominated sequencing genetic algorithm (NSGA-Ⅱ) multi-objective optimization coupled Artificial Neural Network (ANN) is conducted with the consideration of maximum Nusselt number Nu and minimum temperature standard deviation (σ) as objectives. Technique for Order Preference by Similarity to Ideal Solution (TOPSIS) method is employed to determine the best solution from the Pareto front, i.e., multi-objective optimization solutions set. The optimized solution obtains 2.1 times increase in average Nusselt number and 0.36 times decrease in temperature standard deviation compared with conventional counter flow minichannel heat sink. This work serves as a guideline for designing minichannel heat sinks for thermal management of electronic components.

Effect of TiO2 on the thermal performance and emissivity of glass coatings

Deep space exploration missions pose significant challenges to the temperature stability and thermal management of electronic components in spacecraft.

Optimizing heat transfer efficiency in electronic component cooling through fruit waste-derived phase change material

This study focuses on the development and evaluation of heat sinks designed for the thermal management of electronic components operating under low-temperature conditions. Two distinct heat sink configurations were investigated: one featuring a hollow structure without fins and the other incorporating equidistant triangular fins. These heat sinks were subjected to varying heat input levels of 35 W, 40 W, and 45 W. To enhance thermal performance, various thermal enhancement techniques were employed, including the integration of phase change materials, graphene nanoparticles, and nanoparticles coated with dragon fruit extract. The results of this investigation revealed significant improvements in the heating-cooling cycle. It was observed that the heating effectiveness of the heat sink increased by 23 %, 11 %, and 6.8 %, respectively, when employing dragon fruit extract-coated nanoparticles in conjunction with phase change material. After increasing the heat input to 40 W, the heating and cooling cycle of the heat sink containing PCM and without fins was reduced by 18 %. Coating the nanoparticles with dragon fruit extract reduced the heating and cooling cycle time by 37 % compared to the heat sink without fins and PCM included. Further optimisation studies substantiated these findings, affirming the efficacy of the proposed approach. In summary, incorporating dragon fruit extract-coated graphene nanoparticles demonstrated a noteworthy enhancement in the heating-cooling cycle, proportionate to the applied heat input, within the context of finned heat sinks employed for electronic component thermal management.

Experimental study about the impact of open cell aluminium foam (OCAF) insertion in salt-based phase change material (PCM) for electronics thermal management

Thermal management of electronic components is a critical task in a harsh thermal environment. Spacecraft and satellites' electronics are susceptible to highly intermittent heating and cooling thermal conditions, which imposes challenges for robust thermal management system design. Phase change materials (PCM) are a promising solution for overcoming these challenges and enhancing thermal control performance. The lower PCM thermal conductivity and PCM supercooling limit PCM utilisation in electronic thermal control systems. The present study aims to provide solutions for enhancing the heat transfer within the PCM, boosting the PCM thermal conductivity, and diminishing the PCM supercooling. The open-cell aluminium foam (OCAF) was adopted for boosting the heat transfer within the PCM. A thermal management module (TMM) integrated with a salt-based PCM/OCAF composite was developed for electronics thermal management. The TMM was tested under intermittent thermal conditions of heating and cooling. An electric heater and Peltier cooler were affixed to the TMM for the heating and cooling process, respectively. Three levels of heat fluxes were adopted: 700, 1000, and 1400 W/m2. The heating process lasted one hour; then, the TMM was cooled by the Peltier element to the initial temperature. The research novelty covers the gap in understanding how OCAF affects salt-based PCM supercooling when subjected to varying heating loads during intermittent cycles. The outcomes reported a remarkable improvement in thermal management efficiency. The PCM-based TMM reduced the highest temperature by about 20.4 %, 21.6 %, and 23 % at the three heating levels. The OCAF diminished the PCM supercooling curiously. The reduction in PCM supercooling was 43.5 % compared to the 100 % PCM case obtained at the heat flux of 1400 W/m2.

