Package Interface Research Articles

A Novel Fake-News Dataset and Detection System to Mitigate Cyber War with Emphasis on Nigerian News Events

Fake-news refers to a cyber-weapon launched through the social media, as, its consequence can result to the breakdown of law and order in the society both physically and on the cyber-social-space. In Nigeria, there is currently no established law that guides the use of social media. Therefore, the rate at which fake-news propagates is alarming. This paper presents a new dataset, with focus on Nigeria’s trending news such as EndSARS and Herdsmen attacks, which was further used to simulate Convolutional Neural Network (CNN) and Recurrent Neural Network (RNN) machine learning models to detect fake-news. The data were extracted from twitter using twitter Application Package Interface (API) and from facebook using a scraping tool. The dataset was encoded using Unicode escape function in python to make all characters accessible by the algorithm and tokenised using Global Vectors for Word Representation. The dataset was used to train CNN and RNN models built in python on google colab platform to detect fake-news using accuracy, sensitivity, recall and F1 score as evaluation metrics. Results showed that RNN performed better in terms of accuracy and precision, at 82.34% and 93.19% compared to 81.96% and 79.65% for CNN, F1 scores are approximately the same for both models and CNN performed better than RNN in terms of recall at 98.03% to 50.61% for RNN.

Advanced Cu/Polymer Hybrid Bonding System for Fine‐Pitch 3D Stacking Devices

Hybrid bonding enables the commercialization of ultra‐fine pitch high‐density 3D packages. Cu/SiO2 hybrid bonding is the standard packing interface recently introduced in the industry. Herein, the Cu/polymer hybrid bonding interface beyond Cu/SiO2 is proposed in order to have high compatibility for additional processes in the future. Ideally, polymers can provide excellent bonding strength and low permittivity, enabling high‐speed signal transmission with high reliability. To realize it, optimum polymer and additives selection and polymer bonding processing development are needed to get the desired packaging interface. Therefore, detailed materials and processing challenges are discussed to realize the successful Cu/polymer hybrid bonding. Then, the authors’ preliminary results are suggested to supplement the feasibility of the emerging bonding technology.

GAHP: An integrated software package on genetic analysis with bi-parental immortalized heterozygous populations.

GAHP is a freely available software package for genetic analysis with bi-parental immortalized heterozygous and pure-line populations. The package is project-based and integrated with multiple functions. All operations and running results are properly saved in a project, which can be recovered when the project is re-open by the package. Four functionalities have been implemented in the current version of GAHP, i.e., 1) MHP: visualization of genetic linkage maps; 2) VHP: analysis of variance (ANOVA) and estimation of heritability on phenotypic data; 3) QHP: quantitative trait locus (QTL) mapping on both genotypic and phenotypic data; 4) SHP: simulation of bi-parental immortalized heterozygous and pure-line populations, and power analysis of QTL mapping. VHP and QHP can be conducted in individual populations, as well as in multiple populations by the combined analysis. Input files are arranged either in the plain text format with an extension name same as the functionality or in the MS Excel formats. Output files have the same prefix name as the input file, but with different extensions to indicate their contents. Three characters before the extension names stand for the types of populations used in analysis. In the interface of the software package, input files are grouped by functionality, and output files are grouped by individual or combined mapping populations. In addition to the text-format outputs, the constructed linkage map can be visualized per chromosome or for a number of selected chromosomes; line plots and bi-plots can be drawn from QTL mapping results and phenotypic data. Functionalities and analysis methods available in GAHP help the investigation of genetic architectures of complex traits and the mechanism of heterosis in plants.

Colour schemes to reduce stress response in the hygiene area of a space station: A Delphi study

This paper aims to explore colour schemes to reduce stress response in the hygiene area of a space station. We conducted a two-stage exploratory Delphi-study with 30 international experts. It was found that the overall environment, stool-urine collection device, garbage collection interface and negative pressure package interface of the hygiene area most affected astronauts’ experience. Remarkably, experts have highest visual requirements for the cleanliness of the overall environment and for stool and urine collection devices in the hygiene area. These tend to have low saturation and low blackness colours, while the garbage collection interface and negative pressure package interface have conspicuity and discernibility visual requirements. It was found that experts tend to choose high saturation and high brightness colours.

