Robust Interconnection Research Articles

Verticality Bridging Multilayered MXenes by NCNTs for Rapid Electron/Ion Bi-Continuous Transport.

Enlarging the interlayer structure of MXenes has been proven to be an effective strategy for enhancing the speed and efficiency of ion transport in assembled MXene-based battery electrodes. However, the expanded interlayer space will inevitably lead to decreased interlayer conductivity because of the insufficient internal contact between isolated monolayered MXenes. Herein, the "rapid electron/ion bi-continuous-transport channels" are achieved by vertically growing N-doped carbon nanotubes (NCNTs) into the interlamination to bridge multilayered MXenes. Importantly, both experimental and theoretical analyses demonstrate the co-catalytic effect of Ni and MXenes on the growth of NCNTs, a phenomenon that has not been reported previously. The vertically grown NCNTs, serving as bridging pillars in the interlamination, not only significantly augment the interlayer structure but also forge a robust interconnection among the monolayered MXenes. Therefore, this design simultaneously realizes the enlargement of the interlayer space to facilitate electrolyte infiltration for fast ion transport and enhances the interlayer conductivity for rapid electron transport through the NCNTs bridging pillars. As a result, the as-derived Ti3C2@NCNTs hybrids show a high reversible capacity of 610 mAh g-1 for Li+ storage and 158 mAh g-1 Na+ storage. This work provides a universal approach to regulating the properties of MXenes.

Relationship network of safety management elements in the construction industry under the perspective of resilience

PurposeConstruction safety resilience is gradually gaining attention in the field of engineering construction as a new management concept and way to improve safety performance. However, how to cope with the dilemma of the unclear relationship of construction safety resilience elements at the practice level and promote the harmonization of construction safety goals and resilience enhancement paths has become an urgent challenge for safe construction.Design/methodology/approachThis study analyzes the components of construction safety resilience elements. A relationship network model of construction safety resilience elements is developed by using the social network analysis method. The location and influence of each element in the network and the interrelationships among the elements are explored in depth.FindingsThe findings reveal a robust interconnection among the elements of safety resilience in the construction industry. Key components such as safety behavior, risk prevention and control mechanisms, disaster prevention and mitigation technologies as well as information technology, are positioned at the core of the network. Notably, safety behavior exerts the most significant influence over the other elements, serving as the linchpin of safety management in the construction industry. Moreover, the interplay among safety resilience elements in the construction sector can alter the structure of the relationship network.Originality/valueThis study adopts the social network approach to solve the problem that it is difficult to quantitatively analyze the elements of construction safety resilience and their interrelationships and to clarify the interactions among the core elements, which can help to further assist the construction project manager to continuously optimize safety resilience and improve construction safety.

Bibliometric analysis of AI and Fintech: Mapping the intersection of artificial intelligence and financial technologies

This paper presents a comprehensive bibliometric analysis aimed at mapping the convergent landscapes of artificial intelligence (AI) and financial technology (Fintech), fields poised for significant disruptive potential in global financial services. Given the rapid integration of AI within financial operations, this research investigates the publication trends, key contributing nations, and prevalent themes within this intersection, crucial for understanding the trajectory of Fintech innovations and their alignment with AI advancements. Employing a robust methodology utilizing VOSviewer and the Scopus database, the analysis distilled insights from 298 selected papers, focusing on co-authorship, bibliographic coupling, and keyword occurrences to highlight the global influential works and primary research hubs. Key findings reveal that AI and Fintech are not only predominant themes but are also the nucleus of emerging scholarly discussions, with the United States, China, and India leading in contributions. These nations, alongside others like France and the United Kingdom, form critical nodes in our analysis, indicating a robust interconnection of global research efforts. This study introduces the novel application of advanced bibliometric techniques to dissect dense academic outputs, offering a granular view of how AI influences financial technologies. The implications of this research are manifold; it provides a strategic blueprint for academics, industry practitioners, and policymakers to understand the focal areas of AI in Fintech, suggesting an amplified focus on collaborative innovations and policy-making that aligns with technological advancements. Future research should expand the analysis to include diverse databases and explore the integration of AI across various financial sectors, emphasizing the socioeconomic impacts, ethical considerations, and regulatory challenges posed by AI-driven financial services. This extended focus will enhance our understanding of AI’s role in shaping the future of Finance, ensuring comprehensive coverage of this dynamically evolving field.

