Electrodeposition Of Sn Research Articles

Effect of the pH and electrodeposition frequency on magnetic properties of binary Co1−xSnx nanowire arrays

Abstract

Tin–zinc alloy electrodeposition from aqueous citrate baths

The process of tin–zinc alloy electrodeposition from aqueous citrate electrolytes was studied. The influence of applied potential, current density, hydrodynamic conditions, electrolyte composition and charge transfer on the electrodeposition of Sn–Zn alloy was determined. Depending on these parameters, coatings with different compositions and appearances can be obtained. The surface composition of deposits was ascertained by chemical analysis (WDXRF). The morphology of coatings was studied by SEM. The electrodeposition of bright, shiny Sn–Zn coatings on steel is possible from the citrate baths studied. The presence of zinc ions in the electrolyte results in a significant inhibition of tin reduction rate, which enables the electrodeposition of tin–zinc alloy layers containing from about 0.5 to 75wt.% of Zn, with high current efficiency, within the range from 80% to almost 100%. Two phases are formed in deposits: a hexagonal zinc phase and a tetragonal β-tin phase.

Electrodeposition of Sn and NiSn alloys coatings using choline chloride based ionic liquids—Evaluation of corrosion behavior

Abstract The present paper presents several experimental results regarding the electrodeposition and corrosion behavior of Sn and NiSn alloy coatings from some choline chloride based ionic liquids, applied onto various metallic substrates including Cu and steel. There are discussed electrolytes containing Sn and Ni salts in choline chloride–ethylene glycol and choline chloride–malonic acid eutectic mixtures. The obtained Sn and Ni–Sn alloy deposits are adherent and uniform onto metallic substrates The Ni–Sn alloys contained about 62–72 wt% Sn according to EDX analysis, with a very slight variation against the applied current density domain. According to XRD investigations both electrochemical coatings showed a nanocrystalline structure, with average sizes of the crystallites between 50 and 80 nm for Sn and around 11–14.5 nm for NiSn alloy. To evaluate corrosion resistance of Sn and Ni–Sn alloy coatings, potentiodynamic polarization curves and electrochemical impedance spectra (at open circuit potential) in 0.5 M NaCl solution have been recorded after different immersion times of coated specimens. Different corrosion performances are discussed taking into account the used electrodeposition procedures.

Electrodeposition of some metals and their alloys using different deep eutectic solvents based on choline chloride

Ionic liquids with discrete anions are deep eutectic solvents can be utilized for metals electroplating. In this investigation various types of deep eutectic solvents have been utilized such as Reline, Ethaline and Hybrid as solvents for the electrodeposition of Sn, Zn and Zn-Sn alloys. Ethaline and Reline displayed identical voltammetric profiles for the reduction of Zn+2 and Sn+2. Reline possess high viscosity which lead to decreasing the quality of electroplating, therefore the process needs higher temperature or longer electroplating time. The surface morphology and compositions have been characterized using scanning electron microscopy (SEM) and elemental analysis by energy dispersive X-ray Spectroscopy (EDX). These techniques lead to detecting the metal alloy that have been added to the ionic liquids. Pure ionic liquids preparation was another aim of this investigation, which utilized as a standard scale for comparison with the metal based liquids. Analysis of cyclic voltammetry in all systems indicated differences in the reactivity and mobility of species in solution which affected the growth mechanism and resulted in changes in deposit morphology. Keywords

Effects of hydroquinone and gelatin on the electrodeposition of Sn–Bi low temperature Pb-free solder

The effects of an antioxidant, hydroquinone (HQ) and a grain refining additive, gelatin, on the electroplating characteristics of Sn–Bi alloys were investigated. Methane sulfonic acid (MSA) based plating baths with varying contents of additives were prepared and the electrochemical behavior of each bath was investigated. The combination of HQ and gelatin successfully reduces the deposition potential gap between the elements hence facilitates the co-deposition of Sn–Bi in this plating bath. Compact, adherent deposits could be obtained through the synergistic effects of these two additives. The electroplated Sn–Bi deposits showed a decrease in Bi content with increasing current density. Near eutectic Sn–60.75wt.% Bi alloy was successfully deposited from the bath containing both HQ and gelatin at a current density of 18mAcm−2.

