Solder Joint Reliability Research Articles

The Intermediate Barrier Performance of Electroless Co-W-B / Ni-P Stacked Deposits Between Cu and Solder Joint

Nickel (Ni) is one of the most common surface finishing materials for solder joint and wire bonding because it can behave as the diffusion barrier for Copper (Cu) and bring excellent reliability. Electroless Ni plating has many advantages such as high productivity, good thickness uniformity, and the deposition ability for isolated patterns of printed circuit boards without supplying electrolytic power. Electroless Ni plating is widely used as the jointing material for Tin (Sn) or Sn alloy solder in printed circuit boards, lead frames, and so on. The amorphous deposits of electroless Nickel-Phosphorus (Ni-P) generate the intermetallic compounds (IMC) with solder after the reflow and the remaining Ni behaves as the barrier between Cu and solder. In this time, the P amount of Ni-P deposits generally have the impact to the growth of IMC. Electroless Ni-P with high P (high P Ni) such as 10-12 wt% has been selected to achieve both corrosion resistance and solder joint reliability. Because the growth of Sn-Ni IMC between high P Ni is faster than deposits with lower P, the target thickness of high P Ni has been set to approximately 10 µm to sustain the Ni-P layer as the barrier layer between Cu and solder during reflow. However, if the Ni-Sn IMC is repeatedly formed and dissolved by the diffusion after solder jointing, the Ni-P layer reduces and finally disappears. As a result, an additional barrier layer is desirable for higher reliability. In this study, we investigated adding electroless Cobalt-Tungsten-Boron (Co-W-B) as a new intermediate barrier between Cu and solder jointing. We evaluated the bonding strength and IMC analysis after mounting Sn-Cu-Ni-P type solder on Cu/Co-W-B/Ni-P by using different reflow profiles. Results showed that Co-W-B 0.1-0.2 µm/Ni-P 1-2 µm stacked deposits had excellent bonding strength even though the Ni-P thickness is thinner such as 1 µm. After mounting solder, a P-rich layer was generated on the Co-W-B layer in cross-sectional Transmission Electron Microscope (TEM) observation. Scanning Transmission Electron Microscope (STEM) –Energy Dispersive X-ray Spectroscopy (EDS, STEMEDS) analysis showed the P-rich layer and Co-W-B layer prevented diffusion between solder and Cu. Furthermore, even if after the thermal loading of high temperature, the bonding strength was excellent. Additionally, the cross-section analysis of STEM-EDS revealed that a thin layer composed of Ni, Co and P was formed between Co-W-B and the P-rich layer. This thin layer also might behave as the barrier for solder. In conclusion, Co-W-B / Ni-P stacked deposits exhibited excellent reliability as the additional intermediate barrier layer between Cu and solder.

Cu Pillar Electroplating Using a Synthetic Polyquaterntum Leveler and Its Coupling Effect on SAC305/Cu Solder Joint Voiding.

With the advancement of high-integration and high-density interconnection in chip manufacturing and packaging, Cu bumping technology in wafer- and panel- level packaging is developed to micrometer-sized structures and pitches to accommodate increased I/O numbers on high-end integrated circuits. Driven by this industrial demand, significant efforts have been dedicated to Cu electroplating techniques for improved pillar shape control and solder joint reliability, which substantially depend on additive formulations and electroplating parameters that regulate the growth morphology, crystal structure, and impurity incorporation in the process of electrodeposition. It is necessary to investigate the effect of an additive on Cu pillar electrodeposition, and to explore the Kirkendall voids formed during the reflowing process, which may result from the additive-induced impurity in the electrodeposited Cu pillars. In this work, a self-synthesized polyquaterntum (PQ) was made out with dual suppressor and leveler effects, and was combined with prototypical accelerator bis- (sodium sulfopropyl)-disulfide (SPS) for patterned Cu pillar electroplating. Then, Sn96.5/Ag3.0/Cu0.5 (SAC305) solder paste were screen printed on electroplated Cu pillars and undergo reflow soldering. Kirkendall voids formed at the joint interfaces were observed and quantified by SEM. Finally, XRD, and EBSD were employed to characterize the microstructure under varying conditions. The results indicate that PQ exhibits significant suppressive and levelled properties with the new structure of both leveler and suppressor. However, its effectiveness is dependent on liquid convection. PQ and SPS work synergistically, influencing the polarization effect in various convective environments. Consequently, uneven adsorption occurs on the surface of the Cu pillars, which results in more Kirkendall voids at the corners than at the center along the Cu pillar surface.

