Phase Change Memory Devices Research Articles

Self-Healing of a Confined Phase Change Memory Device with a Metallic Surfactant Layer.

Understanding and possibly recovering from the failure mechanisms of phase change memories (PCMs) are critical to improving their cycle life. Extensive electrical testing and postfailure electron microscopy analysis have shown that stuck-set failure can be recovered. Here, self-healing of novel confined PCM devices is directly shown by controlling the electromigration of the phase change material at the nanoscale. In contrast to the current mushroom PCM, the confined PCM has a metallic surfactant layer, which enables effective Joule heating to control the phase change material even in the presence of a large void. In situ transmission electron microscope movies show that the voltage polarity controls the direction of electromigration of the phase change material, which can be used to fill nanoscale voids that form during programing. Surprisingly, a single voltage pulse can induce dramatic migration of antimony (Sb) due to high current density in the PCM device. Based on the finding, self-healing of a large void inside a confined PCM device with a metallic liner is demonstrated for the first time.

Effect of scaling on thermal properties and switching operation of phase change memory devices

Phase change memory (PCM) is one of the most promising emerging non-volatile memory technologies. This paper simulates phase change memory devices (PCMDs) with careful attention to the scaling and its resulting impact on programming current during the switching operation, while Thomson heating within the phase change material and Peltier heating at the electrode interface are considered. The simulation results show that the device scaling has an influence on temperature distribution, volume of the molten region, heat diffusion and switching operation of PCMDs. The programming current decreases with smaller electrode size, greater thickness of phase change material and deeper isotropic scaling. The heat diffusion becomes more serious when the thickness of phase change materials decreases and the size of PCMD is isotropically scaled down. The scaling arguments also indicate that the impact of thermoelectric phenomena weakens with smaller dimensions due to the influence of programming current, heat diffusion and action area. This simulation provides useful insights to understand the switching operation of the PCMDs under the impact of thermoelectric effects. The process is instrumental for a complete understanding of device operation and hence provides valuable feedback for fine-tuning the device design so as to enhance its efficiency.

Studies on Se75Te25–xInx chalcogenide glasses; a material for phase change memory

This research paper describes the non-isothermal crystallization during phase transformation in Se75Te25–xInx glasses synthesized by melt quenching method. For crystallization studies in these glasses, non-isothermal differential scanning calorimetry (DSC) measurements was done at constant heating rates of 5, 10, 15, 20 and 25 K min−1 in air atmosphere. The glass transition temperature (Tg), on-set crystallization temperature (Tc), peak crystallization temperature (Tp) and melting temperatures (Tm) were derived by DSC thermograms. Using various thermal parameters the activation energy of glass transition and crystallization were determined by using Kissinger, Moynihan and Ozawa approaches and found to be in good agreement. The value of the activation energy of glass transition (ΔEt) was found to be minimum for Se75Te19In6 alloys confirming its maximum probability of transition in a metastable state. Thermal stability parameters of Se75Te25–xInx were determined and found to be increased with indium content. High resolution x-ray diffraction and field emission scanning electron microscopy studies were employed for the study of phase transformation in Se75Te25–xInx glasses. The outcome of these studies shows that the investigated materials may be suitable for phase change memory devices.

ELECTROTHERMAL CHARACTERIZATION OF PHASE-CHANGE FILMS AND DEVICES

The reversible changes in the optical properties of the phase-change materials have made the rewritable optical storage possible which has revolutionized the dissemination of data since 1990s. For the last two decades, the phase-change materials have been studied extensively for its applications as nonvolatile memory elements (phase-change memory (PCM) devices). While the PCM devices were initially considered as replacements for the flash memory, today they promise a universal memory acting as the main memory and the storage unit. Here we demonstrate a simple alternative to study phase-change films and devices for further fundamental studies. The films are deposited using a single sputtering target and the devices are formed using single lithography, deposition and liftoff steps. The electrical resistivity of the films and devices are characterized in a temperature range varying from room temperature to 250 °C. Finally, microscale GST wires are amorphized by melting using self-heating and quenching.