Electrodeposition of Sn–Zn and Sn–Zn–Mo layers from citrate solutions

The kinetics of separate reduction and co-reduction of Zn(II), Sn(II) and Mo(VI) from citrate baths were studied. Cyclic voltammetry experiments and galvanostatic deposition in coulostatic conditions were carried out to determine the optimal conditions for electrodeposition of Sn–Zn–Mo layers. The electrodeposits were characterised by chemical analysis (EDS and WDXRF) and profile chemical analysis (GDOES). The optimal conditions for electrodeposition from the citrate baths studied are in the slightly acid range (about pH 5). It was found that the high concentration of sodium molybdate and the addition of sodium sulphite to the electrolyte are essential to electrodeposit zinc–tin alloy with the addition of molybdenum. The results of voltammetric studies and chemical profile analysis indicate some connections between electrodeposition of Zn and Mo.

Two-Dimensionally Patterned Electrodeposition of Sn Film from Aqueous Acid Bath

The electrodeposition of two-dimensional Sn micropatterns without whisker growth was investigated using an aqueous acid bath. Polyethylene glycol suppressed the growth of Sn normal to the surface of a Cu foil substrate and flat Sn micropatterns were successfully obtained on various different photoresist-patterned Cu foils. The current efficiency of Sn electrodeposition was higher than 97% for all samples, although the pH of the solution was about 0.0, indicating that the overpotential of H2 evolution on the Sn/Cu substrate was quite large. Sn micropatterns, in the form of both lines and circles, showed a slight macroscopic stress relaxation effect. In the present work, we demonstrate the electrodeposition of two- dimensional Sn micropatterns on Cu foils from an aqueous acid bath utilizing a photolithographic technique. The effect of polyethylene glycol on the surface morphology of Sn and the potential change during electrodeposition were also investigated. This work provides general guidelines for the patterned electrodeposition of other types of metals or alloys. Furthermore, we evaluated the stress relaxation effect during lithiation and delithiation using two-dimensional Sn micropatterns as a reference. expose a single side with an area of 20 mm × 20 mm. The masked Cu foils were used as the working electrodes and a carbon substrate was used as the counter electrode. The distance between the working and counter electrodes was set at 10 mm. A saturated calomel electrode (SCE) was used as the reference electrode. The measured poten- tials were converted to values versus the standard hydrogen electrode (SHE) using the following relationship: ESCE= +0.244 V vs. SHE. Sn plating on the Cu surface was conducted at 10 mA cm −2 (effective surfacearea)withapotentiostat/galvanostat(HokutoDenkoCo.,Ltd., Japan, HZ-3000) at room temperature with stirring at 100 rpm. The Sn morphology was observed using afield emission scanning electron microscope (FE-SEM: Hitachi Ltd., S-4300). Charge-discharge tests were conducted at 90 μ Ac m −2 (effec- tive surface area) and room temperature with a charge-discharge unit (Hokuto Denko Co., Ltd., Japan, HJ-1001 SD8) to study the effect of macroscopic stress relaxation of Sn micropatterns during lithia- tion and delithiation. The cutoff potentials were 0.001 V and 2 V vs. Li/Li + . A coin cell was constructed in an Ar atmosphere glove box (M. Braun Inertgas-Systeme GmbH, Germany, MB150-B). Sn- deposited Cu foils and Li metal were used as the positive and negative electrodes, respectively, and 1 M LiPF6 solution of ethylene carbonate and dimethyl carbonate (1:2, v/v) was used as the electrolyte.

