Package Dimensions Research Articles

Design, Materials, Process, and Fabrication of Fan-Out Panel-Level Heterogeneous Integration

Abstract The design, materials, process, and fabrication of a heterogeneous integration of 4 chips by a FOPLP (fanout panel-level packaging) method are investigated in this study. Emphasis is placed on (a) the application of a dry-film EMC (epoxy molding compound) for molding the chips, and (b) the application of a special assembly process called Uni-SIP (uni-substrate-integrated-package) for fabricating the RDLs (redistribution layers) of the FOPLP. The ABF (Ajinomoto build-up film) is used as the dielectric of the RDLs and is built up by the SAP (semi-additive process). The electroless Cu is used to make the seed layer, the LDI (laser direct imaging) is used for opening the photoresist, and the PCB (printed circuit board) Cu plating is used for making the conductor wiring of the RDLs. The panel dimensions are 508mm × 508mm. The package dimensions of the FOPLP are 10mm × 10mm. The large chip size and the small chip sizes are, respectively 5mm × 5mm and 3mm × 3mm.

Design, Materials, Process, and Fabrication of Fan-Out Panel-Level Heterogeneous Integration

Abstract The design, materials, process, and fabrication of a heterogeneous integration of four chips by a fan-out panel-level packaging (FOPLP) method are investigated in this study. Emphasis is placed on (1) the application of a dry-film epoxy molding compound for molding the chips and (2) the application of a special assembly process called uni-substrate-integrated package for fabricating the redistribution layers (RDLs) of the FOPLP. The Ajinomoto build-up film is used as the dielectric of the RDLs and is built up by the semiadditive process. Electroless Cu is used to make the seed layer, laser direct imaging is used for opening the photoresist, and printed circuit board (PCB) Cu plating is used for making the conductor wiring of the RDLs. The panel dimensions are 508 × 508 mm. The package dimensions of the FOPLP are 10 × 10 mm. The large chip size and the small chip sizes are, respectively, 5 × 5 mm and 3 × 3 mm. The uniqueness of this study is that all the processes are carried out by using the PCB equipment.

Selective attention and information loss in the lab-to-farm knowledge chain: The case of Malawian agricultural extension programs

A multitude of approaches and modalities are available for delivering useful information to rural communities. However, evidence regarding the information efficiency of these modalities is limited, as are studies identifying the mechanisms of potential information loss in the agricultural extension system. In this paper, we assess information efficiency along the knowledge transmission chain from researchers to agricultural extension agents (EAs) to lead farmers (LFs) to other farmers. By asking the same set of questions about a fairly well known technology, pit planting, we construct a measure of knowledge at each node of the knowledge transmission chain. Evidence shows that the majority of information loss happens at the researcher-to-EA link and the EA-to-LF link, and that the loss is potentially caused by teaching failures or by selective attention and learning among both the EAs and the LFs concerning all important details of the technology. Results highlight the need for greater emphasis during training and learning on key dimensions of technology packages that are commonly ignored.

Re-design of apple pia packaging using quality function deployment method

This study was aimed to identify the attributes for premium apple pia packaging, to determine the technical response to be carried out by Permata Agro Mandiri Small and Medium Enterprise (SME) and to design a new apple pie packaging acceptable by the SME. The Quality Function Deployment (QFD) method was employed to improve the apple pia packaging design, which consisted of seven stages in data analysis. The results indicated that whats attribute required by the costumers include graphic design, dimensions, capacity, shape, strength, and resistance of packaging. While, the technical responses to be conducted by the SMEs were as follows: attractive visual packaging designs, attractive colors, clear images and information, packaging size dimensions, a larger capacity packaging (more product content), ergonomic premium packaging, not easily torn, and impact resistant packaging materials. The findings further confirmed that the design of premium apple pia packaging accepted by the SMES was the one with the capacity of ten apple pia or 200 g weight, and with rectangular or beam shape form. The packaging material used was a duplex carton with 400 grammage (g/m2), the outer part of the packaging was coated with plastic and the inside was added with duplex carton. The acceptable packaging dimension was 30 cm x 5 cm x 3 cm (L x W x H) with a mix of black and yellow color in the graphical design.

1.65 mm diameter forward-viewing confocal endomicroscopic catheter using a flip-chip bonded electrothermal MEMS fiber scanner.

