Abstract
AbstractWe report the development of a very high speed high resolution contact line imager using amorphous silicon alloy PIN diodes both as photosensing elements and as isolation diodes in the multiplexing scheme. High speed is achieved by reading the integrated photocurrent in 8μsec and using current integration times less than Imsec. For 200 dots/inch, the scan speed at an illumination of 5×10−4W/cm2 is over 1000 lines/sec. This allows the reading of an A4 (8½″×11″) page in less than 2.0 sec. At this light level, the signal to noise ratio is greater than 40dB. The photosensor array can be used in the true direct contact mode and the multiplexed addressing scheme gives a substantial reduction in the number of peripheral IC chips necessary for operation.
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