Zn–Sn electrodeposition from deep eutectic solvents containing EDTA, HEDTA, and Idranal VII

The use of deep eutectic solvents for metal electrodeposition has become an area of interest in the recent years. In this study, ethaline, propeline, and reline were used as solvents for the electrodeposition of Sn–Zn alloys. Ethaline, propeline, and reline displayed identical voltammetric profiles for the reduction of Zn(II) and Sn(II). Further studies were carried out in ethaline which is the liquid with lowest viscosity. To improve physical and morphological properties of the Sn–Zn deposits, additives were added to the ionic liquid solution. In this study, the addition of three chelators (EDTA, HEDTA, and Idranal VII) and their effects on the voltammetric behavior of zinc and tin and the resultant morphology was described. The structure and composition of the Zn–Sn deposit was largely affected by the additives with the largest effect being obtained in the presence of Idranal VII.

Electrodeposition of Sn and Au–Sn alloys from a single non-cyanide electrolyte

In this paper, it is demonstrated that Sn and Au–Sn alloys can be electrodeposited from a single non-cyanide electrolyte. This electrolyte consists of KAuCl4 · xH2O, SnCl2 · 2H2O, sodium sulfite (Na2SO3), tri-ammonium citrate and Triton X-100. The Sn is electrodeposited at a current density of 4 mA/cm2 or higher, while the Au-rich intermetallic (Au5Sn) is electrodeposited at lower current densities (0.8–1.5 mA/cm2). Microstructural analysis shows that the deposits are uniform and smooth. If the deposits are plated at current densities from 2 to 4 mA/cm2, which corresponds to a composition range of 30–80 at% Sn, multiple phases co-exist in the deposits.

Electrodeposition of Sn–Ag–Cu ternary alloy from HEDTA electrolytes

The electrodeposition of Sn–Ag–Cu ternary alloy from HEDTA electrolytes has been investigated. Based on LSV analysis on a rotating Pt-RDE, HEDTA was found to substantially shift the onset deposition potential of Sn, Ag and Cu ions to negative values and bring the LSV curves of the individual metals close together. A near-eutectic composition of Sn–Ag–Cu ternary alloy has been successfully achieved by HEDTA and simultaneously combining a small amount of thiourea as an auxiliary complexing agent. X-ray diffraction (XRD) confirmed that Sn, Cu6Sn5 and Ag3Sn phases were present in the deposit of Sn–Ag–Cu ternary alloy. Alkylpolyglucoside (APG) was found to be a suitable additive for the electrodeposition of Sn–Ag–Cu alloy. SEM image shows that the addition of alkylpolyglucoside produces a smooth, fine-grained and compact Sn–Ag–Cu deposit.

3D tin anodes prepared by electrodeposition on a virus scaffold

A patterned core–shell tin (Sn) nanorod anode is fabricated by pulse electrodeposition of Sn onto a self-assembled Tobacco Mosaic Virus (TMV) structured nickel current collector. Pulse electrodeposition onto the virus assembled 3D electrode surfaces produces homogenous Sn coatings with significant void space to accommodate the large volume change associated with Sn lithiation. The TMV enabled 3D Sn anodes shows high capacity retention of 560 mAh g−1 after 100 cycles with the average capacity fading rate of 0.4% per cycle. The high electronic conductivity of Sn, short diffusion length for Li-ions, and large interface between Sn nano-rods and electrolyte greatly enhance the rate performance of the TMV enabled Sn anodes.

Electrodeposition of Sn In and Cu from Citrate Electrolytes

not Available.

Electrochemical performances of Sn anode electrodeposited on porous Cu foam for Li-ion batteries

A three-dimensional Sn electrode is fabricated by the electrodeposition of Sn on a porous Cu foam substrate that consists of grape-like Cu nanodeposits. It is revealed from the XRD results that a small amount of Cu6Sn5 is formed at the interface of Sn deposits and the Cu foam, thereby forming Sn–Cu6Sn5/Cu foam electrode. The electrode shows better cyclic performance and higher charge capacity than the Sn electrode electrodeposited on a smooth Cu foil does. The improved electrochemical performances of the Sn–Cu6Sn5/Cu foam electrode is due to the fact that the porous Cu foam accommodates the volumetric expansion of Sn–Cu6Sn5, and hence inhibits the pulverization or delamination of the active materials from the substrate. Furthermore, ex situ XRD analysis and SEM observation demonstrate that Sn deposits electrodeposited on the Cu foam are gradually blended with the Cu deposits, causing the transformation of Sn into Cu6Sn5. The phase transformation of Sn into Cu6Sn5 enhances the bonding force between the Sn and the Cu foam, and reducing the volume changes of active materials during cycling.