Effects of shark bionic V-groove structures and nanofluids on thermal management of electronic components

The miniaturization of electronic components makes it difficult for the traditional radiator working medium and radiator structure to meet the requirements. The combination of nanofluids and bionic micro-surfaces is beneficial to solve the heat dissipation problem of electronic components. Based on the bionics, a CPU enhanced heat dissipation system was designed and built based on the V-shaped groove of shark scales and Fe3O4-H2O nanofluids with high heat transfer coefficient. The effects of V-groove angle, height and nanofluids concentration on the comprehensive evaluation index of the radiator were studied. The groove angle S= 1 mm (54°) and height H= 2 mm have the best heat transfer characteristics and comprehensive evaluation index, which can reduce the surface temperature by 2.16 °C and 3.71 °C at most, and increase the heat transfer efficiency by 17.58% and 28.96%. There is a critical concentration (0.3%) that makes the system cooling effect best. The results of the study have a certain reference value for the structural design of heat sink

MXene-decorated bio-based porous carbon composite phase change material for superior solar-thermal energy storage and thermal management of electronic components

Energy storage technology based on phase change materials (PCM) can effectively solve the problem of poor energy utilization. However, PCM suffer from problems such as low thermal conductivity and easy leakage, which seriously hinder their application in fields such as thermal energy storage. To solve the above issues, this research prepared a series of novel composite PCM by immersing polyethylene glycol (PEG) into MXene-wrapped wood-based porous carbon support materials through a simple vacuum impregnation method. Specially, the balsa wood-derived porous carbon has excellent skeletal structure and hydrophilicity under 1000 °C carbonization temperature and delignification treatment. Further, the effect of MXene content on the properties of the composite PCM was systematically investigated. It was shown that the composite PCM (PDM-20) made within 20 mg/mL MXene dispersion had the best overall performance, with a significant increase in thermal conductivity up to 0.69 W m−1 K−1, the enthalpy efficiency and relative enthalpy efficiency values of 96.8 %/103.0 %, respectively, while the photo-thermal conversion efficiency reaching 90.1 %, which was much higher than that of the unmodified composite PCM. In addition, PDM-20 provided a remarkable delayed effect on the heating and cooling of electronic components. Therefore, PDM-20 prepared in this study has broad application prospects in heat storage, solar thermal absorption and heat management of electronic devices. Meanwhile, it also offers a new idea for the development and fabrication of green and environmentally friendly composite PCM.

A critical review on single-phase thermo-hydraulic enhancement in geometrically modified microchannel devices

The usage of liquid-cooled microchannel heat dissipation devices is gaining importance in thermal management of electronic components owing to miniaturization. The development of such devices requires a deeper knowledge of the flow characteristics within geometrically modified microchannels. This article critically examines the research on modifications in geometry of channels for thermo-hydraulic performance enhancement. The article aims to determine the best channel configuration with optimal parameters that can maximize the overall performance of the device. For this purpose, collected research have been scrutinized in ascending order of the complexity in channel design. This article explores various designs and their influencing parameters, starting with linear and non-linear microchannel shapes, followed by bifurcated and connected secondary channels and, in the end, configurations with structured roughness such as cavities, ribs and cavity-rib combinations in it. Finally, conclusions of the examined research are presented with an analysis of their implications as well as gaps and potential recommendations for future research.

Lattice Boltzmann simulation of natural convection heat transfer phenomenon for thermal management of multiple electronic components

Thermal management of electronic components is becoming a vital necessity in view of the rapid development of electronics technology. It is a concern imposed by the miniaturization of electronic chipsets. The present work addresses this issue numerically, using the lattice Boltzmann method (LBM). It consists of an air-filled heat sink containing multiple protruding electronic components. The problem is modelled using 2D continuity, momentum, and energy conservation equations. The thermal and dynamic fluid flow are analysed for various enclosure inclinations (0°, 45°, and 90°) and Rayleigh numbers (Ra=103-106). A twin protruding heat sources are considered at the bottom wall. The top cold wall can be at a uniform temperature (case 1) or consisting of two protruding sinks maintained at a constant temperature (case 2). The results showed that the maximum heat transfer rate corresponding to Nusselt number (Nu¯=5.51) is achieved for Ra=106 on the hot wall for the horizontal cavity in case 1, illustrating the cavity with top cold uniform wall. Indeed, the heat transfer is improved by 80% by varying the Rayleigh number (Ra) from 103 to 106. Furthermore, for case 2 with a twin cold protruding, a quite complicated heat transfer behaviour is observed on the hot wall. For Ra>106, the horizontal cavity outperforms the other cavities in terms of heat transfer rate, however the horizontal position is the less performant for Ra<104. With a horizontal disposition and Ra=106, the heat exchange ratio is improved by 32.32% in case 2 compared to case 1. The outcomes of this study provide insights into design and implementation of natural convection cooling solutions for electronic devices, which can have significant practical implications in various industries.