Unveiling niobium pentoxide and cerium oxide-dispersed ferritic stainless steel for solid oxide fuel cells interconnects

Herein, the effect of niobium pentoxide (Nb2O5) and nano-sized cerium oxide (CeO2) on oxidation behavior and area specific resistance (ASR) of the ferritic stainless steel has been investigated for the development of robust metallic interconnects. An oxide-dispersed ferritic stainless steel alloy is fabricated using the powder metallurgy (PM) process. The morphologies of the alloy before and after oxidation are observed through Scanning Electron Microscope (SEM), Scanning Transmission Electron Microscopy (STEM) and Secondary Ion Mass Spectrometry (SIMS) analyses. Addition of Nb2O5 in the alloy formed a C14 Laves phase of (Fe, Cr)2(Nb, Si). The Laves phase and CeO2 controlled the oxidation behavior of the ferritic stainless steels, consequently reducing the oxide scale thickness and improving the ASR. An alloy with 1 wt% Nb2O5 and 3 wt% CeO2 showed an ASR value of 27.1 mΩ cm2 at 800 °C for 1000 h, which is similar to the ASR value of the commercial Fe–Cr alloy. The results of this study indicate that Nb2O5 and CeO2-dispersed ferritic stainless steel using the PM process can be more advantageous than the conventional process for manufacturing metallic interconnects with complex shapes and reducing production costs.

Future‐proofing city power grids: FID‐based efficient interconnection strategies for major load‐centred environments

AbstractThe flexible interconnection device (FID) offers significant advantages for interconnecting different distribution networks flexibly. This paper focuses on the significant advantages offered by the FID for interconnecting different distribution networks flexibly. It specifically delves into FID‐based multi‐voltage and multi‐substation distribution networks, proposing a preferable scheme applicable to major load‐centred cities. Beginning with an analysis of constructed FID‐based flexible interconnected distribution network projects, key configurations and features are summarized. Subsequently, typical configurations, electrical parameters, facilities, relevant power functionalities, and application scenarios of multi‐voltage multi‐substation distribution networks are outlined. Building upon this foundation, a suitable interconnection scheme tailored for current urban use is explored to meet the specific needs of load‐centred cities, while incorporating recent advancements in high‐power‐density IGCT technology. An EMT model of a 10 kV/10 MW IGCT‐based four‐substation distribution network is developed in PSCAD/EMTDC. Through thorough analysis under different conditions, the operational performance and benefits are evaluated, providing insights into the efficiency and resilience of the proposed FID‐based interconnection. Lastly, challenges and prospects are discussed from various perspectives to advance the development of FID‐based flexible interconnection solutions. This study aims to contribute to the advancement and implementation of robust interconnection solutions to meet the evolving needs of major load‐centred cities.

Highly conductive coated wires for interconnection of solar cells with TECC-wire technology

TECC-Wire (thermoplastic and electrically conductive coated wire) represents a promising interconnection technology for temperature sensitive solar cells. TECC-Wire uses round copper wires (160–300 μm) coated with a thermoplastic polymer layer (10–20 μm), filled with electrically conductive particles. This study presents a new wire coating formulation based on a polyamide-type wire enamel (Voltatex® 8609 ECO, melting temperature 180 °C), filled with 12 vol% silver resulting in a conductivity of 480 S/cm. Single half-cut M6 heterojunction (SHJ) solar cells were contacted with the manufactured wires using a laboratory scale stringing machine. Peel tests were performed to characterize the adhesion of the wires to the cell surface, module performance was evaluated using electroluminescence (EL) imaging and current-voltage (IV) measurements, damp heat (DH) tests were used to evaluate the long-term stability of the modules. The wires adhere well to the cells with a peel force of more than 1.5 N/mm, and the highly conductive coating has proven to be robust when contacted with different pressure, which might be beneficial for a reliable high throughput solar module production. The obtained fill factor FF = 81.25 ± 0,12 % is similar to those achieved for solar modules connected via standard soldering techniques IEC standard DH tests confirmed that, the modules exhibiting a power loss of less than 5 % after 1000 h of storage at +85 °C and 85 % relative humidity. These results are very encouraging for further development of the technology towards a low temperature, solder-free, low cost and robust cell interconnection technology.