Tin Oxide Dependence of the CO2 Reduction Efficiency on Tin Electrodes and Enhanced Activity for Tin/Tin Oxide Thin-Film Catalysts

The importance of tin oxide (SnO(x)) to the efficiency of CO(2) reduction on Sn was evaluated by comparing the activity of Sn electrodes that had been subjected to different pre-electrolysis treatments. In aqueous NaHCO(3) solution saturated with CO(2), a Sn electrode with a native SnO(x) layer exhibited potential-dependent CO(2) reduction activity consistent with previously reported activity. In contrast, an electrode etched to expose fresh Sn(0) surface exhibited higher overall current densities but almost exclusive H(2) evolution over the entire 0.5 V range of potentials examined. Subsequently, a thin-film catalyst was prepared by simultaneous electrodeposition of Sn(0) and SnO(x) on a Ti electrode. This catalyst exhibited up to 8-fold higher partial current density and 4-fold higher faradaic efficiency for CO(2) reduction than a Sn electrode with a native SnO(x) layer. Our results implicate the participation of SnO(x) in the CO(2) reduction pathway on Sn electrodes and suggest that metal/metal oxide composite materials are promising catalysts for sustainable fuel synthesis.

Electrodeposition of Ni, Sn and Ni–Sn Alloy Coatings from Pyrophosphate-Glycine Bath

In this work the electrodeposition of Ni, Sn and Ni–Sn alloy from the solution containing pyrophosphate and/or glycine has been investigated by cyclic voltammmetry (CV), potentiostatic pulse and polarization curve measurements on two substrates, Ni and GC. It has been shown that the process of Sn electrodeposition in pure pyrophosphate solution commences at the potential of about −0.90 V on both substrates being characterized by the formation of isolated 3D crystals and their further growth by the reduction of [Sn(Pyr)2]6− complex. On the GC surface Sn 3D crystals remain isolated, following 3D nucleation and growth mechanism which does not fit any of the theoretically predicted models. Ni–Sn alloy deposition in the solution containing both cations (Sn2+, Ni2+) and both anions (pyrophosphate and glycine) occurs by the same growth mechanism as pure Sn deposition by simultaneous reduction of [Sn(Pyr)2]6−, [Ni(Pyr)2]6−and/or [Ni(Pyr)3]− complexes at pH 8.0. Depending on the current density/potential of the Ni–Sn alloy coating deposition onto Ni electrode the composition of the flat and compact coatings varies in the range from 66 to 50 atom% Ni, i.e. 34 to 50 atom% Sn.

Nanoporous Pt Catalyst Modified by Sn Electrodeposition for Electrochemical Oxidation of Formaldehyde

AbstractA nanoporous Pt particles‐modified Ti (nanoPt/Ti) electrode was prepared through a simple hydrothermal method using aqueous H2PtCl6 as a precursor and formaldehyde as a reduction agent. The nanoPt/Ti electrode was then modified with limited amounts of tin particles generated by cyclic potential scans in the range of −0.20 to 0.50 V in a 0.01 mol·L−1 SnCl2 solution, to synthesize a Sn‐modified nanoporous Pt catalyst (Sn/nanoPt/Ti). Electroactivity of the nanoPt/Ti and Sn/nanoPt/Ti electrodes towards formaldehyde oxidation in a 0.5 mol·L−1 H2SO4 solution was evaluated by cyclic voltammetry and chronoamperometry. Electrooxidation of formaldehyde on the nanoPt/Ti electrode takes place at a potential of 0.45 V and then presents high anodic current densities due to the large real surface area of the nanoPt/Ti electrode. The formaldehyde oxidation rate is dramatically increased on the Sn/nanoPt/Ti electrode at the most negative potentials, where anodic formaldehyde oxidation is completely suppressed on the nanoPt/Ti electrode. Chronoamperogramms (CA) of the Sn/nanoPt/Ti electrode display stable and large quasi‐steady state current densities at more negative potential steps. Amperometric data obtained at a potential step of 100 mV show a linear dependence of the current density for formaldehyde oxidation upon formaldehyde concentration in the range of 0.003 to 0.1 mol·L−1 with a sensitivity of 59.29 mA·cm−2 (mol·L−1)−1. A detection limit of 0.506 mmol·L−1 formaldehyde was found. The superior electroactivity of the Sn/nanoPt/Ti electrode for formaldehyde oxidation can be illustrated by a so‐called bifunctional mechanism which is involved in the oxidation of poisoning adsorbed CO species via the surface reaction with OH adsorbed on neighboring Sn sites.