EPIDEMIOLOGICAL CHARACTERISTICS OF FEMALE BREAST CANCER PATIENTS OF SAURASTRA REGION OF GUJARAT-A HOSPITAL BASED STUDY

With the increase in adoption of westernization and sedentary life style in low- and middle-income countries like India, there is a significant increase in breast cancer incidence rate. The exact cause of breast cancer is yet unknown and there are limited studies available on the risk factors associated with breast cancer. Thus, this research work is carried out with an aim to study the region-specific contributing risk factors playing role in breast cancer incidence and their prognosis. We also aimed to study rural-urban disparity in risk factors associated with female breast cancer patients of Saurastra region of Gujarat. This Cross Sectional, Single-Centre, Hospital-based study was conducted in Cancer Hospital at Rajkot, Gujarat India. One-to-one In-person interview of total 174 primary breast cancer patients were carried out and details were collected in pre-tested structured questionnaire. Data obtained from the patients were further analysed using Bürkner’s BRMS package (R) interface and SPSS. In our study, majority of patients are from rural background and its subsequent relationship with other relevant parameters is found to be significant (p less than 0.03). The age of patients ranged from 22 to 76 years and the mean age at diagnosis of the breast cancer was 51.5 years. A positive association is observed between risk of breast cancer and BMI for both pre- and post-menopausal rural and urban women. 37% females were having premenopausal status and 62% females were postmenopausal. Out of total postmenopausal patients, 31% had attained late menopause at the age of 51 years, while 13% females had experienced menarche at less than 12 years of age. Our data is first of its kind studying risk factors playing role in breast cancer incidence in Saurashtra region of Gujarat. Even though having limited patients representing the population this region-specific study is useful for cancer projection and to understand treatment modalities.

Solder Joint Reliability Modeling of WLP and FOWLP with Crack Path Evaluation Method under Thermal Cycling

Abstract An updated solder joint reliability (SJR) modeling methodology under thermal cycling (TC) is proposed and implemented for the diagonal solder crack path case as well as the SJR correlation of wafer-level package (WLP) and fan-out wafer-level package (FOWLP) data, which have the conventional solder failure mode around the under-bump metallization (UBM). First, two critical element layers near by the UBM layer and the printed circuit board (PCB) Cu pad are defined as the percentage of the total solder height in order to differentiate the critical element size around the UBM and the PCB Cu pad. Secondly, a crack path evaluation (CPE) method is developed for the gradual selection of the elements from the highest creep strain energy density (SED) value up to the predefined volume. The conventional solder crack path at the package interface or the diagonal solder crack path can be analyzed depending on the package technology because the critical solder elements are selected depending on the SED level and the failure path. The proposed SJR modeling method successfully demonstrates the diagonal solder crack path selection and further improves the SJR correlation of WLP and FOWLP.

Stability Performance Analysis of Various Packaging Materials and Coating Strategies for Chronic Neural Implants under Accelerated, Reactive Aging Tests.

Reliable packaging for implantable neural prosthetic devices in body fluids is a long-standing challenge for devices’ chronic applications. This work studied the stability of Parylene C (PA), SiO2, and Si3N4 packages and coating strategies on tungsten wires using accelerated, reactive aging tests in three solutions: pH 7.4 phosphate-buffered saline (PBS), PBS + 30 mM H2O2, and PBS + 150 mM H2O2. Different combinations of coating thicknesses and deposition methods were studied at various testing temperatures. Analysis of the preliminary data shows that the pinholes/defects, cracks, and interface delamination are the main attributes of metal erosion and degradation in reactive aging solutions. Failure at the interface of package and metal is the dominating factor in the wire samples with open tips.

Effect of (Ni, Au)3Sn4 growth on the thermal resistance of Au-20 wt% Sn solder/ENIG joint in flip-chip LED packages

In this study, the effect of growth of intermetallic compound (IMC) layer between Au-20 wt% Sn solder and electroless Ni/immersion Au (ENIG) on the thermal resistance of a flip-chip (FC) light emitting diode (LED) package was investigated. Two IMC layers were formed at the interface of FC LED package, including Au5Sn and (Ni, Au)3Sn4 that were identified using a transmission electron microscopy. A thermal aging test was carried out at 200 °C for 1000 h to observe IMCs growth. After 1000 h, the (Ni, Au)3Sn4 thickness increased to about 1.5 μm and the thermal resistance of the FC LED package increased by 3.5 times compared to the initial thermal resistance of 2 K W−1. As the (Ni, Au)3Sn4 grew, a calculation of thermal resistance also increased comparing to the initial aging test, thus, the growth of (Ni, Au)3Sn4 layer can be effective factor on the increase of thermal resistances of FC LED package.

