Solder joint shape optimization and thermal-mechanical reliability improvement for microwave RF coaxial connectors

Abstract

Coaxial connectors are widely used in microwave RF components in wireless communication, aerospace, and other fields. However, the poor interconnection reliability between their inner conductors and circuit boards has been a key factor restricting their development. Thermal cycling and high temperature are the most common working loads for high-frequency devices and the failure generally takes place at the solder joint interface. Therefore this study investigated the solder joints thermal-mechanical reliability of coaxial connectors through a combination of numerical simulation and reliability experiments. Three innovative initial models were used to solve the shape simulation problem of solder joint in planar-curved composite structures. The optimal solder joint shape and structural parameters were obtained through finite element simulation, and the impact mechanism of different parameters on solder joint reliability was explained. After optimization, the maximum stress of the solder joint decreased by 44 % with thermal cycling, while the average stress decreased by 55 %. The reliability tests effectively verified the accuracy of the simulation. In addition, the 150 °C aging tests clarified the kinetics of the growth and evolution of intermetallic compounds in this solder joint structure. The results contribute to the advancement of coaxial connectors solder joints reliability and support the development of more robust and durable interconnects for microwave devices and digital communication systems.