Abstract Leadless Ceramic Chip Carrier (LCCC) is commonly used in high-density electronic packaging PCB boards. Due to the different thermal expansion of materials, the solder joints of LCCC devices are prone to stress and cracking after assembly, which leads to the failure of LCCC devices’ electrical performance. In this paper, the advantages and disadvantages of four solutions were analysed, and comprehensively considered the use of ball planting to alleviate thermal mismatch stress. After experimental verification, the thermal mismatch between the LCCC devices and PCB results in a lifespan of less than 200 cycles for direct assembly of the LCCC devices. Planting balls at the bottom of LCCC devices and soldering can effectively increase the lifespan of solder joints and improve product reliability. By analysing the SMT process, the bottom high-lead ball placement of LCCC devices was implemented, and environmental testing was conducted using temperature shock testing to demonstrate that bottom ball placement can extend solder joint life and improve reliability. This study provides a reliable soldering method for large-scale LCCC devices and provides a basis for improving LCCC reliability.
Read full abstract