Reliability-Aware 3-D Clock Distribution Network Using Memristor Ratioed Logic

A novel reliability-aware clock distribution network clock distribution network in a 3-D I/O interface packaging integrating memristor ratioed logic (MRL) is presented. An evolutionary algorithm has been employed to obtain the optimal reliability tradeoffs and the placement of the intertier clock delivery network. To improve the signal integrity, to increase the power efficiency, and to decrease the clock noise, through-silicon vias transfer the clock along with the power/ground links in a symmetric-centroid arrangement. The proposed reliability-aware 3-D packaging clock distribution network (CDN) can significantly decrease the clock skew/jitter and propagation delay, increase the energy efficiency, and improve the signal quality of the whole aged system. The proposed on-chip 3-D CDN architecture is analyzed and designed using a 65-nm CMOS technology at 1.0 V. The results show that the reliability and power efficiency of the proposed CDN with optimization has been significantly improved for a 15-year aged circuit. Moreover, the clock latency and the total power consumption of the proposed MRL-based CDN are improved around 10% and 22%, respectively, under process, voltage, and temperature variations.

Integrated Point of Sales and Snack Vending Machine based on Internet of Things for Self Service Scale Micro Enterprises

Sales management is a key function which helps small and medium size enterprises (SMEs) in monitoring and tracking stock and co-ordinate transaction processing. Point of Sales developed to support sales management for scale micro enterprises. While self-service applications from banking, to travel, to foodservice, to ticketing, to hotels are booming, many have forgotten that the original self-service applications were in the vending industry. Selfservice has evolved into an operational mode that no longer should be viewed as merely a device-based channel for selling snacks and beverages. The aim of this research integrates point of sales and vending machine based on internet of Things (IoT) for self-service scale micro enterprise. Applications that record while sending data from multiple sensors. Data that records sensors sent through the IoT module to the server, then the server will save the data in a server database. Periodically new data will be visualized in the system through server application is a service. Real-time sales recapitulation system through a vending machine IoT for 24 hours. After being developed and implemented 24 hours machine will embedded by Internet of Thing (IoT) module. Through this all operational forms of the system are good in the form of stock, recapitulation of sales made by the vending machine and the latest conditions vending machines will be sent to the server so that users can monitor them at any time system. In addition to the profit-taking report, items can be recorded by the system. Owner outlets can remotely controlling vending machines via mobile phones because they are connected to server API (Application Package Interface) to the server application.

Reivew of silicon photonic switches

Silicon photonic switch is recognized as a cost-effective optical switching technology because it has many applications in long-haul telecommunication networks, short-reach data center and high-performance computing. In this paper, the research progress of various silicon photonic switch technologies is reviewed systematically. Firstly, the principles of three kinds of switch technologies including Mach-Zehnder interferometer (thermo-optic and carrier-injection types), micro-ring resonator (thermo-optic and carrier-injection types) and micro-electro-mechanical-system actuated waveguide coupler (electrostatic actuated type) are introduced. The switch technologies with the state-of-the-art insertion loss, crosstalk, switch time, footprint and power consumption are summarized and compared. Then the recent demonstrations of large-port silicon photonic matrix based on the above switch technologies are discussed. In this paper, we also investigate the key technologies such as topological architecture, passive components and optoelectronic packaging, which affect the performance of large-port optical switch matrix. Specifically, we study the scalability of various topologies, low-loss/broadband waveguide components, high-density optical/electrical packaging and control interface to improve the overall performance of the silicon photonic switch matrix. Finally, we discuss the critical technical challenges that might hamper the commercialization of silicon photonic switches and envision their future.