Reliability of BGA solder joints using nanoindentation

Reliability of BGA solder joints using nanoindentation

Electrochemical Migration Study on Sn-58Bi Lead-Free Solder Alloy Under Dust Contamination.

With the development of electronic packaging technology toward miniaturization, integration, and high reliability, the diameter and pitch of solder joints continue to shrink. Adjacent solder joints are highly susceptible to electrochemical migration (ECM) due to the synergistic effects of high-density electric fields, water vapor, and contaminants. Dust has become one of the non-negligible causal factors in ECM studies due to air pollution. In this study, 0.2 mM/L NaCl and Na2SO4 solutions were used to simulate soluble salt in dust, and the failure mechanism of an Sn-58Bi solder ECM in the soluble salt in dust was analyzed by a water-droplet experimental method. It was shown that the mean failure time of the ECM of an Sn-58Bi solder in an NaCl solution (53 s) was longer than that in an Na2SO4 solution (32 s) due to the difference in the anodic dissolution characteristics in the two soluble salt solutions. XPS analysis revealed that the dendrites produced by the ECM process were mainly composed of Sn, SnO, and SnO2, and there were precipitation products-Sn(OH)2 and Na2SO4-attached to the dendrites. The corrosion potential in the NaCl solution (-0.351 V) was higher than that in the Na2SO4 solution (-0.360 V), as shown by a polarization test, indicating that the Sn-58Bi solder had better corrosion resistance in the NaCl solution. Therefore, an Sn-58Bi solder has better resistance to electrochemical migration in an NaCl solution compared to an Na2SO4 solution.

The Effect of Bi Addition on the Electromigration Properties of Sn-3.0Ag-0.5Cu Lead-Free Solder

As electronic packaging technology advances towards miniaturization and integration, the issue of electromigration (EM) in lead-free solder joints has become a significant factor affecting solder joint reliability. In this study, a Sn-3.0Ag-0.5Cu (SAC305) alloy was used as the base, and different Bi content alloys, SAC305-xBi (x = 0, 0.5, 0.75, 1.0 wt.%), were prepared for tensile strength, hardness, and wetting tests. Copper wire was used to prepare EM test samples, which were subjected to EM tests at a current density of approximately 0.6 × 104 A/cm2 for varying durations. The interface microstructure of the SAC305-xBi alloys after the EM test was observed using an optical microscope. The results showed that the 0.5 wt.% Bi alloy exhibited the highest ultimate tensile strength and microhardness, improving by 33.3% and 11.8% compared to SAC305, respectively, with similar fracture strain. This alloy also displayed enhanced wettability. EM tests revealed the formation of Cu6Sn5 and Cu3Sn intermetallic compounds (IMCs) at both the cathode and anode interfaces of the solder alloy. The addition of Bi inhibited the diffusion rate of Sn in Cu6Sn5, resulting in similar total IMC thickness at the anode interface across different Bi contents under the same test conditions. However, the total IMC thickness at the cathode interface decreased and stabilized with increasing EM time, with the SAC305-0.75Bi alloy demonstrating the best resistance to EM.

