Inverse heat conduction problem in a phase change memory device

Abstract

An invers heat conduction problem is solved considering the thermal investigation of a phase change memory device using the scanning thermal microscopy. The heat transfer model rests on system identification for the probe thermal impedance and on a finite element method for the device thermal impedance. Unknown parameters in the model are then identified using a nonlinear least square algorithm that minimizes the quadratic gap between the measured probe temperature and the simulated one.