Peripheral Chip Research Articles

The tradeoff between peripheral and area array bonding of components in multichip modules

This paper examines the tradeoff between peripheral I/O format die (for wirebonding, tape automated bonding (TAB), or peripheral flip chip bonding) and area array I/O format die (for flip chip bonding), as a function of partitioning a fixed functionality into a variable number of die. The comparison in this study has been made in the context of a multichip module (MCM). The analysis approach used concurrently considers module size, thermal and electrical performance, and cost (including module-level test and rework) to assess the overall applicability of one bonding format over the other.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">&gt;</ETX>

Surface mounting of very fine pitch components: a new challenge

Based on their experience in developing and using 16 and 12.5 mils peripheral pitch custom compact single chip packages, the authors analyze the evolution and today's limits of package and board technologies and assembly techniques, with emphasis on manufacturability. The authors present their manufacturing approach and quality and reliability results when using 16 and 12.5 mils peripheral ceramic leaded packages. A detailed analysis of packaging processes and limitations is performed for high pin count ceramic and plastic packages. Competitive packaging methods, pin grid arrays, land grid arrays, and tape automated bonding are compared, and trends for the future are analyzed. >

How to select a microcontroller

A set of guidelines for the designer to use as a checklist for evaluating candidate devices is given. The first decision examined is the level of performance required, that is, on the word size of the controller. The second step is to identify the quantity, frequency, and type of all input/output (I/O) signals, as well as any other special requirements, including those imposed by mechanical aspects of the system. The third consideration is the application's memory requirements, which should be further broken down into program memory and data memory. Mapping I/O peripherals and the choice of single-chip or expanded are discussed. The feature-selection process is addressed, stressing that an absolute match between requirements and features is not necessary, since minor alterations to the requirements or the addition of a peripheral chip could create the most cost-effective solution from a less-than-perfect pairing.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">&gt;</ETX>

A microprocessor controlled programmable switching module for phased array applications

An Intel 8085 microprocessor-based algorithm is presented to provide programmable switching for p-i-n diodes that can be interfaced with an 8225 programmable peripheral interface chip. This can be useful in the realization of phased array in which p-i-n diode switching modules are to be switched ON/OFF according to a certain desired pattern in the time domain. >

Application of ASIC-Technology to Mechatronics Control: Development of the Flexible Servo Peripheral Chip

AbstractIn order to identify the state-of-the-art technology for applying micro-electronics to mechatronics control for advanced factory automation, a user oriented micro-electronics development technology, which is referred to as “ASIC-technology, has been discussed and evaluated by developing a compact Flexible Servo System. A three-chip integration approach of the Flexible Servo System has been pioposed and one of the three chips has been designed and actually fabricated by using a gate array technology. The methodologies of design, fabrication and testing have been established using advanced design and test automation tools so that even the user can design and fabricate “semi-custom” or “full-custom” semiconductors based on their own needs. This paper contributes to the rather advanced application oriented knowledge of micro-electronics technology for mechatronics control systems.

Using the MC68901 multifunction peripheral

First-generation microprocessor peripheral chips were each dedicated to specific functions (e.g. serial interface, parallel interface, timer). Some of today's peripherals are designed to carry out a wide range of functions. The 68901 multifunction peripheral (MFP), for example, combines the functions of a serial interface, a parallel interface, a timer and an interrupt generator. It is not possible to go into detail about the MFP here — its data manual is the size of a small book. Instead, this note illustrates the design of a complete single-board microcomputer built around the 68901 and the 68008 microprocessor.

A High Speed High Resolution Contact Line Imager Using Amorphous Silicon Alloy Pin Diodes

AbstractWe report the development of a very high speed high resolution contact line imager using amorphous silicon alloy PIN diodes both as photosensing elements and as isolation diodes in the multiplexing scheme. High speed is achieved by reading the integrated photocurrent in 8μsec and using current integration times less than Imsec. For 200 dots/inch, the scan speed at an illumination of 5×10−4W/cm2 is over 1000 lines/sec. This allows the reading of an A4 (8½″×11″) page in less than 2.0 sec. At this light level, the signal to noise ratio is greater than 40dB. The photosensor array can be used in the true direct contact mode and the multiplexed addressing scheme gives a substantial reduction in the number of peripheral IC chips necessary for operation.

Microprocessor Based Digital Mach Meter

The Mach number is expressed as a non-linear function in terms of total and static pressures and the ratio of specific heats. The accuracy arid increased computational speed in this real time processing score over the conventional methods of treasuring the Mach number. A scheme has been arrived at, to calculate the Mach number using Intel 8085 microprocessor and its associated peripheral chips. The system takes the total and static pressures as analog inputs, determines the Mach number using the look up table am displays it on a seven segment display.

Chip supplies to grow

The article looks at the manufacture and supply of memory, microprocessor and peripheral chips by Japanese and US companies and points out that the present chip shortage may become a glut by 1986. Future techniques for chip production are also briefly examined.

An 8-channel neuron recording interface for a microcomputer (apple II), designed to gather spike occurrence times

A microcomputer interface card is described, using a standard peripheral interface adapter chip, for use in multi-channel extracellular single unit recording. The design is for the Apple II. The card sends an interrupt signal to the processor whenever a pulse arrives to it, and enables the computer to read out which of 8 possible channels brought the pulse and when.

Peripheral controller chip ties into 8- and 16-bit systems: J. Banning and P. Lin Electronics p.143 (1980)

Peripheral controller chip ties into 8- and 16-bit systems: J. Banning and P. Lin Electronics p.143 (1980)

Peripheral chips shift microprocessor systems into high gear: John G. Posa Electronics p. 93 (16 August 1979)

Peripheral chips shift microprocessor systems into high gear: John G. Posa Electronics p. 93 (16 August 1979)

Peripheral chips shift microprocessor systems into high gear : John G. Posa. Electronics p. 93 (16 August 1979)

Peripheral chips shift microprocessor systems into high gear : John G. Posa. Electronics p. 93 (16 August 1979)

An inexpensive microprocessor development system

For engineers accustomed to designing with large scale integrated logic the step to microprocessors is one of attitude, not to say emotion, rather than one of technical competence. As with any new family of devices it is difficult for the newcomer to decide between the relative merits of the various microprocessors each with its different features and trade-offs and this difficulty is compounded by the fact that to evaluate any microprocessor system not only must the actual chip be bought but the bill must also include the relevant peripheral chips and some form of software system to loud, run and examine programs. This may range from the expensive full-blown simulator to the ROM containing teletype routines that is sold with the cheaper evaluation kits. One factor these systems have in common is the teletype. If microprocessor development work is taking place in an electronics laboratory as opposed to a computer orientated environment the teletype is not always available and it becomes an extra hidden cost in the system. This paper describes a system with which microprocessor development work can be carried out—programs written and run in real time without using a teletype. The system is based on an Intel 4040 microprocessor but most of its elements, the reprogrammable memory, the output/display module and the input module are not specific to a microprocessor and can be used with many other processors with little or no adaption. The system consists of five elements: the microprocessor, program memory (PROM simulator), bus monitor, output/display module, and input module.