Estimation of solder joint reliability in electronic packaging: Insights from finite element analysis on intermetallic compounds and voids

Estimation of solder joint reliability in electronic packaging: Insights from finite element analysis on intermetallic compounds and voids

Numerical modeling and optimization of fillet height of reinforced SAC305 solder joint in an ultra-fine capacitor assembly

PurposeThis study aims to investigate the design configuration for an optimum solder height of reinforced SAC305 solder joint in an ultra-fine capacitor assembly.Design/methodology/approachA multiphase finite volume model is developed for reflow soldering simulations to determine the fillet height of reinforced SAC305 solder joint in an ultra-fine capacitor assembly. Different solders, namely SAC305-x, SAC305-xNiO and SAC305-xTi, with varying percentage weight compositions of nanoparticles (x = 0 Wt.%, 0.01 Wt.%, 0.05 Wt.%, 0.10 Wt.%, 0.15 Wt.%) are investigated. A reflow soldering experiment is also conducted, and the cross-sections of the reflowed packages are examined using a High-Resolution Transmission Electron Microscope (HRTEM). The optimum design configurations (nanoparticle composition and material) for the solder fillet height are investigated using the Taguchi orthogonal array method.FindingsGood correlations were recorded between the HRTEM micrographs and the numerical predictions of the nanoparticles' distribution in the molten solder. The numerical prediction of the fillet height also agrees with the experiment, with a maximum disparity of 5.43%. It was found that Ti nanoparticles, having the smallest density compared to NiO and, exhibit the highest buoyancy effect in the molten solder. The Taguchi analysis revealed that the nanoparticles' material factor is more significant than the Wt.% factor for an optimum fillet height. An optimum design configuration for fillet height was established as SAC 305–0.15 Wt.% Ti, corresponding to a 41.13% improvement of the plain SAC 305 solder.Practical implicationsThe fillet height of solder joints greatly influences the solder joint reliability of miniaturized electronic packages. Solder joint reliability of ultra-fine capacitors can be improved using this study's findings on the optimum design configuration for the capacitor's solder fillet. The study’s findings can be practically implemented in industries such as electronics manufacturing, where enhanced solder joint reliability is critical.Originality/valueInvestigation of the optimum design configuration for reinforced SAC305 solder fillet is almost nonexistent in the literature. This study explored the optimization of fillet height of reinforced SAC305 solder joints in miniaturized capacitor assembly.

The influences of microstructural length scale on the tensile properties and deformation mechanisms of Sn-3.0Ag-0.5Cu solder alloys

Optimizing microstructures remains critical for improving the reliability of Pb-free solder joints, especially in applications with high failure risks. The mechanical properties of Sn-3.0Ag-0.5Cu (SAC305) solder alloys is intricately linked to the length scale of the initial microstructure. This paper investigates the effects of microstructure refinement on uniaxial tensile properties, nanomechanical response, plastic deformation, and fracture using directional solidification techniques. The findings demonstrate that controlling the microstructure can effectively enhance mechanical properties, dynamic recrystallization, and intragranular deformation in SAC305 alloys. Furthermore, the study explores heterogeneous plastic deformation and the interaction between eutectic intermetallics and β-Sn. These results offer valuable insights for optimizing microstructures to achieve superior solder joint performance.

Study on Thermal Cycling Reliability of Epoxy-Enhanced SAC305 Solder Joint.

In this work, epoxy was added into commercial Sn-3.0Ag-0.5Cu (SAC305) solder paste to enhance the thermal cycling reliability of the joint. The microstructure and fracture surface were observed using a scanning electron microscope/energy dispersive spectrometer (SEM/EDS), and a shear test was performed on the thermally cycled joint samples. The results indicated that during the thermal cycling test, the epoxy protective layer on the surface of the epoxy-enhanced SAC305 solder joint could significantly alleviate the thermal stress caused by coefficients of thermal expansion (CTE) mismatch, resulting in fewer structural defects. The interfacial compound of the original SAC305 solder joints gradually coarsened due to the accelerated atomic diffusion, but epoxy-enhanced SAC305 solder joints demonstrated a thinner interfacial layer and a smaller IMC grain size. Due to the reduced stress concentration and the additional mechanical support provided by the cured epoxy layer, epoxy-enhanced SAC305 solder joints displayed superior shear performance compared to the original joint during the thermal cycling test. After 1000 thermal cycles, Cu-Sn IMC regions were observed on the fracture surfaces of the original SAC305 solder joint, exhibiting brittle fracture characteristics. However, the fracture of the SAC305 solder joint with 8 wt.% epoxy remained within the solder bulk and exhibited a ductile fracture mode. This work indicates that epoxy-enhanced SAC305 solder pastes display high thermal cycling reliability and could meet the design needs of advanced packaging technology for high-performance electronic packaging materials.