Multi-chip module integration of Hybrid Silicon CMOS and GaN Technologies for RF Transceivers

Digital transceiver architectures offer the potential for achieving wireless hardware flexibility to frequency and modulation scheme for future-generation communications systems. Additionally, digital transmitters lend themselves to the use of switch-mode power amplifiers, which can have significantly higher efficiency than their linear counterparts. Two proposed architectures for realizing digital transmitters will be described in this work, both of which employ a hybrid combination of silicon integrated circuits (IC) and a power technology (e.g. GaN). This hybrid architecture takes advantage of the silicon to implement the high-complexity signal processing required for wireless communications, and uses power devices with high power density and low parasitic capacitance to sufficiently amplify the RF signals for transmission. Unfortunately, interfacing the low-power RF switching signals with off-chip high-power devices poses numerous design challenges, including: generation of integrated silicon power drivers with sufficient voltage swing for controlling power devices such as GaN, mitigation of on-chip current transients, wideband assembly interface from the silicon IC to the power device, and full system design verification using multiple process technologies. This work presents two CMOS driver architectures that can be used to interface low-power CMOS processing circuits with off-chip high-power devices. This work also details the performance limitations when assembling and interfacing multiple process technologies that are not co-located on the same IC. The main function of the driver circuitry within the digital transceiver system is to interface the low-power digital modulator to a large, high capacitance, off-chip power device. The driver must provide adequate transient current to charge/discharge the off-chip power devices' input capacitance through parasitic routing. Furthermore, the driver is designed to exhibit rise/fall times of less than 5% of the switching period and low jitter to meet RF signal quality requirements. Since silicon process technologies typically have much lower voltage breakdowns than those required to drive a power devie (e.g. GaN device), special driver architectures must be implemented to ensure the CMOS devices never exceed their breakdown voltages. Two architectures were implemented within this work to simultaneously achieve RF switching speeds and 5V signal swing from a 0.9V silicon CMOS process technology. The two architectures are: 1) a House-of-Cards configuration, and 2) a Cascode topology. These architectures will be detailed and compared with respect to performance in this presentation. Two of the most common techniques to assemble and connect a silicon IC, which includes the driver circuitry, and a (GaN) power device are: 1) direct wire bonding or flip-chip connection from the IC to the GaN, and 2) connection through a board or package interface circuit. Since most high-performance RF power devices such as GaN have negative threshold voltage, the driver (CMOS) IC must either: 1) have a supply and ground that are shifted to negative voltage values, or 2) decouple the IC's output from the GaN device's input in order to properly control the GaN. Off-chip decoupling is more easily implemented, but may limit maximum operating frequencies due to the added interface network and board/module parasitics. This work shall detail the interface models and compare the assembly procedures and potential performance limits when using both of these most common assembly techniques.

X-ray Advances in Support of Advanced Packaging – Today and Tomorrow

Abstract As advanced packaging continues to develop to support novel and emerging technologies, the need for, ideally non-destructive, test and inspection continues to be vital to ensure the quality and assurance of functionality, wherever the package may go. This is made ever more difficult as the package complexity increases, whilst the feature sizes within continue to decrease. X-ray technology has long been an important part of the non-destructive inspection protocol over the history of advanced packaging and will continue to need to play a more important part in the future. This paper will review the advances made in both 2D and 3D X-ray inspection over recent years and the new opportunities that are now starting to be available, especially in 3D, or CT, inspection, that will enable this 120-year-old technology to remain relevant to and supportive of the needs of advanced packaging. To highlight the above, a case study will be presented on the faults that 2D and CT X-ray analysis can find in LEDs during their manufacture. LEDs are a good example of the remarkable developments in packaging and technology over the last 20 years, where the use of higher powers, smaller sized features and increased reliability requirements intensify the need for higher quality, more consistent production output. Flaws cannot be accepted, especially as higher usage powers mean higher operating temperatures which, in turn, then requires very good thermal conductivity in the package to move heat away from key areas. Without good heat dissipation then heat stresses at the interfaces can cause delamination or die fractures, so reducing LED lifetimes. The presence of voids, particularly at the die to package interface, creates air gaps that reduces heat transfer efficiency. As many LEDs are potted, or encapsulated, the only non-destructive test option to check for voiding and other faults is by using 2D and CT X-ray analysis.

Bio-inspired Edible Superhydrophobic Interface for Reducing Residual Liquid Food.

