This paper presents a passive temperature compensation technique that can provide full cancellation of the linear temperature coefficient of frequency (TCF1) in silicon resonators. A uniformly distributed matrix of silicon dioxide pillars is embedded inside the silicon substrate to form a homogenous composite silicon oxide platform (SilOx) with nearly perfect temperature-compensated stiffness moduli. This composite platform enables the implementation of temperature-stable microresonators operating in any desired in- and out-of-plane resonance modes. Full compensation of TCF <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">1</sub> is achieved for extensional and shear modes of SilOx resonators resulting in a quadratic temperature characteristic with an overall frequency drift as low as 83 ppm over the industrial temperature range ( -40°C to 80°C). Besides a 40 times reduction in temperature-induced frequency drift in this range, SilOx resonators exhibit improved temperature stability of Q compared with their single crystal silicon counterparts.