Secondary vortex drag reduction and heat transfer enhancement of nanofluids in hierarchical microchannels applied to thermal management of electronic components

In order to improve the heat dissipation performance of electronic components, two hierarchical microchannel structures with curve and straight corners are proposed, and semi-circular and trapezoidal secondary flow structures are introduced into the structure with the best performance. The effects of coolant (Fe3O4-water nanofluid), layered structure and secondary flow structure on the comprehensive performance of MCHS were studied by numerical simulation. Results showed that deionized water is more suitable for the heat dissipation of microchannels at this scale. The hierarchical structure has the effect of enhancing heat transfer, and Nu can be increased by up to 67.32 %. The introduction of secondary flow structure has drag reduction effect in a certain Reynolds number range. The hierarchical MCHS with semi-circular secondary flow structure has drag reduction effect in the Reynolds number range of Re = 200–400, and the pressure drop can be reduced by up to 1.89 %. The hierarchical MCHS with trapezoidal secondary flow structure always has a drag reduction effect in the range of Reynolds number Re = 200–600, and the maximum pressure drop can be reduced by 2.46 %, showing excellent drag reduction ability. In addition, the introduction of trapezoidal secondary flow in MCHS increases the Nusselt number by 9.70 %, the comprehensive performance index reaches 1.10, and the cooling performance and comprehensive performance are optimal. The combination of hierarchical structure and secondary flow structure has excellent drag reduction and heat transfer enhancement effects, and has broad application prospects in the field of thermal management of electronic devices.

Construction of phase change n-Octadecane microencapsulated in carbon nanotubes-modified polymer for thermal management applications of finned heat sinks

The low thermal conductivity of organic shell-based phase change microcapsules severely limits their practical applications in thermal management of high-power-density electronic components. A novel microencapsulated phase change material (MPCM) was synthesized via suspension polymerization with n-Octadecane core shelled by aminated multiwalled carbon nanotubes-doped styrene–divinylbenzene copolymer (SDB/MWCNT-NH2). The chemical structure and micromorphology of the new microcapsules (MPCM/CNT) with various amounts of doped aminated multiwalled carbon nanotubes (MWCNT-NH2) were identified by the Fourier transform infrared spectroscopy and scanning electron microscopy. The thermal properties of various MPCM/CNT samples were analyzed based on the measurements of thermogravimetric analyzer, differential scanning calorimeter and thermal conductivity meter. The results indicated that the microcapsules with MWCNT-NH2 had good thermal stability, heat storage capacity and heat transfer properties. The thermal performance of the microcapsule samples in the low and medium temperature finned heat sink (FHS) was investigated and their thermal performance with that of bare FHS at four constant thermal loads of 5 W, 7 W, 10 W and 15 W was compared. The thermal performance was evaluated based on the time to setpoint temperature, heat dissipated and heat dissipation factors. Compared with the bare FHS, the FHS with the MPCM/CNT-2.5 sample (i.e., 2.5 wt% MWCNT-NH2) exhibited 17.70% longer operation time, 33.01% more heat dissipated, and 16.53% higher heat dissipation factor during heating at 10 W. This study aims to apply the phase change microcapsules modified with high thermal conductivity MWCNT-NH2 in medium and low temperature heat sinks to optimize the thermal management of high power density electronic components and improve the heat dissipation performance of heat sinks. The microcapsules with MWCNT-NH2 showed great potential for applications in thermal management of electronic components.

Investigation of finned heat sinks with PEG-6000/EG and PEG-6000/MWCNT composite phase change material for thermal management application

Present study reports the thermal performance of various cross finned heat sinks involving PEG-6000/EG and PEG-6000/MWCNT composites for thermal management applications. The performance of various heat sink configurations namely, heat sink with one cavity (HSOC), heat sink with four cavities (HSFC), heat sink with nine cavities (HSNC), and heat sink with sixteen cavities (HSSC) are analyzed for different heat flux values (q” = 1.7 kW/m2 to 2.4 kW/m2). Polyethylene glycol-6000 (PEG-6000) is considered as phase change material (PCM); while expanded graphite (EG) and multi-walled carbon nanotubes (MWCNT) with varied weight concentrations (0.5, 1.0 and 2.0 %) are used to prepare composite PCM (CPCM). The characterization has been made to access various thermophysical properties and thermal stability of CPCMs. The thermal performance of heat sinks involving CPCM is estimated by analyzing the enhancement ratio and the modified Stefan Number. A maximum enhancement of 55.80 % in thermal conductivity is achieved for CPCM involving PEG-6000 and 2.0 % MWCNT compared to only PEG-6000. The maximum value of enhancement ratio is found to be 1.37 and 1.18 for HSFC with with PEG-6000 and 2.0 wt% EG at q” = 1.7 kW/m2 and q” = 2.4 kW/m2, respectively. The minimum value of modified Stefan number (St) is found to be 8.25 and 11.65 at q” = 1.7 kW/m2 and q” = 2.4 kW/m2, respectively for PEG-6000 and 2.0 wt% EG. The findings suggest that the HSFC with PEG-6000 and 2.0 wt% EG CPCM has the potential to enhance the thermal performance of heat sinks and can be incorporated for efficient thermal management of electronic components.