We report a 1.65 mm diameter forward-viewing confocal endomicroscopic catheter using a flip-chip bonded electrothermal MEMS fiber scanner. Lissajous scanning was implemented by the electrothermal MEMS fiber scanner. The Lissajous scanned MEMS fiber scanner was precisely fabricated to facilitate flip-chip connection, and bonded with a printed circuit board. The scanner was successfully combined with a fiber-based confocal imaging system. A two-dimensional reflectance image of the metal pattern 'OPTICS' was successfully obtained with the scanner. The flip-chip bonded scanner minimizes electrical packaging dimensions. The inner diameter of the flip-chip bonded MEMS fiber scanner is 1.3 mm. The flip-chip bonded MEMS fiber scanner is fully packaged with a 1.65 mm diameter housing tube, 1 mm diameter GRIN lens, and a single mode optical fiber. The packaged confocal endomicroscopic catheter can provide a new breakthrough for diverse in-vivo endomicroscopic applications.

Appreciating Anonymity: An Exploration of Embarrassing Products and the Power of Blending In

While most research suggests using ostentatious packaging as a strategy to increase sales, using such packaging for embarrassing products can actually decrease purchase intentions. Five studies explore two components of packaging that influence product anonymity and the relationship between anonymity, embarrassment, and purchase intentions. The studies use a variety of methods including one field study, three scenario-based experiments, and one virtual reality video study with a behavioral component. This research contributes to retailing literature by examining the effect of packaging dimensions on product anonymity and the subsequent impact on embarrassment and purchase intentions. We consistently show more anonymously packaged products are perceived as less embarrassing and are more likely to be purchased than less anonymously packaged products. Consumers are able to circumvent undesirable stigmas associated with embarrassing products by selecting products that are more anonymously packaged and positioned in the store. Additionally, increased sales due to product packaging differences are more likely when an embarrassing product is positioned in an aisle versus on an endcap. Promotional incentives, such as coupons, in-store discounts, or bonus buys, can mitigate the negative effect of embarrassment onto purchase intentions. These findings have important implications to our understanding of shopper behavior when threatened with embarrassment.

Thermo-mechanical reliability analysis of a RF SiP module based on LTCC substrate

The RF SiP module based on LTCC substrate has attracted considerable attention in wireless communications for the last two decades. However, the thermo-mechanical reliability of this 3D LTCC architecture has not been well-studied as common as its traditional ceramic package structure. A practical RF SiP module based on LTCC substrate was presented and its thermo-mechanical reliability was analyzed in this paper, with emphasis on the reliability of heat reflow process, the operating state and fatigue of second-level solder joints. The configuration and assembly process of the SiP module were briefly introduced at first, and qualitative analysis was made according to the reliability problem that may occur in the manufacturing process and the operating state. Through FEM simulation, this paper studied the warpage and stress variation of the RF SiP module, as well as parametric studies of some key package dimensions. Solder joint reliability under temperature cycling condition was also analyzed in particular in this paper. The results show that for the heat reflow process and operating state, the maximum warpage is both on the top LTCC substrate, but the maximum stresses are on the outermost solder ball and the kovar column at the corner, respectively. There is a large residual stress on the critical solder ball at the end of the reflow process and the key package dimensions has little effect on it. The thickness of top LTCC substrate has a significant impact on the thermal deformation and thermal stress, followed by the height of kovar columns. The reason for the considerable thermal stress on the kovar column is the non-uniform of temperature distribution. The key to reducing thermal deformation and stress in the operating state is the employment of effective cooling measures. It is found by comparison that the reliability of critical solder joints can be greatly improved by adding suitable underfill.

МАТЕМАТИЧЕСКИЙ АППАРАТ ФОРМИРОВАНИЯ ОБЪЕДИНЕННЫХ ГРУЗОВЫХ ЕДИНИЦ ДЛЯ ТРАНСПОРТИРОВАНИЯ ГРУЗОВ

The article substantiates the need to develop a technique of composing optimum integrated cargo units for piece goods in soft packing according to the integrated circuit "a cargo item - a transport package - a container" in their mutual coordination. The requirements and corresponding mathematical conditions of technological compatibility of transport packages and vehicles have been formulated: maximum use of loading capacity and tonnage of transport packages and vehicles, maximum use of loading capacity of the reloading equipment. Similar mathematical conditions of technological compatibility of containers and vehicles have been defined. Algorithms of carrying out computer analysis work on composing an optimum transport package have been offered: determination of parameters of a consumer (transport) package, an optimum way of location of packages in a transport package and their total number. At the same time there has been taken into account importance to maintain the standards of overall dimensions of a transport package, internal dimensions and loading capacity of a container, characteristics of loaders. The article offers the algorithm defining the rational scheme of locating the formed optimum transport packages in a container: determining net volume of a container, finding optimum placement of transport packages in a container and norms of its loading. There have been considered advantages of the developed techniques and algorithms for carrying out further researches, as well as for practical activities of cargo owners, transport and forwarding companies when planning delivery of cargo parties, forming optimum transport packages directly at manufacturing plants, deciding the best schemes of loading of large-capacity containers with transport packages.

