Electrodeposition Of Sn Research Articles

Spontaneous Motion of Oil Droplets on Au Electrode during Sn Electrodeposition: Factors Creating Imbalance of Interfacial Tension

It has been reported [1] that the interfacial energy at Au electrode surface in aqueous solution becomes larger when metals such as Sn, Pb, and Sb are electrodeposited. This was because the reaction intermediates of the electrodeposition, i.e., the active adatoms on the electrode surface, increased the interfacial energy, or the interfacial tension at electrode-electrolyte interface. It was also reported [1] that a droplet of oil, e.g., hexane and nitrobenzene, put on the Au electrode moved spontaneously during the electrodeposition. This motion was of interest from the viewpoint of energy conversion because the mechanical motion was driven by simple electrochemical reactions. The driving force inducing the droplet motion was an imbalance of the interfacial tension acting on the droplet, as illustrated in Figure 1a. The droplet spontaneously moved toward the area where the interfacial tension is relatively high, i.e., where the electrodeposition occurred relatively efficiently. The electrodeposition occurred less efficiently at the rear side because it was suppressed by adsorbed oil molecules remaining on the metal surface. This mechanism seems highly plausible. However, it cannot explain how the droplet starts to move. Then, in order to investigate other factors creating the imbalance, we studied the spontaneous motion of nitrobenzene droplets during the Sn electrodeposition (Sn2+ + 2e- → Sn) in H2SO4 solution containing SnSO4 [2]. Figures 1b and 1c show the experimental setup for observing the motion and the photo images of the moving droplet during the Sn electrodeposition, respectively. The study demonstrated that the imbalance was caused by the occurrence of a side reaction, namely, hydrogen evolution reaction (HER), near the rear side of nitrobenzene droplet. The rate of Sn electrodeposition decreased as that of HER increased, and therefore the interfacial tension became lower at the rear side than that at the front side where the Sn electrodeposition occurred efficiently without the occurrence of the HER. The HER occurred on the rear side probably because the surface of the Au electrode used was not uniform. In other words, the non-uniform surface could be one of the factors that create the interfacial tension imbalance. Recently, we found that the droplet put on an Au film started to move spontaneously without the occurrence of the HER at the rear side. The Au film was produced on a Si wafer by electroless plating, and thus it was more uniform than the surface of the Au electrode used in the previous study [2], namely, the Au surface polished with alumina powders. This clearly indicates that an interfacial tension imbalance was induced by other factors rather than the occurrence of the HER. In this presentation, the factors that create the imbalance will be reported and the mechanism of the droplet motion will be reconsidered. REFERENCES [1] S. Nakanishi, T. Nagai, D. Ihara, Y. Nakato, Chemphyschem, 9 (2008) 2302-2304. [2] Y. Mukouyama, T. Shiono, J. Electrochem. Soc., 163 (2016) H36-H41. FIGURE CAPTION Figure 1. (a) A schematic cross section of an oil droplet placed on an electrode. Spontaneous lateral motion of the droplet induced by an imbalance of electrode-electrolyte interfacial tension between the front and rear sides of the droplet. (b) Schematic of the experimental setup. A nitrobenzene droplet, the volume of which is about 1.0 mL, is put on an Au disc electrode in 0.5 M H2SO4 + 0.01M SnSO4. (c) Snapshots of a nitrobenzene droplet taken at -0.66 V vs.SHE. Figure 1

Determination of Trifluoperazine hydrochloride in pharmaceutical preparations using Spectrophotometric method

Ionic liquids with discrete anions are deep eutectic solvents can be utilized formetals electroplating. In this investigation various types of deep eutecticsolvents have been utilized such as Reline, Ethaline and Hybrid as solvents forthe electrodeposition of Sn, Zn and Zn-Sn alloys. Ethaline and Reline displayedidentical voltammetric profiles for the reduction of Zn+2 and Sn+2. Relinepossess high viscosity which lead to decreasing the quality of electroplating,therefore the process needs higher temperature or longer electroplating time.The surface morphology and compositions have been characterized usingscanning electron microscopy (SEM) and elemental analysis by energydispersive X-ray Spectroscopy (EDX). These techniques lead to detecting themetal alloy that have been added to the ionic liquids. Pure ionic liquidspreparation was another aim of this investigation, which utilized as a standardscale for comparison with the metal based liquids. Analysis of cyclicvoltammetry in all systems indicated differences in the reactivity and mobility ofspecies in solution which affected the growth mechanism and resulted inchanges in deposit morphology.

