Abstract
In this study, the contact formation process of Al containing Ag screen-printing pastes to BBr3-based B emitters on Si is investigated. Therefore, a detailed scanning electron microscopy (SEM) and energy-dispersive X-ray spectroscopy study of top-view and cross-sectional samples was conducted. The possible influence of a SiN <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">∞</sub> :H antireflection coating was considered by comparing contacts with and without a SiN <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">∞</sub> :H layer. To analyze the role of the glass frit in the paste, the contact formation of pastes without glass was examined. The results indicate that the Ag/Al contact spots grow below the Si surface/SiN <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">∞</sub> :H layer. The glass frit is only indispensable for etching the antireflection layer-it is not needed for melting the metal in the screen-printing paste. The realized experiments lead to a phenomenological model for the contact formation process of Al containing screen-printing pastes to boron emitters.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
