Abstract
In order to enhance the heat dissipation of electronic components, hierarchical microchannels and nanofluids were applied into the thermal management of electronic components in this paper. Two kinds of hierarchical microchannels (rectangular microchannels and circular microchannels) were considered, and three different channel equivalent diameters (microchannel-a, microchannel-b, microchannel-c) of microchannel were analyzed. In addition to above factors, influence of nanoparticle concentration on the pressure drop, cooling uniformity, thermal resistance, and heat transfer coefficient was studied. For rectangular microchannel, microchannel-a has the lowest cooling uniformity and microchannel-b has the highest heat transfer coefficient, but for circular microchannel, microchannel-b has the lowest cooling uniformity and microchannel-a has the highest heat transfer coefficient. The comprehensive performance index of the microchannel was also studied. It can be concluded that the rectangular microchannel has a lower comprehensive evaluation coefficient than the circular microchannel. The maximum PEC of rectangular microchannel is 1.08, and the circular microchannel can reach 1.26. However, the heat transfer capacity of the rectangular microchannel is stronger, and the thermal resistance is about 0.00005 smaller than that of the circular microchannel.
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