Electrochemically modified boron-doped diamond electrode with Pd and Pd-Sn nanoparticles for ethanol electrooxidation

The modification of hydrogen terminated boron-doped diamond (HBDD) electrode with pure palladium (Pd) and Pd-Sn (tin) nanoparticles is described in this study. For synthesis of Sn/HBDD and Pd-Sn/HBDD electrode, a potentiostatic two-step electrochemical method involving the electrodeposition of Sn followed by Pd was used, respectively. The modification of the HBDD electrode with Sn and noble metal Pd by forming bimetallic Pd-Sn nanoparticle leads to a higher electrocatalytic activity. The electrocatalytic activity of the bimetallic Pd-Sn nanoparticles was evaluated towards the electrooxidation of ethanol in alkaline media and compared with that of the Pd nanoparticles alone. The bimetallic Pd-Sn nanoparticles modified HBDD electrode exhibits higher current densities and less poisoning effects during ethanol electrooxidation compared to Pd/HBDD. The proper tuning of the Pd loading on a foreign metal along with the surface termination effects of the BDD electrode plays a crucial role in achieving a high mass (4.26×106mA/g) and specific (12.37mA/cm2) electrocatalytic activity of Pd towards ethanol electrooxidation. The aforementioned catalysts of this research possess a high poisoning resistance (If/Ib=1.63) and stability towards ethanol electrooxidation in alkaline media.

Tin, Bismuth, and Tin-Bismuth Alloy Electrodeposition from Chlorometalate Salts in Deep Eutectic Solvents.

The electrodeposition of tin, bismuth, and tin–bismuth alloys from SnII and BiIII chlorometalate salts in the choline chloride/ethylene glycol (1:2 molar ratio) deep eutectic solvent was studied on glassy carbon and gold by cyclic voltammetry, rotating disc voltammetry, and chronoamperometry. The SnII‐containing electrolyte showed one voltammetric redox process corresponding to SnII/Sn0. The diffusion coefficient of [SnCl3]−, detected as the dominating species by Raman spectroscopy, was determined from Levich and Cottrell analyses. The BiIII‐containing electrolyte showed two voltammetric reduction processes, both attributed to BiIII/Bi0. Dimensionless current/time transients revealed that the electrodeposition of both Sn and Bi on glassy carbon proceeded by 3D‐progressive nucleation at a low overpotential and changed to instantaneous at higher overpotentials. The nucleation rate of Bi on glassy carbon was considerably smaller than that of Sn. Elemental Sn and Bi were electrodeposited on Au‐coated glass slides from their respective salt solutions, as were Sn–Bi alloys from a 2:1 SnII/BiIII solution. The biphasic Sn–Bi alloys changed from a Bi‐rich composition to a Sn‐rich composition by making the deposition potential more negative.

Ionic Liquids Electrodeposition of Sn with Different Structures as Anodes for Lithium-Ion Batteries

Electrodeposition of tin (Sn) on a Ni electrode has been investigated in three ionic liquids, i.e., 1-ethyl-3-methylimidazolium tetrafluoroborate ([EMIm]BF4), 1-ethyl-3-methylimidazolium trifluoromethylsulfonate ([EMIm]TfO) and 1-ethyl-3-methylimidazolium dicyanamide ([EMIm]DCA). Sn(II) ion was introduced into the ionic liquids by dissolving SnCl2. The different redox potentials of the Sn(II)/Sn couple imply that different Sn(II) species were formed in these solvents. Voltammetric studies reveal that the reduction of Sn(II) in these systems involves a diffusion-controlled irreversible process. The microstructure of the Sn electrodeposits can be significantly influenced by altering the anion of the ionic liquids and the electrodeposition potential. The electrochemical performances of the as-prepared Sn electrodeposits as anodes for lithium-ion batteries were studied. The Sn electrode electrodeposited in [EMIm]DCA ionic liquid shows a high discharge/charge capacity of 515 and 502 mAh g−1 after 50 cycles at 0.1 A g−1. The cycling performance is evidently better than those of the Sn electrodes obtained in [EMIm]BF4 and [EMIm]TfO ionic liquids.