Impact of innovative fin design on phase change material melting for thermal energy storage system

Among the main types of thermal energy storage, Latent Heat Storage System has the advantage of storing heat due to the small size temperature changes and the high stored energy. These benefits are attributed to the use of phase change material. However, the most fantastic drawback of phase change material is its low thermal conductivity. To further improve the weak thermal conductivity of phase change materials in these systems, it is imperative to look at different thermal enhancement techniques. This paper discusses two primary thermal improvement approaches for a rectangular thermal energy storage system: fins and a metal matrix. The rectangular enclosure is filled with n-eicosane and the bottom surface is subjected to constant heat flux. A comparison of different structures (conventional fin, Y-shaped fin, and honeycomb structure) with a reference configuration that contains only pure phase change material was discussed. The comparison between these structures is based on the charging time, which is one of the main objectives of this work. Outcomes reveal that adding a hexagonal Y-shaped fin and honeycomb structure can help improve the thermal performance of the latent heat thermal energy storage system and uniformize the temperature compared to the reference configuration. However, the effect of natural convection is not significant for the honeycomb structure but is crucial for the reference configuration. An optimization study was done to study the effect of varying the number of the hexagonal Y-shaped fin, PCM types, and heat flux. Results show that deploying four Y-shaped hexagonal fins is the best convincing argument in favor of improving the performance of the latent storage system. The RT44HC is the predominant coolant at lower heat fluxes, whereas the RT28HC was the best choice at higher heat fluxes. These results could be beneficial in applying phase change material to the thermal management of electronic components.

Polyethersulfone wick and metal wick based loop heat pipe for LED street light thermal management

The challenge of dissipating heat from light-emitting diode (LED) poses a limitation on LED's application. Loop heat pipe (LHP) is an efficient heat transfer device that is used in the thermal management of electronic components. Therefore, in this article, an LED with an LHP as the heat dissipation solution was designed and investigated for the replacement of halogen street lights without changing other accessories of the existing street lights. The prototypes with sintered nickel wick and polyethersulfone (PES) wick were studied at the tilt angle from 0° to 12° and the ambient temperatures from 16 °C to 50 °C. In addition, five prototypes were tested for 50 days to verify the stability of the PES wick. The solution could solute the heat dissipation problem of the LED in a limited space and inclination. From the results, the PES wick showed a better performance. When the power was 110 W and the angle was 12°, the temperature of the light source could be below 62 °C and the thermal resistance could be below 0.37 °C/W. The results demonstrate that the ability of the prototype with PES wick can well solute the heat dispassion problem of the LED.

Thermal management of electronic components based on hierarchical microchannels and nanofluids

In order to enhance the heat dissipation of electronic components, hierarchical microchannels and nanofluids were applied into the thermal management of electronic components in this paper. Two kinds of hierarchical microchannels (rectangular microchannels and circular microchannels) were considered, and three different channel equivalent diameters (microchannel-a, microchannel-b, microchannel-c) of microchannel were analyzed. In addition to above factors, influence of nanoparticle concentration on the pressure drop, cooling uniformity, thermal resistance, and heat transfer coefficient was studied. For rectangular microchannel, microchannel-a has the lowest cooling uniformity and microchannel-b has the highest heat transfer coefficient, but for circular microchannel, microchannel-b has the lowest cooling uniformity and microchannel-a has the highest heat transfer coefficient. The comprehensive performance index of the microchannel was also studied. It can be concluded that the rectangular microchannel has a lower comprehensive evaluation coefficient than the circular microchannel. The maximum PEC of rectangular microchannel is 1.08, and the circular microchannel can reach 1.26. However, the heat transfer capacity of the rectangular microchannel is stronger, and the thermal resistance is about 0.00005 smaller than that of the circular microchannel.

