Abstract
Reliable packaging for implantable neural prosthetic devices in body fluids is a long-standing challenge for devices’ chronic applications. This work studied the stability of Parylene C (PA), SiO2, and Si3N4 packages and coating strategies on tungsten wires using accelerated, reactive aging tests in three solutions: pH 7.4 phosphate-buffered saline (PBS), PBS + 30 mM H2O2, and PBS + 150 mM H2O2. Different combinations of coating thicknesses and deposition methods were studied at various testing temperatures. Analysis of the preliminary data shows that the pinholes/defects, cracks, and interface delamination are the main attributes of metal erosion and degradation in reactive aging solutions. Failure at the interface of package and metal is the dominating factor in the wire samples with open tips.
Highlights
Implantable microelectronic devices have been widely used in neuroscience and clinical research for manipulating and mapping of neural activities [1,2]
We found that the majority failure mode is delamination and metal erosion that progresses along the interface between the tungsten wire and the packaging layer
We simulated the environments of cortical neural implantation with different degrees of inflammations by adding distinctive concentrations of the reactive chemical
Summary
Implantable microelectronic devices have been widely used in neuroscience and clinical research for manipulating and mapping of neural activities [1,2]. Assessment of long-term device stability provides a better understanding of the underlying factors that cause implant failure or complications [4], but requires a long testing cycle. Various sealing methods [26] and materials [27] have been studied and discussed for many years, the probability of device failure should continue to increase over time, and the failure of the device package is a gradual process. An in-depth understanding of the performance and stability of these insulating materials is meaningful for the future development of chronic implants
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