Effects of the degradation of methane sulfonic acid electrolyte on the collapse failure of Sn–Ag alloy solders for flip-chip interconnections

The degradation mechanism of the methanesulfonic acid based electroplating bath used for the electrodeposition of Sn–Ag alloy solder bumps and its effects on the collapse failure of flip-chip solder bumps.

Spontaneous Motion of Oil Droplets on Au Electrode during Sn Electrodeposition in Nitric Acid Solutions

It has been reported [1] that the interfacial energy at Au electrode surface in aqueous solutions becomes larger during the electrodeposition of metals such as Sn, Pb, and Sb than that in the absence of the electrodeposition. This was because the reaction intermediates of the electrodeposition, i.e., the active adatoms on the electrode surface, increased the interfacial energy, or the interfacial tension at electrode-electrolyte interface. The previous work also reported [1] that droplets of oil, e.g., hexane and nitrobenzene, put on Au electrodes moved spontaneously during the electrodeposition when the interfacial tension at the front side of the droplets was higher than that at the rear side (Figure 1a). Furthermore, it mentioned [1] that the velocity of the motion increased with the negative shift in the electrode potential. The motion was interesting from the viewpoint of energy conversion because the mechanical motion was driven by simple electrochemical reactions. However, the mechanism of the motion was not fully elucidated because the previous work was not focused on studying the difference in the interfacial tension between the front and rear sides of the droplets. Then, in order to clarify the factors that caused the interfacial tension difference, we studied the spontaneous lateral motion of nitrobenzene droplets during the Sn electrodeposition (Sn2+ + 2e- → Sn) in H2SO4 + SnSO4 solutions [2]. The main factor was found to be the occurrence of a side reaction, i.e., hydrogen evolution reaction (HER), near the rear side of the nitrobenzene droplets. The rate of Sn electrodeposition decreased as that of HER increased, and therefore the interfacial tension became lower at the rear side than that at the front side where the Sn electrodeposition occurred efficiently without the occurrence of the HER. Recently, we have studied if the spontaneous lateral motion occurs when the Sn electrodeposition is performed in HNO3 + SnSO4 solutions. Figure 1b shows the experimental setup for observing the motion. In the nitric acid solutions, a nitrobenzene droplet started to move immediately after the electrode potential was set at the potential at which the Sn electrodeposition took place, e.g., -0.66 V vs. SHE (Figure 1c), though both the Sn electrodeposition and the HER were less favorable than in the sulfuric acid solutions. Therefore, it was possible that the interfacial tension difference was induced by other factor rather than the occurrence of the HER; hence the reduction reaction of nitrate ions occurring at Sn atoms deposited on Au surface probably played a major role in the factor. In this presentation, the droplet motion in the nitric acid solutions will be reported and discussed. REFERENCES [1] S. Nakanishi, T. Nagai, D. Ihara, Y. Nakato, Chemphyschem, 9 (2008) 2302-2304. [2] Y. Mukouyama, T. Shiono, J. Electrochem. Soc., 163 (2016) H36-H41. FIGURE CAPTION Figure 1. (a) A schematic cross section of an oil droplet placed on an electrode. Spontaneous lateral motion of the droplet induced by an imbalance of electrode-electrolyte interfacial tension between the front and rear sides of the droplet. (b) Schematic of the experimental setup. A nitrobenzene droplet, the volume of which is about 1.0 mL, is put on an Au disc electrode in 1.1 M HNO3 + 0.01M SnSO4. (c) Snapshots of a nitrobenzene droplet taken at -0.66 V vs. SHE. Figure 1