Geometrical effects of pins in a center cleared heat sink on thermal management of electronic systems

Thermal management of electronic components is becoming popular due to the extensive applications of electronic components in modern machines and automobiles. Natural convection heat transfer is preferred for electronic cooling in the unavailability of power supply or where high energy efficiency is desirable. Pin fin heat sinks offer effective cooling of such electronic devices even with the natural convection mode. Center-cleared pin-fin heat sinks offer better thermal management of a heated surface compared to conventional pin-fin heat sinks. The present work numerically investigates the thermal characteristics of center cleared solid cylinder, solid tapered, hollow tapered, and perforated hollow tapered pin fin heat sinks under natural convection. The numerical results are discussed in the form of steady state base temperature, heat transfer coefficient, mass-multiplied thermal resistance, volumetric heat dissipation rate, and effectiveness of different pin fin heat sink designs under varying power input from 2.15 to 10.75 W. The minimum mass-multiplied thermal resistance (RThM) is found to be 0.11 K.kg/W and the maximum volumetric heat dissipation rate is 1750.3 KW/m3 corresponding to the perforated hollow tapered pin fin heat sink design.

Heat transfer performance of a novel PCM based heat sink coupled with heat pipe: An experimental study

Thermal management is vital for all electronic applications due to the system’s considerable heat output. The improvement of the charging time for a continuous operation has been the subject of much research to date. However, for intermittent operations, which are most likely to be experienced in practical applications are considered, a reduction in the heat discharge time from the heat sink is equally as essential as an improvement in the charging time. The main aim of this study is to develop a strategy that enhances the charging cycle performance and performs well during the discharging cycle as well.This paper reports the experimental heat transfer results of a novel n-Eicosane phase change material (PCM) based finned heat sink coupled with a heat pipe for electronic thermal management. Heat transfer experiments are performed on four heat sink (HS) configurations: heat sink (i) without a fin, (ii) with a circular stem at the center, (iii) with three longitudinal plate fins having a central gap for heat pipe provision, and (iv) with four longitudinal plate fins. A circular heat sink having an outer diameter of 58 mm and 55 mm in height with a wall thickness of 4 mm is considered for all the heat sink configurations. The fill ratios considered are 33, 66, and 99%. The heat input given to the plate heater is varied between 8 and 12 W. Results show that the HS performs best at a PCM fill ratio of 99%. A sintered heat pipe is coupled with a three fin heat sink. Finned heat sink with heat pipe (FHSHP) enhances the (i) charging time by 21.1%, 15.41%, and 21.65%, (ii) discharging time by 22.5%, 23.25%, and 21.25% compared to a heat sink with three fins for the power level of 8, 10, and 12 W, respectively. Further, the overall effectiveness is high for the FHSHP compared to all the geometries considered in the present study. The novel design (FHSHP) is advantageous from an engineering standpoint for efficient thermal management of electronic components.

Thermal performance analysis of heat pipe using response surface methdologyUdayvir

Heat pipes are the specific class of heat exchangers. They are used in thermal management of electronic components. Research community is continuously working to obtain the optimum heat transfer performance. In present work, parametric study of heat pipe using nano- fluid has been carried out. The operating parameters of heat pipe like power supply, orientation (gravity assisted angle), filling- ratio, and nano-fluids concentration are being investigated to find the optimum thermal performance of heat pipe. Response surface method (RSM) is used to analyze the effect of operating parameters on thermal performance. The optimum value of thermal resistance and thermal efficiency are 0.3994 °C/Watt and 68.44% respectively. Most suitable power supply, inclination angle, filling ratio and nanofluid concentration are 185.85 W, 60.09°, 50.7% and 1.05 % respectively. The experimental results confirm and validate the RSM predicted results.

Topology optimization of a novel bionic fractal microchannel applied in thermal management of electronic components

AbstractReducing energy consumption and improving device efficiency are important ways to realize efficient heat dissipation of microdevices, this paper developed a new bionic fractal microchannel heat sink based on fractal theory and topological optimization ideas, which introduced a binary flow stagnation zone optimization based on topological optimization ideas on the basic fractal microchannel. The thermal and hydraulic properties of a nanofluid in a fractal microchannel heat sink (FMCHS) have been numerically simulated with the fractal dimensions (fd = 1, 1.5, and 2) and Reynolds number (Re = 200–1600) as variables, and the comprehensive performance has been analyzed. The results showed that the introduction of the optimization increases the central velocity of the microchannel by 7.14–18.2%. With fractal dimensions of 1.5 and 2, the flow improvement and velocity increase are significant, and a significant Nusselt number improvement is obtained. The best comprehensive performance is obtained for FMCHS with a fractal dimension of 1.5, with an optimization effect of 8.3%.