Fast phase change with no preconditions

Phase-Change Memory Random access memory (RAM) devices that rely on phase changes are primarily limited by the speed of crystallization. Rao et al. combined theory with a simple set of selection criteria to isolate a scandium-doped antimony telluride (SST) with a subnanosecond crystallization speed (see the Perspective by Akola and Jones). They synthesized SST and constructed a RAM device with a 700-picosecond writing speed. This is an order of magnitude faster than previous phase-change memory devices and competitive with consumer dynamic access, static random access, and flash memory. Science , this issue p. [1423][1]; see also p. [1386][2] [1]: /lookup/doi/10.1126/science.aao3212 [2]: /lookup/doi/10.1126/science.aaq0476

Reduction of thermal conductivity in YxSb2–xTe3 for phase change memory

Thermal conductivity (κ) is one of the fundamental properties of materials for phase change memory (PCM) application, as the set/reset processes strongly depend upon heat dissipation and transport. The κ of phase change materials in both amorphous and crystalline phases should be quite small, because it determines how energy-efficient the PCM device is during programming. At a high temperature, the electronic thermal conductivity (κe) is always notable for semiconductors, which is still lacking for antimony telluride under doping in the literature as far as we know. In this paper, using density functional theory and Boltzmann transport equations, we report calculations of lattice thermal conductivity κL and electronic thermal conductivity κe of the yttrium doped antimony telluride. We show that the average value of thermal conductivity decreases from ∼2.5 W m−1 K−1 for Sb2Te3 to ∼1.5 W m−1 K−1 for Y0.167Sb1.833Te3. This can be attributed to the reduced κL and κe, especially the κe at high temperature (near melting point). We further point out that the increased effective mass of carriers and the flat valance band edge are responsible for the decrease of κe. The reduced thermal conductivity is highly desirable for the decrease of heat dissipation and transport in PCM operations, which can increase the density of memory and reduce energy consumption.

Reducing the stochasticity of crystal nucleation to enable subnanosecond memory writing.

Operation speed is a key challenge in phase-change random-access memory (PCRAM) technology, especially for achieving subnanosecond high-speed cache memory. Commercialized PCRAM products are limited by the tens of nanoseconds writing speed, originating from the stochastic crystal nucleation during the crystallization of amorphous germanium antimony telluride (Ge2Sb2Te5). Here, we demonstrate an alloying strategy to speed up the crystallization kinetics. The scandium antimony telluride (Sc0.2Sb2Te3) compound that we designed allows a writing speed of only 700 picoseconds without preprogramming in a large conventional PCRAM device. This ultrafast crystallization stems from the reduced stochasticity of nucleation through geometrically matched and robust scandium telluride (ScTe) chemical bonds that stabilize crystal precursors in the amorphous state. Controlling nucleation through alloy design paves the way for the development of cache-type PCRAM technology to boost the working efficiency of computing systems.

Impact of Pressure on the Resonant Bonding in Chalcogenides

Resonant bonding has been appreciated as an important feature in some chalcogenides. The establishment of resonant bonding can significantly delocalize the electrons and shrink the band gap, leading to low electrical resistivity and soft optical phonons. Many materials that exhibit this bonding mechanism have applications in phase-change memory and thermoelectric devices. Resonant bonding can be tuned by various means, including thermal excitations and changes in composition. In this work, we manipulate it by applying large hydrostatic-like pressure. Synchrotron X-ray diffraction and density functional theory reveal that the orthorhombic lattice of GeSe appears to become more symmetric and the Born effective charge has significantly increased at high pressure, indicating that resonant bonding has been established in this material. In contrast, the resonant bonding is partially weakened in PbSe at high pressure due to the discontinuity of chemical bonds along a certain lattice direction. By controlling res...