Distributed robust optimal configuration of multi-microgrid interconnected systems based on multi-objective bee colony algorithm

The distributed robust optimal allocation method for multi-microgrid interconnected systems usually involves a large number of variables and constraints, and the computational complexity is high in practical applications, which makes it difficult to solve the problem. Therefore, a distributed robust optimal allocation method for multi-microgrid interconnection systems based on multi-objective swarm algorithm is proposed. A distributed robust optimization configuration constraint index model for multi-microgrid interconnection system is established. Considering the influence of energy storage technology operation characteristics on its service life, a micro-grid hybrid energy storage capacity optimization configuration model with the minimum annual comprehensive energy storage cost as the objective function is established with charge and discharge power and residual power as the constraint conditions. The multi-objective swarm algorithm is used to realize the optimization model of distributed robust configuration microgrid interconnection system. By determining the power capacity configuration of the optimal energy storage system and the corresponding frequency dividing points, the power capacity configuration of the optimal energy storage system and the corresponding frequency dividing points are determined. The hybrid energy storage configuration model of multi-microgrid interconnection system is established with the minimum alternative operating cost as the objective function, so as to realize the distributed robust optimal configuration of multi-microgrid interconnection system. The simulation results show that the distributed configuration of multi-microgrid interconnection system with the proposed method has good robustness and strong optimization control ability.

Sectoral uncertainty spillovers in emerging markets: A quantile time–frequency connectedness approach

This study investigates the sectoral expected uncertainty connectedness in emerging markets across different frequencies and quantiles using the novel quantile time–frequency connectedness approach of Chatziantoniou et al. (2022a). The employed dataset spans from January 1st, 2003 to October 4th, 2022, encompassing 10 key sectors. The findings reveal a robust and notable interconnection among these sectors, with a substantial total connectedness index of 91.01%. We also note that the largest proportion of the sectoral total connectedness is associated with long-term spillovers. Consumer Cyclicals emerges as the primary source of net risk transmission. Conversely, the Communications & Networking and Healthcare appear to be the greatest net receivers of shocks at the median level. Furthermore, we find that the degree of interconnectedness substantially varies over time, frequency, and quantile, and by economic events. In addition, we find suggestive evidence of asymmetric sectoral uncertainty connectedness effects as the uncertainty spillovers are higher during turbulent market conditions than normal market conditions. A positive relationship between uncertainty measures and sectoral connectedness is also observed during periods of smooth and normal market conditions. Besides, we also conduct different portfolio analyses illustrating the importance of risk diversification to reduce investment uncertainty. This has important implications for international investors and policymakers in forming optimal investment portfolios reducing adverse risk spillovers.

Magnetoelastic Coupling Evidence by Anisotropic Crossed Thermal Expansion in Magnetocaloric RSrCoFeO6 (R = Sm, Eu) Double Perovskites.