Significant wastage of residual liquid food, such as milk, yogurt, and honey, in food containers has attracted great attention. In this work, a bio-inspired edible superhydrophobic interface was fabricated using U.S. Food and Drug Administration-approved and edible honeycomb wax, arabic gum, and gelatin by a simple and low-cost method. The bio-inspired edible superhydrophobic interface showed multiscale structures, which were similar to that of a lotus leaf surface. This bio-inspired edible superhydrophobic interface displayed high contact angles for a variety of liquid foods, and the residue of liquid foods could be effectively reduced using the bio-inspired interface. To improve the adhesive force of the superhydrophobic interface, a flexible edible elastic film was fabricated between the interface and substrate material. After repeated folding and flushing for a long time, the interface still maintained excellent superhydrophobic property. The bio-inspired edible superhydrophobic interface showed good biocompatibility, which may have potential applications as a functional packaging interface material.

Early stages of localized recrystallization in Pb-free BGA solder joints subjected to thermomechanical stress

This study quantitatively characterized the grain orientation evolution of Sn3.0Ag0.5Cu ball grid array (BGA) solder joints subjected to thermomechanical stress using electron backscatter diffraction (EBSD). Further polishing of the as-reflowed solder joint cross sections was avoided after thermal shock treatment to accurately analyze the underlying mechanism of recrystallization. No previous reports have been presented on this topic because of the inability to conduct pattern indexing due to cross-sectional contamination after thermomechanical fatigue. The results show that the pre-existing low-angle boundaries in the as-reflowed joints tend to gradually increase in misorientation and that low-angle boundaries inhomogeneously increase mainly by the cross-slip and climb of dislocations. Recovery tends to occur at the pre-existing low-angle boundaries in the as-reflowed joints and the regions in the solder joints near the package interface composed of a single grain, and there is a partial release of stored energy prior to recrystallization. However, the residual stored energy remains sufficiently high to induce subsequent recrystallization in the deformed solder alloy after subgrain formation. The transition process from subgrains to recrystallized grains is continuous, and subgrains appear before the formation of recrystallized grains in the Pb-free solder joints subjected to thermomechanical stress. The orientations of the small recrystallized grains separated by the low-angle boundaries evolve from the initial orientations by subgrain rotation. Additionally, the subgrain rotation behavior of Pb-free solder joints was investigated in terms of the rotation axis and angle. The results show that there is typically a single rotation axis for each subgrain in the early stages of recrystallization. This finding confirms the interrelationship between the activated β-Sn slip systems and the process of recrystallization in Pb-free solder joints.

Analysis and optimisation of a mixed fluid cascade (MFC) process

A mixed fluid cascade (MFC) process that comprises three refrigeration cycles has great capacity for large-scale LNG production, which consumes a great amount of energy. Therefore, any performance enhancement of the liquefaction process will significantly reduce the energy consumption. The MFC process is simulated and analysed by use of proprietary software, Aspen HYSYS. The effect of feed gas pressure, LNG storage pressure, water-cooler outlet temperature, different pre-cooling regimes, liquefaction, and sub-cooling refrigerant composition on MFC performance are investigated and presented. The characteristics of its excellent numerical calculation ability and the user-friendly interface of MATLAB™ and powerful thermo-physical property package of Aspen HYSYS are combined. A genetic algorithm is then invoked to optimise the MFC process globally. After optimisation, the unit power consumption can be reduced to 4.655kWh/kmol, or 4.366kWh/kmol on condition that the compressor adiabatic efficiency is 80%, or 85%, respectively. Additionally, to improve the process further, with regards its thermodynamic efficiency, configuration optimisation is conducted for the MFC process and several configurations are established. By analysing heat transfer and thermodynamic performances, the configuration entailing a pre-cooling cycle with three pressure levels, liquefaction, and a sub-cooling cycle with one pressure level is identified as the most efficient and thus optimal: its unit power consumption is 4.205kWh/kmol. Additionally, the mechanism responsible for the weak performance of the suggested liquefaction cycle configuration lies in the unbalanced distribution of cold energy in the liquefaction temperature range.

Simcausal R Package: Conducting Transparent and Reproducible Simulation Studies of Causal Effect Estimation with Complex Longitudinal Data.