Modeling of Phase-Change Memory: Nucleation, Growth, and Amorphization Dynamics During Set and Reset: Part I—Effective Media Approximation

We have constructed a framework that enables finite-element modeling of nucleation, growth, and amorphization processes in phase-change memory devices using a single rate equation that tracks evolution of local crystal density at each mesh point. The rate equation, current continuity equation, and Fourier heat transfer equation are solved simultaneously to perform electro-thermal simulations that capture the device dynamics during set and reset operations. The functionality of this framework is demonstrated through simulation of various set and reset operations and consecutive set/reset cycles of a mushroom cell using temperature and crystallinity dependent parameters for Ge2Sb2Te5.

Dual-Layer Dielectric Stack for Thermally Isolated Low-Energy Phase-Change Memory

High reset energy is an ongoing issue for phase-change memory (PCM) devices. Prior work demonstrates that smaller PCM switching volume and thermal isolation can reduce the reset energy. In this paper, we fabricate and measure a planar confined PCM device with a multilayer dual-layer stack (DLS) of SiO2/Al2O3 insulator. Devices with contact area of 500 $\times $ 20 nm and lengths of $2~ {\mu }\text{m}$ show exceptionally low reset energies of 18.25 ± 15.8 pJ and low reset current densities of 0.94 ± 0.51 MA/cm2. Implementing the DLS enables a 60% reduction in reset energy compared with SiO2-isolated devices.

Temporal correlation detection using computational phase-change memory

Conventional computers based on the von Neumann architecture perform computation by repeatedly transferring data between their physically separated processing and memory units. As computation becomes increasingly data centric and the scalability limits in terms of performance and power are being reached, alternative computing paradigms with collocated computation and storage are actively being sought. A fascinating such approach is that of computational memory where the physics of nanoscale memory devices are used to perform certain computational tasks within the memory unit in a non-von Neumann manner. We present an experimental demonstration using one million phase change memory devices organized to perform a high-level computational primitive by exploiting the crystallization dynamics. Its result is imprinted in the conductance states of the memory devices. The results of using such a computational memory for processing real-world data sets show that this co-existence of computation and storage at the nanometer scale could enable ultra-dense, low-power, and massively-parallel computing systems.

Multiple Physical Time Scales and Dead Time Rule in Few-Nanometers Sized Graphene-SiOx-Graphene Memristors.

The resistive switching behavior in SiOx-based phase change memory devices confined by few nanometer wide graphene nanogaps is investigated. Our experiments and analysis reveal that the switching dynamics is not only determined by the commonly observed bias voltage dependent set and reset times. We demonstrate that an internal time scale, the dead time, plays a fundamental role in the system's response to various driving signals. We associate the switching behavior with the formation of microscopically distinct SiOx amorphous and crystalline phases between the graphene electrodes. The reset transition is attributed to an amorphization process due to a voltage driven self-heating; it can be triggered at any time by appropriate voltage levels. In contrast, the formation of the crystalline ON state is conditional and only occurs after the completion of a thermally assisted structural rearrangement of the as-quenched OFF state which takes place within the dead time after a reset operation. Our results demonstrate the technological relevance of the dead time rule which enables a zero bias access of both the low and high resistance states of a phase change memory device by unipolar voltage pulses.

Strong electron-polarized atom chain in amorphous phase-change memory Ge[sbnd]Sb[sbnd]Te alloy

Phase-change memory (PCM) material is the promising material system for nonvolatile-memory technology. Performance optimization of PCM device urgently requires the deeper clarification of its material “Gene”. In this study, through first-principles calculations, p-orbital-aligned atom chains are identified to play important roles in governing optoelectronic reflectivity in amorphous Ge2Sb2Te5. These atom chains make the electronic state of the amorphous Ge2Sb2Te5 hold strong electron-polarized components, thereby governing the optical property. The present study offers a new understanding of “Gene” for PCM materials which benefit the material design and the performance improvement of PCM devices.