Double perovskite oxides, characterized by their tunable magnetic properties and robust interconnection between the lattice and magnetic degrees of freedom, present an enticing foundation for advanced magnetic refrigeration materials. Herein, we delve into the influence of rare-earth elements on RSrCoFeO6 (R = Sm, Eu) disordered double perovskites by examining their structural, electronic, magnetic, and magnetocaloric properties. Temperature-dependent synchrotron X-ray diffraction analysis confirmed the stability of the orthorhombic phase (Pnma) across a wide temperature range. X-ray photoemission spectroscopy revealed that both Sm and Eu are in the 3+ state, whereas multiple states for Co2+/3+ and Fe3+/4+ are identified. The magnetic investigation and magnetocaloric effect (MCE) analysis brought to light the presence of a long-range antiferromagnetic (AFM) order with a second-order phase transition (SOPT) in both samples. The maximum magnetic entropy change ΔSMmax was approximately 0.9 J/kg K for both samples at applied field 0-7 T, manifesting prominently above Neel temperatures TN ≈ 93 K (Sm) and 84 K (Eu). Nevertheless, different relative cooling powers (RCP) of 112.6 J/kg (Sm) and 95.5 J/kg (Eu) were observed. A detailed analysis of the temperature-dependent lattice parameters shed light on a distinct magnetocaloric effect across the magnetic transition temperature, unveiling an anisotropic thermal expansion [αV = 1.41 × 10-5 K-1 (Sm) and αV = 1.54 × 10-5 K-1 (Eu)] wherein the thermal expansion axial ratio αbSm/αbEu = 0.61 became lower with increasing temperature, which suggests that the Eu sample experiences a greater thermal expansion in the b-axis direction. At the atomic bonding level, the evidence for magnetoelastic coupling around the magnetic transition temperatures TN was found through the anomalies along the average Co/Fe-O bond distance, formal valence, octahedral distortion, as well as an anisotropic lattice expansion.

Solder joint shape optimization and thermal-mechanical reliability improvement for microwave RF coaxial connectors

Coaxial connectors are widely used in microwave RF components in wireless communication, aerospace, and other fields. However, the poor interconnection reliability between their inner conductors and circuit boards has been a key factor restricting their development. Thermal cycling and high temperature are the most common working loads for high-frequency devices and the failure generally takes place at the solder joint interface. Therefore this study investigated the solder joints thermal-mechanical reliability of coaxial connectors through a combination of numerical simulation and reliability experiments. Three innovative initial models were used to solve the shape simulation problem of solder joint in planar-curved composite structures. The optimal solder joint shape and structural parameters were obtained through finite element simulation, and the impact mechanism of different parameters on solder joint reliability was explained. After optimization, the maximum stress of the solder joint decreased by 44 % with thermal cycling, while the average stress decreased by 55 %. The reliability tests effectively verified the accuracy of the simulation. In addition, the 150 °C aging tests clarified the kinetics of the growth and evolution of intermetallic compounds in this solder joint structure. The results contribute to the advancement of coaxial connectors solder joints reliability and support the development of more robust and durable interconnects for microwave devices and digital communication systems.

Novel approach to the 3D printing of biphasic calcium phosphate/molybdenum disulfide composite reinforced with polyamide12

In practical terms, the successful treatment of critical-sized bone defects remains a formidable obstacle. Among various options for bone regeneration, a customized 3D composite scaffold is widely acknowledged as the optimal choice. In the present study, we have developed a specialized composite scaffold utilizing biphasic calcium phosphate/molybdenum disulfide (BCp/MoS2) reinforced with polyamide12 (PA12) through the selective laser sintering (SLS) technique, employing different laser powers: 16W, 18W, 20W, and 22W. Notably, the BCp/MoS2/PA12 scaffold described in this research has not been explored in previous investigations. Analysis using a 3D profilometer reveals that the surface properties of the scaffold exhibit a robust mechanical interconnection between the 3-wt percent (Wt%) BCp/MoS2 composite within the PA12 matrix, particularly at a laser power of 22W. Remarkably, the mechanical properties of BCp/MoS2/PA12, including tensile strength (47.64 ± 0.42 MPa) and Young's modulus (2.31 ± 0.15 MPa), surpass those of pure PA12. These enhanced mechanical characteristics hold promising implications for the future advancement of bone tissue engineering. To comprehensively evaluate the composite scaffolds, we thoroughly investigated their thermal behavior and conducted morphological analysis. Moreover, after 21 days, in vitro live/dead results exhibited living cells along with their distinctive filopodia morphology, providing compelling evidence of the composite's non-toxicity. Further cell adhesion results showed enhanced growth, multiplication, and more reliable attachment and spreading across the composite surface. Encouragingly, the observed biological activity of the BCp/MoS2/PA12 scaffold with a 3 wt% concentration at a laser power of 22W suggests its significant potential for application in implant-related scenarios.