Interfacial IMC growth behavior of Sn-3Ag-3Sb-xIn solder on Cu substrate

PurposeThe reliability of solder joints is closely related to the growth of an intermetallic compound (IMC) layer between the lead-free solder and substrate interface. This paper aims to investigate the growth behavior of the interfacial IMC layer during isothermal aging at 125°C for Sn-3Ag-3Sb-xIn/Cu (x = 0, 1, 2, 3, 4, 5 Wt.%) solder joints with different In contents and commercial Sn-3Ag-0.5Cu/Cu solder joints.Design/methodology/approachIn this paper, Sn-3Ag-3Sb-xIn/Cu (x = 0, 1, 2, 3, 4, 5 Wt.%) and commercial Sn-3Ag-0.5Cu/Cu solder were prepared for bonding Cu substrate. Then these samples were subjected to isothermal aging for 0, 2, 8, 14, 25 and 45 days. Scanning electron microscopy and transmission electron microscopy were used to analyze the soldering interface reaction and the difference in IMC growth behavior during the isothermal aging process.FindingsWhen the concentration of In in the Sn-3Ag-3Sb-xIn/Cu solder joints exceeded 2 Wt.%, a substantial amount of InSb particles were produced. These particles acted as a diffusion barrier, impeding the growth of the IMC layer at the interface. The growth of the Cu3Sn layer during the aging process was strongly correlated with the presence of In. The growth rate of the Cu3Sn layer was significantly reduced when the In concentration exceeded 3 Wt.%.Originality/valueThe addition of In promotes the formation of InSb particles in Sn-3Ag-3Sb-xIn/Cu solder joints. These particles limit the growth of the total IMC layer, while a higher In content also slows the growth of the Cu3Sn layer. This study is significant for designing alloy compositions for new high-reliability solders.

Effect of the solder conductive particles and substrate widths on the current carrying capability for flex-on-board (FOB) assembly

PurposeThe study aims to ascertain the influence of solder conductive particle types and substrate widths on the current carrying capability of flex-on-board (FOB) assemblies. By comparing Sn58Bi and SAC305 particles and varying substrate widths, the research sought to provide insights into the stability and performance of solder joints under different scenarios, particularly in high-power applications.Design/methodology/approachThe study used a comprehensive design/methodology, encompassing the investigation of solder conductive particle types (Sn58Bi and SAC305) and substrate widths on the current carrying capability of FOB assembly. Stable solder joints were obtained by manipulating the curing speed of anisotropic conductive films for both particle types. Various tests were conducted, including current carrying capability assessments under differing conditions.FindingsThe study revealed that larger substrate widths yielded higher current carrying capability due to increased contact area and reduced contact resistance. Notably, solder joints remained stable beyond the solder melting temperature due to encapsulation by cured epoxy resin. SAC305 solder joints exhibited superior current carrying capability over Sn58Bi in continuous high-voltage conditions. The results emphasized the stability of SAC305 solder joints and their suitability for robust interconnections in high-power FOB assemblies.Originality/valueThis study contributes by offering a comprehensive assessment of the impact of solder particle types and substrate widths on solder joint performance in FOB assemblies. The finding that SAC305 joints outperform Sn58Bi under continuous high-voltage conditions adds significant value. Moreover, the observation of stable solder joints beyond solder melting temperature due to resin encapsulation introduces a novel aspect to solder joint reliability. These insights provide valuable guidance for designing robust and high-performance interconnections in demanding applications.

Brittle Fracture Behavior of Sn-Ag-Cu Solder Joints with Ni-Less Surface Finish via Laser-Assisted Bonding.