High temperature electrical resistivity and Seebeck coefficient of Ge2Sb2Te5 thin films

High-temperature characterization of the thermoelectric properties of chalcogenide Ge2Sb2Te5 (GST) is critical for phase change memory devices, which utilize self-heating to quickly switch between amorphous and crystalline states and experience significant thermoelectric effects. In this work, the electrical resistivity and Seebeck coefficient are measured simultaneously as a function of temperature, from room temperature to 600 °C, on 50 nm and 200 nm GST thin films deposited on silicon dioxide. Multiple heating and cooling cycles with increasingly maximum temperature allow temperature-dependent characterization of the material at each crystalline state; this is in contrast to continuous measurements which return the combined effects of the temperature dependence and changes in the material. The results show p-type conduction (S > 0), linear S(T), and a positive Thomson coefficient (dS/dT) up to melting temperature. The results also reveal an interesting linearity between dS/dT and the conduction activation energy for mixed amorphous-fcc GST, which can be used to estimate one parameter from the other. A percolation model, together with effective medium theory, is adopted to correlate the conductivity of the material with average grain sizes obtained from XRD measurements. XRD diffraction measurements show plane-dependent thermal expansion for the cubic and hexagonal phases.

Effect of electron beam on structural, linear and nonlinear properties of nanostructured Fluorine doped ZnO thin films

Electron beam induced effects on Fluorine doped ZnO thin films (FZO) grown by chemical spray pyrolysis deposition technique were studied. The samples were exposed to 8MeV electron beam at different dose rate ranging from 1kGy to 4kGy. All films exhibit a polycrystalline nature which shows an increase in crystallanity with irradiation dosages. The electron beam irradiation effectively controls the films surface morphology and its linear optical characteristics. Z-Scan technique was employed to evaluate the sign and magnitude of nonlinear refractive index and nonlinear absorption coefficient using a continuous wave laser at 632.8nm as light source. Enhancement in the third order nonlinear optical properties was were noted due to electron beam irradiation. Tailoring the physical and NLO properties by electron beam, the FZO thin films becomes a promising candidate for various optoelectronic applications such as phase change memory devices, optical pulse compression, optical switching and laser pulse narrowing.

Nanoscale cross-point diode array accessing embedded high density PCM

The main bottlenecks in the development of current embedded phase change memory (PCM) technology are the current density and data storage density. In this paper, we present a PCM with 4F2 cross-point diode selector and blade-type bottom electrode contact (BEC). A blade TiN BEC with a cross-sectional area of 630 nm2 (10 nm × 63 nm) reduces the reset current down to about 750 μA. The optimized diode array could supply this 750 μA reset current at about 1.7 V and low off-current 1 × 10−4 μA at about −5.05 V. The on-off ratio of this device is 7.5 × 106. The proposed nanoscale PCM device simultaneously exhibits an operation voltage as low as 3 V and a high density drive current with an ultra small cell size of 4F2 (108 nm × 108 nm). Over 106 cycling endurance properties guarantee that it can work effectively on the embedded memory.

Synthesis of SnSe2 thin films by thermally induced phase transition in SnSe

The synthesis of SnSe2 thin films, for phase change memory applications, generally require selenization and higher temperature. However, there are many critical problems associated with selenization, such as use of highly toxic H2Se/Se gas at high temperature, slow reaction rate and non-uniform composition of thin films. To overcome these problems, a novel and relatively low temperature synthesis of SnSe2 thin films has been reported here. Selenium rich Sn30Se70 (prepared by melt quenching technique) has been thermally evaporated in presence of Ar followed by vacuum annealing at 200 °C. An attempt has been made to elucidate the structural, optical and electrical properties of these thin films. X-ray diffraction and UV–Vis studies confirmed a phase change from orthorhombic SnSe to hexagonal SnSe2 followed by improvement in crystallinity (from ≈5 nm to 15 nm) and a red shift in optical band gap on annealing. Electrical studies revealed that SnSe phase have single thermal and photo activation energies in temperature range from −20 °C to 100 °C. A large contrast (four orders) in dark-conductivity [(3.19 ± 0.02) × 10−5Ω−1cm−1 to (5.16 ± 0.02) × 10−1Ω−1cm−1] between two phases of Sn30Se70, suggests its use in phase change memory devices. The SnSe2 phase is observed to be highly stable in the presence of visible light as compared to SnSe.