Solvent engineering of scalable deposited wide-bandgap perovskites for efficient monolithic perovskite-organic tandem solar cells

High-quality wide-bandgap perovskite films are a key component in constructing efficient tandem solar cells. Although the efficiency of perovskite tandem devices advances rapidly in recent years, the majority of wide-bandgap perovskite films are deposited by laboratory spin-coating, which greatly hinders their commercial viability. Here, we first show that the widely-used binary solvents (DMF:DMSO) in spin-coating are incapable of producing qualified wide-bandgap perovskite films by scalable methods. It is identified that dense and uniform wide-bandgap thin films can be deposited from single-solvent NMP by blade-coating, which is mainly related to the well-controlled crystallization kinetics enabled by the formation of stable intermediate adduct. Along with a rational passivation by constructing a 2D/3D layered heterojunction, inverted perovskite devices with a bandgap of 1.8 eV deliver a champion efficiency of 18.92 %. On this basis, monolithic perovskite-organic tandem solar cells with an efficient and robust interconnection layer of “SnO2/Au/PEDOT:PSS” are fabricated, yielding a high efficiency of 22.25 % along with an impressive open-circuit voltage of 2.1 V. These results demonstrate an important step toward scalable fabrication of monolithic perovskite-organic tandem solar devices.

Structurally synergetic stabilization of polyvinylpyrrolidone and co-doping boosts robust interconnected Ni(OH)2 nanosheets for high-performance asymmetric supercapacitor

The occurrence of microcracks hinders the capacity performance and lifetime of electrode materials in energy storage systems. Herein, we report PVP-modified and Co doped Ni(OH)2 nanosheets with structurally robust interconnection fabricated on Ni foam by a facile hydrothermal process. Co-doping obviously makes the Ni(OH)2 nanosheets have fewer microcracks while no observable microcracks appear under PVP modification. The obtained P-CoNi-0.5 LDHs (layered double hydroxides) electrode presents the optimal specific capacitance of 2350 F g−1 (293.8 mA h g−1) at 1 A g−1 current density, which is about 3.12 times greater than that of CoNi-0 LDHs (pure Ni(OH)2). The excellent rate capability is obtained since the retained specific capacitance of 1706 F g−1 (213.3 mA h g−1) is achieved at 16 A g−1 current density. An asymmetric supercapacitor device is fabricated by using P-CoNi-0.5 LDHs and activated cow dung carbon (ACDC), as the positive and negative electrode materials respectively. It exhibits desirable energy and power densities up to 32.1 W h kg−1 at 800 W kg−1, and offers a fascinating electrochemical cyclic performance of 89.6 % capacitance retention after 4000 cycles. We suggest that the synergy of Co-doping and PVP modification makes it a promising electrode material for supercapacitor applications, and also provides a feasible strategy for the design and preparation of functional electrode materials.

Overview of Genetics in Non Alcoholic Fatty Liver Disease: A Futuristic Cognizance

Non Alcoholic Fatty Liver Disease (NAFLD) is an emerging epidemic worldwide. It comprehends simple steatosis to escalating steatosis with associated fibrosis, cirrhosis, and Hepatocellular Carcinoma (HCC). NAFLD patients are at increased risk of liver-related as well as cardiovascular mortality. It seems to have a robust interconnection with visceral adiposity, Insulin Resistance (IR), inflammation, and environmental factors. Although the pathogenesis of NAFLD is presumed to be linked to lifestyle patterns, nutritional factors, and genetics, the predictor of advancement of this disease spectrum caused by genetics stands imprecise. In the past decade, multiple genome-wide associations and large candidate gene studies have recognised the contribution of several genetic polymorphisms in regulating hepatic lipid metabolism, thus influencing NAFLD establishment and progression. Recent understanding of the genetic underpinning of NAFLD explains the involvement of several common naturally occurring variants in PNPLA3, TM6SF2, MBOAT7, GCKR, LYPLAL1 and PPP1R3B genes in the evolution of the disease. The genetic landscape may play a role to appraise the risk stratification and ascertaining the potential therapeutic target in NAFLD patients. The perspective of this review was to emphasise the genetic basis of the NAFLD spectrum, which modulates the severity and progression of the disease.