In this study, we investigated the brittle fracture behavior of Sn-3.0Ag-0.5Cu (SAC305) solder joints with a Direct Electroless Gold (DEG) surface finish, formed using laser-assisted bonding (LAB) and mass reflow (MR) techniques. Commercial SAC305 solder balls were used to ensure consistency. LAB increases void fractions and coarsens the primary β-Sn phase with higher laser power, resulting in a larger eutectic network area fraction. In contrast, MR produces solder joints with minimal voids and a thicker intermetallic compound (IMC) layer. LAB-formed joints exhibit higher high-speed shear strength and lower brittle fracture rates compared to MR. The key factor in the reduced brittle fracture in LAB joints is the thinner IMC layer at the joint interface. This study highlights the potential of LAB in enhancing the mechanical reliability of solder joints in advanced electronic packaging applications.

Intermetallic Compounds in Solder Alloys: Common Misconceptions

Intermetallic compounds (IMC) or intermediate phases are formed between two or more metallic elements in many metal alloy systems. During soldering, an IMC is formed at the soldered interface as the molten solder reacts with an element in the substrate. IMCs also can form within the bulk solder as the joint solidifies. IMCs have critical roles in the solder joint quality and reliability. Unlike most metal alloys, an intermetallic compound typically has a fixed stoichiometry and is in variance with the conventional phases or constituents in the metal system (e.g., alpha and beta). IMCs have a different crystal structure than any of its constituents and some but never all the characteristics and properties of its constituents. Ductility is an important solder joint property, and the low intrinsic ductility of IMCs is associated with brittle behavior and reliability risk in service. However, a review of published solder field failures shows little evidence that IMC properties or IMC evolution under service conditions reduce solder joint reliability. Most IMC-induced solder joint failures are found to result from incorrect material specification or uncontrolled soldering processes. This paper describes the IMCs that occur typically in eutectic, Sn63Pb37 solder and near-eutectic SAC305 or other tin-based Pb-free solder alloys, including how they impact solder joint reliability. The paper also describes the potential impact of IMCs on the solder joint reliability for the newest generation of Pb-free high-performance solder alloys.

Investigation of the Impacts of Solder Alloy Composition and Temperature Profile on Fatigue Life of Ball Grid Array Solder Joints Under Accelerated Thermal Cycling

Abstract This study investigated the thermal fatigue reliability of ball grid array (BGA) solder joints under accelerated thermal cycling, considering the impacts of solder alloy and temperature profile. Applying the Darveaux solder joint reliability assessment, simulations consider lead-based (63Sn37Pb and 62Sn36Pb2Ag) and lead-free (SAC105, SAC305, and SAC405) solder alloys under temperature profiles: 0°C (Tmin) to 100°C (Tmax), −40°C to 85 °C, −40 °C to 125 °C, and −40 °C to 150 °C. Results indicate that SAC305 exhibited the highest equivalent stress, while 63Sn37Pb demonstrated the highest plastic strain and creep strain energy density. SAC105 displayed the lowest stress and strain parameters. Moreover, increasing the thermal cycling temperature range intensifies stress, strain, and damage parameters, with −40 °C to 150 °C showing the highest magnitudes. SAC405 exhibited superior thermal fatigue life compared to other alloys, with its cycles to failure outperforming 63Sn37Pb, SAC105, 63Sn36Pb2Ag, and SAC305 by 16832, 11992, 6218, and 3601 cycles, respectively. Lower temperature ranges enhance thermal fatigue life, with 0 °C to 100 °C recording 8%, 33%, and 53% higher life than −40 °C to 85 °C, −40 °C to 125 °C, and −40 °C to 150 °C, respectively. Notably, higher silver content and lower temperature ranges were associated with increased thermal fatigue life, providing valuable insights for BGA solder joint reliability enhancement.

Stable SnAgCu solder joints reinforced by nickel-coated carbon fiber for electronic packaging