Electrodeposition of nanostructured Sn–Zn coatings

The electrodeposition of Sn-Zn coating at ambient temperature was investigated. The bath consists of metal salts SnCl2·2H2O and ZnSO4·7H2O and sodium citrate (NaC6H5Na3O7·2H2O) as complexing agent. To prevent precipitation, the pH is fixed at 5. Reducing tin and zinc through Sncit2− and ZnHcit− complex respectively is confirmed by the presence of two cathodic peaks on the voltammogram. The kinetic of tin (II) reduction process is limited by the SnCit2− dissociation. The SEM and TEM observations have showed that the coating consists of a uniform Sn–Zn layer composed of fine grains on which tin aggregates grow up. XRD revealed peaks corresponding to the hexagonal Zn phase and the tetragonal β-Sn phase.

Electrochemical preparation of tin–titania nanocomposite arrays

The first successful electrodeposition of Sn inside self-organized anodic titania nanotubes.

Spontaneous Motion of a Nitrobenzene Droplet on Au Electrode during Sn Electrodeposition

The spontaneous motion of a nitrobenzene droplet on an Au electrode during an Sn electrodeposition has been reported in a previous paper (Chemphyschem, 9, 2302 (2008)). It also mentions that the velocity of the motion increases with a negative shift in the electrode potential. This present work has studied the motive force inducing the droplet motion, which is the imbalance between interfacial tension acting on the opposite side of a nitrobenzene droplet. As explained in the previous study, a high interfacial tension on the front side of the droplet is caused by an occurrence of electrodeposition. From this study, a low interfacial tension on the rear side has been found to attribute to an occurrence of hydrogen evolution reaction on the electrode surface. The rate of hydrogen evolution reaction increases as the electrode potential decreases, and thus the increase in the droplet velocity with a decreasing potential can be ascribed to the increase in the rate of hydrogen evolution reaction. The present work also reports that the velocity also increases by the addition of a salt such as K2SO4 to the solutions.

The Growth of Hierarchal Shape Tin Used As Catalysts Support Towards a Binder Free Fuel Cell Anodes

A novel catalyst support utilizing electrodeposited tin was investigated for direct liquid fuel cells. These materials were prepared by electrodeposition of tetragonal metallic Sn on Toray® carbon paper or gold electrodes under non-equilibrium conditions. Hierarchical shape branched dendrites of Sn were formed under selected experimental conditions (fig 1). The growth process on these electrodes were rigorously investigated using potentiostatic or galvanostatic steps, in aqueous solutions containing sodium citrate, SDS, HTAB. Hydrogen evolution and mass balance calculations suggest that the columbic efficiency of Sn2+reduction is controlled by diffusion of the surfactant solvated ions. Various morphologies of metallic Sn can be prepared by controlling the applied potential, duty cycle and the HCl additive. Hierarchal morphologies of Sn start to appear at an over potentials of more than 0.9V and is strongly influenced by hydrogen evolution competing reaction. Characterization of the deposition the deposition and etching, passivation and activation processes were performed by EQCM. These results show that H2SO4 and HClO4, which were applied in the activation of SnO2 layer, prior to applying the catalyst, behave differently with the deposited metal. HClO4seems to prevent further acting of the oxide layer and provide the required functionality for metal deposition as well as good passivation required stable operation as anodes. Pt, PtSn and Ni catalysts were loaded on electrodeposited Sn supported on Toray® carbon paper by electroless or by electroplating processes. These binder free anodes were measured in methanol, methyl- formate acid solutions, and nickel-plated was applied in urea oxidation in alkaline solutions. Superior oxidation specific activity was observed on all Sn supported anodes with respect to Pt or Ni catalysts loaded on carbon XC72. Figure 1. HRSEM of electrodeposited Sn in a “tree” like shape Figure 1

Structure and properties of SnS thin layers obtained by sulfurization of electrodeposited tin precursors