Gapwaveguide Automotive Imaging Radar Antenna With Launcher in Package Technology

A 77 GHz gapwaveguide radar antenna system with launcher-in-package (LiP) technology is presented in this paper for automotive imaging applications. Firstly, state-of-the-art LiP technology integrated with radar transceivers is proposed. The transceivers are equipped with waveguide interfaces for RF connection, enabling direct integration with waveguide antennas. Robust interconnects for coupling transceivers to waveguide antennas with non-galvanic contacts are proposed using gapwaveguide packaging technology. A simultaneous multi-mode imaging radar system using 4 cascaded aforementioned transceivers is introduced. Designated antenna elements of the system are realized by slot arrays with center-fed ridge gapwaveguides. Ultimately, the imaging radar antenna has a top radiating slot layer, a middle distribution layer and a bottom interconnect layer capable of accommodating 4 LiP radar transceivers with considerable assembly tolerance which is really one of the key aspects for commercial automotive radar applications. Input matching and radiation patterns of the antenna are verified by measurement. The results indicate that the proposed gapwaveguide imaging radar antenna in conjunction with the novel LiP packaging is able to serve the radar system properly. To the best of the authors’ knowledge, the proposed gapwaveguide antenna system is the first imaging radar antenna system ever developed for LiP components. This work provides a compact, high-efficiency and cost-effective solution for the integration of complex radar systems with waveguide antennas.

Physics-of-degradation-based life prediction of solder interconnects of long-life solar arrays in low-earth orbit

Exact prediction of lifespans of solder interconnects is critical for designing reliable solar photovoltaic systems that operate for a long time across a wide range of temperatures in low earth orbit, but pertinent prediction methodology has rarely been investigated. Here, a systematic approach for analyzing the fatigue life of the solder interconnects was developed concurrently using experimental, computational, and analytical methods. Physics of failure was examined using thermal cycling, thermal aging, and materials characterization. Solder interconnect geometry as well as strain distribution and evolution were determined through equilibrium liquid surface simulation and finite element simulation. Microstructure evolution modeling, constitutive equation fitting, and fatigue model calibration were conducted to reliably predict solder interconnect lifetime. Using this integrated approach to busbar-to-wire solder interconnects in photovoltaic systems, we have demonstrated that increasing the stand-off height of solder interconnects can delay the onset of the fatigue cracks and prolong the total fatigue life. The interconnects with large solder amount go through long life due to slow crack propagation with low averaged plastic work, but they possess nearly the same number of cycles to fatigue crack initiation because of relatively fixed plastic strain range under thermal cycling. The approach proposed would be useful to inspire the design of robust interconnects in photovoltaic systems that survive harsh thermal cycling (−90 to + 130 °C).

Spinel Iron Oxide Nanoparticles Decorated on Pyridinic‐N and Carbon Surface: A Highly Efficient Inexpensive Electrocatalyst for Oxygen Reduction and Oxygen Evolution Eeactions

