In this study, the contact formation process of Al containing Ag screen-printing pastes to BBr3-based B emitters on Si is investigated. Therefore, a detailed scanning electron microscopy (SEM) and energy-dispersive X-ray spectroscopy study of top-view and cross-sectional samples was conducted. The possible influence of a SiN <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">∞</sub> :H antireflection coating was considered by comparing contacts with and without a SiN <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">∞</sub> :H layer. To analyze the role of the glass frit in the paste, the contact formation of pastes without glass was examined. The results indicate that the Ag/Al contact spots grow below the Si surface/SiN <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">∞</sub> :H layer. The glass frit is only indispensable for etching the antireflection layer-it is not needed for melting the metal in the screen-printing paste. The realized experiments lead to a phenomenological model for the contact formation process of Al containing screen-printing pastes to boron emitters.