Today’s 3D electronic packaging is characterized by smaller size and higher functional density, which generally require multiple reflow cycles. However, due to the Ostwald ripening process of the interfacial intermetallic compound (IMC), the solder joint’s strength would decrease as the number of reflow cycles increases. To address this, we developed a novel composite solder by incorporating nickel-coated carbon fiber (Ni@CF) into the Sn–3.0Ag–0.5Cu (SAC305) solder connection. The study showed that Ni@CF effectively enhanced the stability and reliability of solder joints during multiple reflow processes. Compared with Ni@CF-free equivalents, Ni@CFs promoted the nucleation of interfacial IMC during the solid–liquid reaction and inhibited Ostwald ripening, leading to a refinement of the interfacial IMC grains. As a result, the interface was strengthened, and the shift of shear fracture to the brittle interface seen in the SAC305 solder joint with multiple reflows did not occur in the composite solder joint. Furthermore, carbon fiber strengthened the solder matrix through the load transfer and shear-off mechanisms, depending on its inclination angle with the shear plane. Consequently, the Ni@CFs-reinforced solder joints maintained a shear strength of over 42 MPa throughout ten reflow cycles, while the pristine SAC305 solder joint exhibited decreased shear strength to 33 MPa. This study provides new insights into composite solder joints’ stability and reinforcement characteristics when subjected to multiple reflows.

Mechanical property of intermetallic compounds in Zn–Al solder interconnects by nanoindentation and first-principles calculations

Presently, interfacial intermetallic compounds play a vital role in determining the reliability of solder joints due to their intrinsic mechanical property. Especially for Zn–Al solder joints, the interfacial Cu–Zn IMCs grow significantly without diffusion barriers. This work comprehensively investigated the mechanical properties of interfacial IMCs in Zn–Al solder joints with and without the Ni–W–P diffusion barrier by nanoindentation tests and first-principles calculations. The nanoindentation results show that the elastic moduli of CuZn4, Cu5Zn8, CuZn and Al3Ni2 were 68.45 ± 1.4 GPa, 142.6 ± 2.3 GPa, 94.7 ± 1.16 GPa, and 221 ± 18.9 GPa, respectively. Their corresponding hardness were 1.03 ± 0.04 GPa, 5.98 ± 0.23 GPa, 1.38 ± 0.16 GPa, and 17.7 ± 0.16 GPa. Through first-principles calculations, the bulk modulus of CuZn and Cu5Zn8 exhibits isotropic behaviour, while CuZn4 and Al3Ni2 demonstrate anisotropy. In addition, the bulk modulus, shear modulus, Young's modulus and hardness values of Al3Ni2 are considerably higher when compared to those of Cu–Zn intermetallic compounds.

Research Overview on the Electromigration Reliability of SnBi Solder Alloy.

Due to the continuous miniaturization and high current-carrying demands in the field of integrated circuits, as well as the desire to save space and improve computational capabilities, there is a constant drive to reduce the size of integrated circuits. However, highly integrated circuits also bring about challenges such as high current density and excessive Joule heating, leading to a series of reliability issues caused by electromigration. Therefore, the service reliability of integrated circuits has always been a concern. Sn-based solders are widely recognized in the industry due to their availability, minimal technical issues during operation, and good compatibility with traditional solders. However, solders that are mostly Sn-based, such as SAC305 and SnZn, have a high melting point for sophisticated electronic circuits. When Bi is added, the melting point of the solder decreases but may also lead to problems related to electromigration reliability. This article reviews the general principles of electromigration in SnBi solder joints on Cu substrates with current flow, as well as the phenomena of whisker formation, voids/cracks, phase separation, and resistance increase caused by atomic migration due to electromigration. Furthermore, it explores methods to enhance the reliability of solder joint by additives including Fe, Ni, Ag, Zn, Co, RA (rare earth element), GNSs (graphene nanosheets), FNS (Fullerene) and Al2O3. Additionally, modifying the crystal orientation within the solder joint or introducing stress to the joint can also improve its reliability to some extent without changing the composition conditions. The corresponding mechanisms of reliability enhancement are also compared and discussed among the literature.