Since current research trends in photovoltaics include among others low toxic and earth-abundant materials, tin sulfide (SnS) has high potential in device fabrication. We propose new inexpensive and well controllable method for manufacturing of tin sulfide layers by Sn electrodeposition and subsequent sulfurization in sulfur vapor in reusable reactor. Tin sulfide films crystallized in Herzenbergite orthorhombic structure β-SnS were obtained at sulfurization temperature 330°C. These films with thickness about 1–2μm are characterized by direct optical transitions, have high optical absorption coefficients and direct band gap 1.3eV, so, they are promising for large-scale production of inexpensive and affordable solar cells.By a simple reducing the thickness of the Sn film precursors we can produce by this method desirable for the nanophotovoltaics very thin tin sulfide layers up to attached to the substrates SnS quantum dots with high visible optical absorption coefficients, which band structure can be modified and blue shifted to higher energy by the quantum confinement.

Self-Propelled Motion of Oil Droplets on Au Electrode during Sn Electrodeposition

It has been reported that self-propelled motion of oil droplets on Au electrode occurs during Sn electrodeposition and also that the velocity of the motion increases with a negative shift in the electrode potential (Chemphyschem, 9, 2302 (2008)). We, then, have studied the origin of the imbalance between interfacial tension acting on opposite sides of the droplet causing the motion. A high interfacial tension on the front side of the droplet is caused by an occurrence of electrodeposition as reported before, whereas a low interfacial tension on the rear side is attributed to an occurrence of hydrogen evolution reaction on the electrode surface. The velocity increase is due to the increase in the rate of hydrogen evolution reaction. We have also found another factor affecting the velocity; the velocity increases as the density of aqueous solution increases.

Cu2ZnSnS4 absorption layers with controlled phase purity.

We report the synthesis and characterization of Cu2ZnSnS4 (CZTS) with controlled phase purity. The precursor was first prepared using sequential electrodeposition of Cu, Zn, and Sn in different orders. The Cu/(Sn+Zn) ratio in each stacking order was also varied. The precursor was subjected to annealing at 200°C and sulfurization at 500°C in a 5%-H2S/Ar atmosphere for the formation of CZTS. The phase evolutions during the electrodeposition and annealing stages, and the final phase formation at the sulfurization stage were examined using both x-ray diffractometry and Raman spectroscopy, both of which are shown to be complimentary tools for phase identification. Detailed growth path is therefore reported. We also demonstrate by controlling the stacking order and the Cu/(Sn+Zn) ratio, CZTS with a phase purity as high as 93% is obtained.

Tunable electrodeposition of Sn and Sn-based alloys using ionic liquids

The electrochemical behavior of Sn(II) was studied at 25 °C in three different room temperature ionic liquids (1-ethyl-3-methylimidazolium dicyanamide (EMI-DCA), 1-butyl-1-methylpyrrolidium bis-(trifluoromethanesulfonyl)imide (BMP-NTf2), 1-ethyl-3-methylimidazolium bis-(trifluoromethanesulfonyl)imide (EMI-NTf2)). The Sn(II) was introduced into EMI-NTf2 by anodic dissolution with a current efficiency of almost 100 %. The diffusion coefficient of Sn(II) was compared in three ionic liquids at different temperatures. In addition, the morphology of Sn deposits on the inert substrate Mo obtained from three ionic liquids at 25 °C was characterized. This study also shows that the copper–tin alloy could be achieved in EMI-NTf2 by the electrodeposition method and subsequent thermal treatment.

Electrodeposition of Ge, Sn and GexSn1-x from two different room temperature ionic liquids

In this paper, we present a simple and viable route for the synthesis of germanium-tin alloys (GexSn1-x) from two different ionic liquids, namely, 1-butyl-1-methylpyrrolidinium trifluoromethylsulfonate ([Py1,4]TfO) and 1-butyl-1-methylpyrrolidinium bis(trifluoromethylsulfonyl)amide ([Py1,4]Tf2N). Cyclic voltammetric analysis showed that in the presence of both SnCl2 and GeCl4 precursors, a shoulder peak is obtained which is related to the formation of GexSn1-x. Constant potential deposition was performed to obtain GexSn1-x thin films. Furthermore, on changing the concentration of GeCl4 and SnCl2 in [Py1,4]TfO, the GexSn1-x composition could be varied.

