Copper oxides and internal stress have an obvious influence on adhesion strength of copper deposited polymer composites. However, the effect of the evolution behavior of copper oxides and internal stress on adhesion force of chip substrates is no clear and rare far. Herein, the copper deposited epoxy-phenolic/silica composite film with different desmear time was fabricated by using wet chemistry and electrochemistry methods. The chemical structure, surface roughness, morphology, surface chemical state, crystal structure and adhesion strength of copper and epoxy resin substrate were characterized by scanning electron microscope (SEM), interference microscope, X-ray photoelectron spectroscopy (XPS) and Fourier transform infrared spectroscopy (FTIR). The adhesion strength of samples is increased from 3 N/cm to 4.7 N/cm. The effect of the evolution behavior of copper oxides and internal stress on adhesion strength of copper deposited epoxy resin composite films at the interfaces was systematically investigated, the mechanisms and reason of increasing adhesion strength and interfacial adhesion failure for copper deposited epoxy resin composite substrates were revealed. This work will provide a guidance in theory and experiment to enhance interfacial adhesion force of epoxy resin composite films for advanced substrate in the future.
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