Investigating the impact of different solder alloy materials during laser soldering process

PurposeThis study aims to investigate the influence of different solder alloy materials on passive devices during laser soldering process. Solder alloy material has been found to significantly influence the solder joint’s quality, such as void formation that can lead to cracks, filling time that affects productivity and fillet shape that determines the solder joint’s reliability.Design/methodology/approachFinite volume method (FVM)-based simulation that was validated using real laser soldering experiment is used to evaluate the effect of various solder alloy materials, including SAC305, SAC387, SAC396 and SAC405 in laser soldering. These solders are commonly used to assemble the pin-through hole (PTH) capacitor onto the printed circuit board.FindingsThe simulation results show how the void ratio, filling time and flow characteristics of different solder alloy materials affect the quality of the solder joint. The optimal solder alloy is SAC396 due to its low void ratio of 1.95%, fastest filling time (1.3 s) to fill a 98% PTH barrel and excellent flow characteristics. The results give the ideal setting for the parameters that can increase the effectiveness of the laser soldering process, which include reducing filling time from 2.2 s to less than 1.5 s while maintaining a high-quality solder joint with a void ratio of less than 2%. Industries that emphasize reliable soldering and effective joint formation gain the advantage of minimal occurrence of void formation, quick filling time and exceptional flowability offered by this solution.Practical implicationsThis research is expected not only to improve solder joint reliability but also to drive advancements in laser soldering technology, supporting the development of efficient and reliable microelectronics assembly processes for future electronic devices. The optimized laser soldering material will enable the production of superior passive devices, meeting the growing demands of the electronics market for smaller, high-performance electronic products.Originality/valueThe comparison of different solder alloy materials for PTH capacitor assembly during the laser soldering process has not been reported to date. Additionally, volume of fluid numerical analysis of the quality and reliability of different solder alloy joints has never been conducted on real PTH capacitor assemblies.

Thermal Fatigue Failure of Micro-Solder Joints in Electronic Packaging Devices: A Review

In electronic packaging products in the service process, the solder joints experience thermal fatigue due to temperature cycles, which have a significant influence on the performance of electronic products and the reliability of solder joints. In this paper, the thermal fatigue failure mechanism of solder joints in microelectronic packages, the microstructure changes of the thermal fatigue process, the influence factors on the joint fatigue life, and the simulation analysis and forecasting of thermal fatigue life are reviewed. The results show that the solder joints are heterogeneously coarsened, and this leads to fatigue cracks occurring under the elevated high-temperature phase of alternating temperature cycles. However, the thickness of the solder and the hold time in the high-temperature phase do not significantly influence the thermal fatigue. The coarsened region and the IMC layer thicken with the number of cycles, and the cracks initiate and propagate along the interface between the intermetallic compound (IMC) layer and coarsened region, eventually leading to solder joint failure. For lead-containing and lead-free solders, the lead-containing solder shows a faster fatigue crack growth rate and propagates by transgranular mode. Temperature and frequency affect the thermal fatigue life of solder joints to different degrees, and the fatigue lifetime of solder joints can be predicted through a variety of methods and simulated crack trajectories, but also through the use of a unified constitutive model and finite element analysis for prediction.

Solder joint reliability performance study and shear characterization of low-Ag SAC lead-free solders for handheld application

As handheld electronic products move toward smaller and thinner form factor, the demand of high reliability under stringent field usage also increasing. Drop test, based on the JEDEC JESD22-B111A, accompanied with temperature cycling (TC) test, based on JEDEC JESD22-A104F, are two of the most critical board-level reliability tests for handheld makers. In terms of solder joint reliability (SJR), total 7 candidates of LF35-liked lead-free solder alloys are investigated for its drop performance, and TC reliability evaluation. Among 7 solders, leg 4 and 5 exhibit both decent drop and TC behavior, which are likely owing to the silver (Ag) precipitation hardening and bismuth (Bi) solid solution hardening effect respectively. In addition, the shearing mechanical characterization of 7 solder alloys are being studied. Shear strength of leg 4 and 5 shows higher strength value than others. In terms of failure analysis under drop test, three main fracture modes are observed, including via cracking at PCB side, solder/intermetallic compound (IMC) cracking at package side, and Cu trace broken at package side. Furthermore, in terms of failure modes of TC test, solder/IMC cracking at package side are the main fracture modes. In summary, this study provides an overall reliability performance mapping for 7 solders, and list out a table comprising of shear strength, void% analysis, TC reliability, and drop reliability performance for each LF35 solders which lays out potential future solder alloy to meet higher handheld phone drop reliability margin.