AbstractThe oxygen evolution reaction (OER) and oxygen reduction reaction (ORR) have been established widely owing to their significance in water electrolyzers, fuel cells and metal‐air batteries. The ORR electron transfer number have been calculated from K−L plot as 3.1 (Fe3O4/ N2−xC‐500), 3.8 (Fe3O4/N2−xC‐600), 3.6 (Fe3O4/N2−XC‐700) and 3.2 (Fe3O4/N2−XC‐800). At 3 mA cm−2, the half‐wave potential has been determined as 0.66 V (Fe3O4/N2−XC‐500), 0.76 V (Fe3O4/N2−XC‐600), 0.75 V (Fe3O4/N2−XC‐700) and 0.68 V (Fe3O4/N2−XC‐800). At 10 mA cm−2, the OER potential for Fe3O4/N2−XC‐500, Fe3O4/N2−XC‐600, Fe3O4/N2−XC‐700 and Fe3O4/N2−XC‐800 electrocatalysts were determined as 1.61, 1.58, 1.62 and 1.66 V, respectively. The ORR: OER electrode potentials were found to be 0.95, 0.82, 0.87 and 0.93 V for Fe3O4/N2−XC‐500, Fe3O4/N2−XC‐600, Fe3O4/N2−XC‐700 and Fe3O4/N2−XC‐800 electrocatalysts, respectively by using solar to hydrogen fuel device conversion scale. The ORR/OER Tafel slopes were calculated as 78/89 mV/dec (Fe3O4/N2−XC‐500), 73/78 mV/dec (Fe3O4/N2−XC‐600), 76/83 mV/dec (Fe3O4/N2−XC‐700) and 79/98 mV/dec (Fe3O4/N2−XC‐800). Among the new born oxygen vacancy (Vo) spinel oxide electrocatalysts, Fe3O4/N2−XC‐600 exhibit an exceptional oxygen electrode activity with 0.82 V in 0.1 M KOH due to robust double exchange interconnection (DEI) between stable magnetite spinel Fe3O4 and N2−XC.

Twin-Boundary Reduced Surface Diffusion on Electrically Stressed Copper Nanowires

Surface diffusion is intimately correlated with crystal orientation and surface structure. Fast surface diffusion accelerates phase transformation and structural evolution of materials. Here, through in situ transmission electron microscopy observation, we show that a copper nanowire with dense nanoscale coherent twin-boundary (CTB) defects evolves into a zigzag configuration under electric-current driven surface diffusion. The hindrance at the CTB-intercepted concave triple junctions decreases the effective surface diffusivity by almost 1 order of magnitude. The energy barriers for atomic migration at the concave junctions and different faceted surfaces are computed using density functional theory. We proposed that such a stable zigzag surface is shaped not only by the high-diffusivity facets but also by the stalled atomic diffusion at the concave junctions. This finding provides a defect-engineering route to develop robust interconnect materials against electromigration-induced failures for nanoelectronic devices.

Thermally Stable Nanotwins: New Heights for Cu Mechanics.

Nanocrystalline and nanotwinned materials achieve exceptional strengths through small grain sizes. Due to large areas of crystal interfaces, they are highly susceptible to grain growth and creep deformation, even at ambient temperatures. Here, ultrahigh strength nanotwinned copper microstructures have been stabilized against high temperature exposure while largely retaining electrical conductivity. By incorporating less than 1vol% insoluble tungsten nanoparticles by a novel hybrid deposition method, both the ease of formation and the high temperature stability of nanotwins are dramatically enhanced up to at least 400°C. By avoiding grain coarsening, improved high temperature creep properties arise as the coherent twin boundaries are poor diffusion paths, while some size-based nanotwin strengthening is retained. Such microstructures hold promise for more robust microchip interconnects and stronger electric motor components.

Artificial Intelligence Enables Real-Time and Intuitive Control of Prostheses via Nerve Interface.

The next generation prosthetic hand that moves and feels like a real hand requires a robust neural interconnection between the human minds and machines. Here we present a neuroprosthetic system to demonstrate that principle by employing an artificial intelligence (AI) agent to translate the amputee's movement intent through a peripheral nerve interface. The AI agent is designed based on the recurrent neural network (RNN) and could simultaneously decode six degree-of-freedom (DOF) from multichannel nerve data in real-time. The decoder's performance is characterized in motor decoding experiments with three human amputees. First, we show the AI agent enables amputees to intuitively control a prosthetic hand with individual finger and wrist movements up to 97-98% accuracy. Second, we demonstrate the AI agent's real-time performance by measuring the reaction time and information throughput in a hand gesture matching task. Third, we investigate the AI agent's long-term uses and show the decoder's robust predictive performance over a 16-month implant duration. Conclusion & significance: Our study demonstrates the potential of AI-enabled nerve technology, underling the next generation of dexterous and intuitive prosthetic hands.