The nickel-iron alloys have been widely used for versatile soft magnetic applications and electro-magnetic applications due to their magnetic properties for a long time. Also, it has been discovered that Ni-Fe alloy near 36 wt% Ni shows almost zero thermal expansion composition(CTE) in a wide temperature range (~150 ℃). The phenomenon showing low CTE in a specific composition is called the Invar effect. Due to the Invar effect, Invar alloys are used for temperature-sensitive applications such as oscillators and fiber-optic package parts. Invar alloy films are used for fine metal masks, an essential part of OLED fabrication. The invar film currently in use is fabricated using the pyrometallurgy method, more than 20um thick. However, miniaturization and high performance of the products require the thinner thickness of the Invar film, around 10um thick which shows the need for a bottom-up fabrication process of invar film. There are various methodologies to fabricate thin films, such as thermal evaporation, sputtering, CVD, and electrodeposition. Most fabricating processes are the vacuum process, a high-cost and non-continuous process. On the other hand, electrodeposition is a non-vacuum process, relatively low-cost, large-scale, and continuous process.Despite these advantages, there are some obstacles to gaining the Invar thin film by electrodeposition, such as anomalous deposition, composition uniformity, and higher CTE of electrodeposited Invar film. There are researches[1-3] about electrodeposited Ni-Fe thin films in the aspect of CTE, magnetic properties, crystal structures, etc. However, very few researchers have seen the effect of complexing agents other than specific complexing agents such as boric acid and ascorbic acid. In addition, Ni-Fe electrodeposition shows very different results depending on temperature and agitation, but no research confirms the effect on various complexing agents under the same condition.In this study, we synthesized Ni-Fe alloy thin film by electrodeposition in the presence of various complexing agents with different functional groups (amine, carboxyl, alcohol, etc.) such as glycolic acid, malonic acid, ethylenediamine, etc. on 20um stainless 304 foil substrates. The electrodeposition was conducted under the aqueous acidic bath(pH 2) at 55℃. Electrochemical studies were conducted to set appropriate potential and current density for electrodeposition. The thin film was characterized by SEM, EDS, XRD, and copper strip tests to observe the difference in composition, surface morphology, phase, and internal stress.