In this paper, a green inhibitor, adenine, is introduced into the Cu-CMP slurry to prevent the toxic ingestion in the CMP process. Moreover, in order to effectively optimize and control the copper chemical mechanical polishing based on the corrosion-inhibition balance, an expression is proposed to diagnostic the balance quickly via the least square fitting of the experimental data. Based on the corrosion-inhibition balance optimization, a pH-neutral slurry (pH = 6.8 ∼ 7.2) incorporating adenine with a high material removal rate (MRR > 600 nm/min), a low surface roughness (Ra < 1 nm) as well as low surface defects (no micro-scratches, number of surface corrosion pits ≤ 0.02 counts·μm−2, particle residues ≤ 0.98 counts·μm−2) is achieved. This newly developed slurry and the diagnostic method for the corrosion-inhibition balance should be promising for designing the green slurry for Cu-CMP.