A weak electric field-assisted ultrafast electrical switching dynamics in In3SbTe2 phase-change memory devices

Prefixing a weak electric field (incubation) might enhance the crystallization speed via pre-structural ordering and thereby achieving faster programming of phase change memory (PCM) devices. We employed a weak electric field, equivalent to a constant small voltage (that is incubation voltage, Vi of 0.3 V) to the applied voltage pulse, VA (main pulse) for a systematic understanding of voltage-dependent rapid threshold switching characteristics and crystallization (set) process of In3SbTe2 (IST) PCM devices. Our experimental results on incubation-assisted switching elucidate strikingly one order faster threshold switching, with an extremely small delay time, td of 300 ps, as compared with no incubation voltage (Vi = 0 V) for the same VA. Also, the voltage dependent characteristics of incubation-assisted switching dynamics confirm that the initiation of threshold switching occurs at a lower voltage of 0.82 times of VA. Furthermore, we demonstrate an incubation assisted ultrafast set process of IST device for a low VA of 1.7 V (∼18 % lesser compared to without incubation) within a short pulse-width of 1.5 ns (full width half maximum, FWHM). These findings of ultrafast switching, yet low power set process would immensely be helpful towards designing high speed PCM devices with low power operation.

The investigations of characteristics of Sb2Te as a base phase-change material

Chalcogenide alloys are paid much attention in the study of nonvolatile phase-change memory (PCM). A comprehensive research is investigated on Sb2Te (ST), a base material, from properties to performances in this paper. For the characteristics of ST films, the sheet resistance is extremely stable during cooling process in resistance-temperature measurement and the thickness change of ST film is 5.7%. However, low 10-year data retention temperature (∼55°C) and large crystal grain are the demerits for ST. In addition, the structure characteristics show stable hexagonal phase and large grain of several hundred nanometers at crystalline state after annealing. As for electrical properties, although the ST-based PCM devices are characterized by fast operation speed of ∼20ns, only about 8×103 times of stable operation cycles can be obtained. After that, the endurance performance deteriorates gradually due to the growth of grains. About resistance drift, the drift coefficients are very small both in crystalline state and in amorphous state.

Stability of Sb<sub>2</sub>Te Crystalline Films for Phase Change Memory

Stability is one of the most important criterions to judge the quality of products, especially for the phase-change memory (PCM), which is regarded as the most promising candidate for next-generation non-volatile memory. Due to the lack of resistance stability, read errors can occur easily and the reliability of PCM will be influenced. Using Sb2Te as a base material, the resistance stability of Sb2Te was studied, and the results indicated that in the whole cooling process, the resistance of Sb2Te crystalline film was extremely steady under different annealing temperatures and different cooling rates. To unravel the reason why the resistance of Sb2Te crystalline film has good stability, further study was carried out and the results showed that there was no new diffraction peak in the XRD pattern, and the HRTEM images showed the similar hexagonal phase for the films under different annealing temperatures. Moreover, it was observed that the resistance in Sb2Te-based PCM device was still stable for crystalline state and amorphous state. These results revealed that the stability of Sb2Te crystalline films at a micro level and the stability of microscopic structure resulted in the stability of resistance. Therefore, based on the present study, the stability of phase-change material Sb2Te can be applied to exploit more reliable PCM for near-future application.