The U.S. Army AMRDEC, Stanley Associates, and the Georgia Institute of Technology are developing spectrally sensitive acoustic emission sensors for the detection of various phenomena of interest in Army missiles and assets. Multiple systems would benefit from monitoring the acoustic spectrum and identifying signatures of interest. These would include monitoring sounds external to Unattended Ground Sensors, looking for specific sounds associated with machine failure in a condition-based maintenance scenario, and identifying items that are impacting each other. Potential device designs employ electroactive polymers to convert acoustic waves into electrical impulses. Many electroactive polymers are, however, not compatible with standard MEMS processing, particularly at elevated temperatures. Piezoelectric films, such as PVDF, require stretching and poling processes to orient the crystal structure. Electret films also require poling to create a permanent polarization, plus discharge occurs at relatively low-temperatures. These types of films are difficult to integrate directly into MEMS devices because of these incompatible processes. The films are therefore added using post-fabrication bonding and assembly processes, thus reducing design flexibility and increasing cost. This paper will present techniques being developed to integrate electroactive polymers directly in MEMS sensors as opposed to performing post-fabrication assembly of electroactive films into sensor structures.