Abstract
Optimizing microstructures remains critical for improving the reliability of Pb-free solder joints, especially in applications with high failure risks. The mechanical properties of Sn-3.0Ag-0.5Cu (SAC305) solder alloys is intricately linked to the length scale of the initial microstructure. This paper investigates the effects of microstructure refinement on uniaxial tensile properties, nanomechanical response, plastic deformation, and fracture using directional solidification techniques. The findings demonstrate that controlling the microstructure can effectively enhance mechanical properties, dynamic recrystallization, and intragranular deformation in SAC305 alloys. Furthermore, the study explores heterogeneous plastic deformation and the interaction between eutectic intermetallics and β-Sn. These results offer valuable insights for optimizing microstructures to achieve superior solder joint performance.
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