Abstract
PurposeThis study aims to investigate the design configuration for an optimum solder height of reinforced SAC305 solder joint in an ultra-fine capacitor assembly.Design/methodology/approachA multiphase finite volume model is developed for reflow soldering simulations to determine the fillet height of reinforced SAC305 solder joint in an ultra-fine capacitor assembly. Different solders, namely SAC305-x, SAC305-xNiO and SAC305-xTi, with varying percentage weight compositions of nanoparticles (x = 0 Wt.%, 0.01 Wt.%, 0.05 Wt.%, 0.10 Wt.%, 0.15 Wt.%) are investigated. A reflow soldering experiment is also conducted, and the cross-sections of the reflowed packages are examined using a High-Resolution Transmission Electron Microscope (HRTEM). The optimum design configurations (nanoparticle composition and material) for the solder fillet height are investigated using the Taguchi orthogonal array method.FindingsGood correlations were recorded between the HRTEM micrographs and the numerical predictions of the nanoparticles' distribution in the molten solder. The numerical prediction of the fillet height also agrees with the experiment, with a maximum disparity of 5.43%. It was found that Ti nanoparticles, having the smallest density compared to NiO and, exhibit the highest buoyancy effect in the molten solder. The Taguchi analysis revealed that the nanoparticles' material factor is more significant than the Wt.% factor for an optimum fillet height. An optimum design configuration for fillet height was established as SAC 305–0.15 Wt.% Ti, corresponding to a 41.13% improvement of the plain SAC 305 solder.Practical implicationsThe fillet height of solder joints greatly influences the solder joint reliability of miniaturized electronic packages. Solder joint reliability of ultra-fine capacitors can be improved using this study's findings on the optimum design configuration for the capacitor's solder fillet. The study’s findings can be practically implemented in industries such as electronics manufacturing, where enhanced solder joint reliability is critical.Originality/valueInvestigation of the optimum design configuration for reinforced SAC305 solder fillet is almost nonexistent in the literature. This study explored the optimization of fillet height of reinforced SAC305 solder joints in miniaturized capacitor assembly.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.