Effect of Current Density on the Nucleation and Growth of Crystal Facets during Pulse Electrodeposition of Sn–Cu Lead-Free Solder

The present study highlights the changes in morphology in a Sn matrix during pulsed electrodeposition of a Sn–Cu near-eutectic alloy with varying current density in an acidic electrolyte. 3D image construction has been employed using SHAPE V7.3; Shape Software: Kingsport, Tennessee, USA to replicate the shape of grown crystals and analyze the results. It is observed that the growth morphology changes with the introduction of high index planes at higher current densities. Furthermore, a growth pattern occurs with high index planes formed from a stepped structure in low index planes. There has been a change in growth direction from ⟨001⟩ to ⟨110⟩ at higher current densities. At very high current densities, sympathetic or secondary nucleation is observed.

Self-Propelled Motion of Oil Droplets on Au Electrode during Sn Electrodeposition

INTRODUCTIONIt was reported that macroscopic contact angles of an oil droplet put on an electrode surface decreased during electrodeposition of metals, such as Sn, Pb and Sb [1]. It was also reported that the difference in the contact angle between the front and rear sides of the droplet caused self-propelled lateral motion of the droplet [1]. This motion has attracted much interest from the viewpoint of the emergence of mechanical motion induced by chemical or electrochemical reactions.Little has been reported about the factors affecting the velocity of the motion. It has only been reported that the velocity increases with a negative shift in the electrode potential [1]. In this work, we studied the factors affecting the velocity and the mechanism of the motion.EXPERIMENTALThe self-propelled motion of a nitrobenzene droplet on an Au ring electrode was observed during Sn electrodeposition (Sn2+ + 2e- → Sn) in H2SO4 + 0.01 M SnSO4. The volume of the droplet was about 1.0 μL. Figure 1 shows schematic of the experimental setup. In order to study the dependence of the velocity on the density of the aqueous electrolyte, K2SO4was added to the electrolyte to increase the density.RESULTS and DISCUSSIONWe studied the dependence of the velocity on the electrode potential when the concentration of H2SO4was 0.5 M. As shown in Figure 2, the droplet did not move, i.e., the velocity was zero, in the potential region above ca. -0.44 V, though the Sn electrodeposition occurred. On the other hand, the droplet moved in the potential region below ca. -0.44 V where both the Sn electrodeposition and hydrogen evolution reaction (HER) occurred. The velocity increased with a negative shift in the electrode potential.In the potential region where the droplet moved, the Sn electrodeposition was limited by the mass-transport of Sn2+ions to the electrode surface, and hence the rate of electrodeposition was constant independently of the potential. We, therefore, think the velocity increase with a negative shift in the potential is probably attributed to the increase in the rate of the HER. Based on this idea, we suggest that the droplet motion is driven by the interaction between the Sn electrodeposition and the HER.We also studied the dependence of the velocity on the density of the aqueous electrolyte. As shown in Figure 3, the velocity observed at -0.66 V vs. SHE increased as the concentration of K2SO4increased. That is, the velocity increased as the density increased. The buoyancy of the droplet increased with the increasing density, which probably led to the increase in the velocity.This work is partially supported by the Research Institute for Science and Technology of Tokyo Denki University under Grants Q12E-02.REFERENCES [1] S. Nakanishi, T. Nagai, D. Ihara, Y. Nakato, Chemphyschem, 9 (2008) 2302-2304.

Application of the combined electrochemical quartz crystal microbalance and probe beam deflection technique in deep eutectic solvents

The electrochemical quartz crystal microbalance (EQCM) and probe beam deflection (PBD) have been widely used to study interfacial processes in molecular solvent-based electrolytes. However, there has been limited use of the EQCM and none of PBD in room temperature ionic liquids, including deep eutectic solvents (DES). Here we explore the use of the combined EQCM/PBD technique to the study of Ag and Sn electrodeposition from a DES comprising a 1:2 mixture of choline chloride and ethylene glycol. While overcoming the effect of viscous loss in the acoustic wave (EQCM) part of the experiment is understood, the optical (PBD) technique fails to provide a meaningful response in slow scan rate voltammetric experiments; this contrasts sharply with the straightforward behaviour seen in aqueous media. Solution transport considerations reveal this to be a consequence of long surface-to-beam transit times in the viscous DES. The problem can be overcome by operating at scan rates 1-2 orders of magnitude slower, permitting application of this powerful technique to novel media of technological interest. The PBD responses reveal unanticipated chemical effects: multiple complexes in the Ag system and solubility limitations in the Sn system, neither of which is evident from the electrochemical or QCM responses.