Study of electrodeposition of amorphous Sn–Ni–Fe ternary alloys from a gluconate based electrolyte

Novel Sn–Ni–Fe ternary phases, which never occur in the metallurgical alloys, were successfully prepared by deposition from an electrolyte based on sodium gluconate, using DC electrodeposition conditions. 57Fe and 119Sn conversion electron Mössbauer spectroscopy and PXRD investigations of these alloys showed that they are amorphous and dominantly ferromagnetic. The occurrence of amorphous Sn–Fe–Ni ternary alloy phase in deposits was found to increase with the current density applied during the deposition. The co-deposition kinetics is mainly governed by the electrodeposition behavior of the tin–gluconate complex that forms in the electrolyte. The high cathodic polarization due to the tin–gluconate discharge causes an apparent mass transfer coupled co-deposition of iron. The nickel deposition rate is independent of the potential and of the partial current of the co-depositing species.

Electrodeposition and electrochemical investigation of thin film Sn–Co–Ni alloy anode for lithium-ion batteries

The thin film Sn–Co–Ni alloy electrodes were prepared by electroplating on copper foil as current collector. The structure of the electroplated porous thin film Sn–Co–Ni alloy electrode is investigated by XRD, FE-SEM, and EDAX. The electrochemical performance is analyzed by using a battery cycler at the current rate of 0.1 C to cut-off potentials of 0.01 and 1.20 V vs. Li/Li+ and also cyclic voltammeter. Experimental results illustrate that the initial discharge capacity of the Sn–Co–Ni alloy anode is 717 mAh g−1. The discharge capacity has been in increasing order between 2nd and 10th cycling and then maintained the stable capacity. It is found that the charge and discharge capacity of thin film Sn–Co–Ni alloy electrode obtained an average reversibility behavior and the better cycle stability.

Effects of triethanolamine and polyethylene glycol additives on electrodeposition of Sn–Ag solder alloy

The effects of triethanolamine (TEA) and polyethylene glycol 600 (PEG600) on the polarisation behaviour and composition of electrodeposited eutectic Sn–3·5Ag film were systematically investigated in order to widen the deposition current density range for the simplicity and potential for cost effective production. The addition of TEA to the bath with PEG600 increased the tin deposition, which was inhibited by PEG600 addition. The addition of both TEA and PEG600 helped to obtain dense and fine grained Sn–Ag alloy films and also widened the operating window.

Role of Additives in the Electrodeposition of Sn, Ag and Sn-Ag Films from Iodide-Pyrophosphate Solution

Studies towards the understanding of the electrodeposition Sn-Ag alloys from KI-K4P2O7 solution and the effect of PEG 600 and Hydrazine Hydrochloride additives on their electrochemistry and material properties is presented. PEG acts as a complexing agent that reduces the difference in the reduction potentials of Sn+2 and Ag+ species. Hydrazine Hydrochloride acts as an anti-oxidant of Sn+2 species and also a reducing agent of Sn+4 species to Sn+2. Hydrazine Hydrochloride also prevents the formation of Sn dendrites during electrodeposition, as the presence of Sn+4 is being proposed as one of the main causes of the dendrite formation. The ideal deposition conditions included the bath composition of Ag at 0.0035 M and deposition current density of 40 mA/cm2. Stress measurements of the Sn-Ag films shows that it is Tensile. X-Ray analysis of the deposit showed the presence of pure Sn and Ag3Sn intermetallic in the deposit.