AbstractMechanical instability is often harnessed in mechanical metamaterials to generate a diverse range of functionalities, and can be triggered by either a mechanical or a field stimulus, such as temperature. Existing field‐responsive metamaterials with snap‐through instability, however, need to rely on a mechanical input to realize functional reversibility, a limitation depriving them of the capacity to operate solely via the applied field. This work demonstrates reversible snap‐through instability in a bi‐material framework that is exclusively driven by environmental temperature. The need for mechanical intervention is bypassed by leveraging the thermally induced contact and mismatched thermal expansion of the constituent materials. A combination of experiments, theory and simulations, unveils the physics underpinning the thermally driven snapping undergoing four successive regimes of deformation: noncontact, full contact, partial contact, and release. The advantages of the concept are showcased in two applications. The first is the development of thermal switches with ternary operation (OFF‐ON‐OFF) and logic functions, going beyond the capabilities of current binary switches. The second is reversible temporal morphing in deployable structures programmed to snap sequentially in multiple locked configurations at predefined values of temperature, opening the door to applications across sectors, such as deployable antennas, soft robots, and self‐reconfigurable medical devices.
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