Optimizing heat transfer efficiency in electronic component cooling through fruit waste-derived phase change material

Abstract

This study focuses on the development and evaluation of heat sinks designed for the thermal management of electronic components operating under low-temperature conditions. Two distinct heat sink configurations were investigated: one featuring a hollow structure without fins and the other incorporating equidistant triangular fins. These heat sinks were subjected to varying heat input levels of 35 W, 40 W, and 45 W. To enhance thermal performance, various thermal enhancement techniques were employed, including the integration of phase change materials, graphene nanoparticles, and nanoparticles coated with dragon fruit extract. The results of this investigation revealed significant improvements in the heating-cooling cycle. It was observed that the heating effectiveness of the heat sink increased by 23 %, 11 %, and 6.8 %, respectively, when employing dragon fruit extract-coated nanoparticles in conjunction with phase change material. After increasing the heat input to 40 W, the heating and cooling cycle of the heat sink containing PCM and without fins was reduced by 18 %. Coating the nanoparticles with dragon fruit extract reduced the heating and cooling cycle time by 37 % compared to the heat sink without fins and PCM included. Further optimisation studies substantiated these findings, affirming the efficacy of the proposed approach. In summary, incorporating dragon fruit extract-coated graphene nanoparticles demonstrated a noteworthy enhancement in the heating-cooling cycle, proportionate to the applied heat input, within the context of finned heat sinks employed for electronic component thermal management.