The simcausal R package is a tool for specification and simulation of complex longitudinal data structures that are based on non-parametric structural equation models. The package aims to provide a flexible tool for simplifying the conduct of transparent and reproducible simulation studies, with a particular emphasis on the types of data and interventions frequently encountered in real-world causal inference problems, such as, observational data with time-dependent confounding, selection bias, and random monitoring processes. The package interface allows for concise expression of complex functional dependencies between a large number of nodes, where each node may represent a measurement at a specific time point. The package allows for specification and simulation of counterfactual data under various user-specified interventions (e.g., static, dynamic, deterministic, or stochastic). In particular, the interventions may represent exposures to treatment regimens, the occurrence or non-occurrence of right-censoring events, or of clinical monitoring events. Finally, the package enables the computation of a selected set of user-specified features of the distribution of the counterfactual data that represent common causal quantities of interest, such as, treatment-specific means, the average treatment effects and coefficients from working marginal structural models. The applicability of simcausal is demonstrated by replicating the results of two published simulation studies.

Efficient implementation of constant pH molecular dynamics on modern graphics processors.

The treatment of pH sensitive ionization states for titratable residues in proteins is often omitted from molecular dynamics (MD) simulations. While static charge models can answer many questions regarding protein conformational equilibrium and protein-ligand interactions, pH-sensitive phenomena such as acid-activated chaperones and amyloidogenic protein aggregation are inaccessible to such models. Constant pH molecular dynamics (CPHMD) coupled with the Generalized Born with a Simple sWitching function (GBSW) implicit solvent model provide an accurate framework for simulating pH sensitive processes in biological systems. Although this combination has demonstrated success in predicting pKa values of protein structures, and in exploring dynamics of ionizable side-chains, its speed has been an impediment to routine application. The recent availability of low-cost graphics processing unit (GPU) chipsets with thousands of processing cores, together with the implementation of the accurate GBSW implicit solvent model on those chipsets (Arthur and Brooks, J. Comput. Chem. 2016, 37, 927), provide an opportunity to improve the speed of CPHMD and ionization modeling greatly. Here, we present a first implementation of GPU-enabled CPHMD within the CHARMM-OpenMM simulation package interface. Depending on the system size and nonbonded force cutoff parameters, we find speed increases of between one and three orders of magnitude. Additionally, the algorithm scales better with system size than the CPU-based algorithm, thus allowing for larger systems to be modeled in a cost effective manner. We anticipate that the improved performance of this methodology will open the door for broad-spread application of CPHMD in its modeling pH-mediated biological processes. © 2016 Wiley Periodicals, Inc.

Modified single cantilever adhesion test for EMC/PSR interface in thin semiconductor packages

We propose and implement an adhesion test configuration called “modified single cantilever adhesion test” (M-SCAT) that can be employed to determine the adhesion strength of epoxy molding compound (EMC) and photo solder resist (PSR) interface in thin semiconductor packages. The proposed M-SCAT method is optimal for quick and quantitative in-situ testing of the interface with strong adhesion as sample preparation and testing are simple while maintaining a low mode mixity at the crack tip. Detailed sample preparation and experimental testing to determine the critical load required for delamination are presented. A numerical procedure is followed to assess the stress and strain fields around the crack tip at the point of delamination, thus allowing for the J-integral method to be employed to determine the critical energy release rate. The proposed approach is carried out for two different EMC/PSR interfaces. The results show excellent repeatability, which allows for the test method to be used effectively to select the most ideal material set for given applications.

An overview of the computer-integrated systems and manufacturing technologies of pistons of internal combustion engines

The technological features of manufacture of pistons of internal combustion engines (ICE) taking into account the operational characteristics that form the functional requirements of the piston material are considered. It is shown that the chill casting of pistons is recommended for alloys with a low coefficient of linear expansion, and the liquid forging of pistons is preferable to the hot forging since it allows to obtain defect-free, dense billets with the fine structure of the piston material. For the heavy-loaded diesel engine pistons, chill casting is acceptable, provided the maximum possible porosity prevention in massive parts of castings.For the simulation of the casting processes of ICE pistons, it is advisable to use the LVMFlow package since it is focused on the finite-difference computation algorithms, ensuring stable operation of the computational station at a relatively low consumption of its hardware resources, ease of interface, computation speed and low cost of the software package. For the engineering simulation of the thermal and the stress-strain state of the ICE cast pistons, the ANSYS complex that has a high interaction with existing CAD and CAE systems having full interaction with WorkbenchProducts and well-known ANSYS, as well as a large number of mathematical solvers, allowing to quickly and accurately conduct computations in the WorkbenchProducts can be recommended.