Electrochemical Properties of Electrodeposited Sn Anodes for Na-Ion Batteries

Introduction Over the past few decades, Li-ion batteries (LIBs) have been widely used as power sources for mobile electronic products and power tools, and nowadays a much effort has been focused on the use of these batteries in large-scale applications such as electric vehicles, hybrid electric vehicles and electrical energy storage (EES) devices. However, because the amount of the Li resources would not be sufficient to meet industrial needs in the long term, the expansion of the LIBs market takes concern on the sustainable supply of Li and the raising of the Li prices. Accordingly, in recent years, rechargeable Na-ion batteries (SIBs) have received great attention as a possible alternative to replace LIBs. Owing to the abundant resource, low cost and a relatively low redox potential (0.3 V above that of Li/Li+), NIBs are expected to be a near-term alternative for large-scale systems such as grid storages [1].Despite the high specific capacity, pure Na metal is inappropriate as an anode material for practical applications of NIBs because the dendiritc deposition of sodium during charging can cause the severe safety problems as well as the reduced capacity and increasing electrode impedance. To overcome these problems, the research for finding suitable electrode materials which have high specific capacity, low irreversible loss, high coulombic efficiency and long cycle life for SIBs have been extensively conducted. Among the various candidate materials, Sn is one of the most attractive anode materials because of its high theoretical capacity and low reaction potential. When assuming complete sodiation of Sn into Na15Sn4, the capacity of Sn is approximately 847 mAh g-1[1], which is substantially higher than the reversible capacity of carbonaceous materials (approximately 250 mAh g-1) [2]. In this study, the electrochemical performance and the sodiation/desodiation mechanisms of electrodeposited Sn were investigated based on previous studies. Herein, two Sn electrodes that have completely different morphologies and crystal structures were prepared by electrodeposition, and their electrochemical properties for Na-ion battery applications were examined, with an emphasis on the effects of the morphology and the phase structure of Sn on the cyclability of the electrodes. Experimental. Two different Sn electrodes were prepared by electrodeposition from different electrolytes. The electrodeposition of Sn was performed in a two-electrode cell that consists of a smooth Cu sheet as the cathode and a Sn plate as the anode. A constant current density of -10 mAcm-2 was applied for 4 min at room temperature. The electrochemical properties of the Sn electrodes were investigated using Swagelok-type cells assembled in an Ar-filled glove box. The cell is composed of a sheet of the Sn electrode (with an area of 1 cm2) and a Na metal film (with an area of 1 cm2) without using a separator. The electrolyte was anhydrous propylene carbonate (PC) containing 1 M NaClO4 and 0.5 vol.% fluoroethylene carbonate (FEC). The charge/discharge characteristics of the electrode were galvanostatically examined at a current density of 50 mA g-1 between 0.001 and 0.65 V (vs. Na/Na+). Results and discussion. Two Sn electrodes that have completely different morphologies and crystal structures were successfully prepared by electrodeposition. One consists of coarse and isolated particles, but the other exhibits a compact thin layer composed of fine grains. Both electrodes showed excellent reversibility via three conjugated sodiation/desodiation reactions. Nevertheless, the particle-type Sn electrode had the poor cycle performance due to the electrical isolation of the active materials. In contrast, the layer-type Sn electrode showed a stable cycle performance in which the charge capacity was maintained at 607.51 mAh g-1after 40 cycles, which corresponds to 98.21% of its initial charge capacity. The difference in the cyclability of the electrodes was attributed to the morphology of the Sn electrodeposits and to the bond between Sn and the Cu substrate.