Thermal boundary layer limitations on the performance of micromachined microphones

The extent to which thermal boundary layer effects limit the performance of micromachined microphones is examined. A lumped element network model for a micromachined microphone is presented which includes a ladder network in parallel with the adiabatic back volume compliance to account for the transition of the enclosure from adiabatic to isothermal conditions when the thermal boundary layer becomes large compared to the enclosure dimensions. The thermal correction to the cavity impedance contains a resistive component which contributes thermal-acoustic noise to the system. The model results are compared to measurements taken from commercially available microphone units with various back volume sizes, and the simulated relative noise power contribution of each acoustic noise source is calculated. The impedance of the back volume, including the thermal correction factor, is compared to the adiabatic compliance and the impedance derived from thermoacoustic finite element analysis. It is shown that the noise due to the thermal component of the back volume impedance becomes significant in microphones with small back volumes and effectively sets an upper bound on the signal-to-noise ratio of a microphone of given package dimensions.

Perceptions and attitudes towards the silent salesman

Packaging which is often called as the 'silent salesman' is an important component of marketing. Today, the importance of packaging has risen to such an extent that product packaging is rightly called as the fifth 'P' of marketing mix. This paper identifies consumers' perception and attitude towards various packaging cues on a high impulse, low involvement confectionary product, namely chocolates across a wide range of consumers. Data interpretations using SEM approach indicated that when consumers associations with packaging and beneficial dimensions were high, the tendencies to buy chocolates were also high. It was also observed that packaging and nutritional mislead had direct negative effect in buying influence of chocolates. Further, it was also concluded that packaging and attitude towards new designs also had direct negative effect in buying influence of chocolates. The results were significant in all the above mentioned situations.

Heat transfer finite element model of fresh fruit salad insulating packages in non-refrigerated conditions

The quality of many foods is significantly affected by temperature fluctuations that can occur during distribution and transport. Packaging materials can help to shield the product from temperature variation by increasing the heat transfer resistance. Thermal insulation power is influenced by several factors, such as material, geometry, and degree of contact between materials. To maintain the cool chain of fruit salad with syrup during the transportation (temperature less than 5 °C), thermal insulation effect of different packaging materials was investigated. A parametric analysis using a finite element model able to describe the heat transfer inside the containers, on varying packaging material (expanded polystyrene: EPS, and air), geometry, dimension, and boundary conditions, was developed and validated. Good agreement was obtained between numerical and experimental results (R2 up to 0.98). The effectiveness of the insulation configurations was evaluated by determining the time taken for the temperature to rise the critical value of 5 °C. Results showed that insulating performance of the air is better than EPS. This is realistic only taking into account insulation layer less than 0.013 m. From a practical point of view, an EPS packaging could result stronger compared to a packaging characterised by an insulating air layer. For the same EPS insulation thickness, product temperature exponentially decreases with the volumetric capacity (R2 = 0.99).

Ideal luminous efficacy and color spatial uniformity of package-free LED based on a packaging phosphor-coated geometry.

This paper presents the optical simulation of the luminous efficacy of radiation (LER) and color spatial uniformity (CSU) of a package-free white LED conducted to boost the LER and simultaneously improve the CSU. According to the simulation results, the main effect on the LER and CSU was the change in the geometrical ratio of phosphor coating. Regardless of the packaging size, when the ratio of the top coating to the sidewall coverage of the phosphor layer thickness was in the range from 0.9 to 1.1, the maximum LER and optimal CSU can be simultaneously obtained. Besides, effectively increasing the volume of the overall packaging dimension to be 30 times the size of the chip can enable a package-free LED to achieve 90% saturated maximum LER without affecting the CSU.

A new multi-objective optimization method for full-vehicle suspension systems

The conventional approach in vehicle suspension optimization based on the ride comfort and the handling performance requires decomposition of the multi-performance targets, followed by lengthy iteration processes. Suspension tuning is a time-consuming process, which often requires the benchmarking of competitors’ vehicles to define the performance targets of the desired vehicle by experimental techniques. Optimum targets are difficult to derive from benchmark vehicles as each vehicle has its own unique vehicle set-up. A new method is proposed to simplify this process and to reduce significantly the development process. These design objectives are formulated into a multi-objective optimization problem together with the suspension packaging dimensions as the design constraints. This is in order to produce a Pareto front of an optimized vehicle at the early stages of design. These objectives are minimized using a multi-objective optimization workflow, which involves a sampling technique, and a regularity-model-based multi-objective estimation of the distribution algorithm to solve greater than 100-dimensional spaces of the design parameters by the software-in-the-loop optimization process. The methodology showed promising results in optimizing a full-vehicle suspension design based on the ride comfort and the handling performance, in comparison with the conventional approach.

Optimization of demand-related packaging sizes using a p-median approach

The determining of efficient packaging sizes is a key factor in saving material and transportation costs and also in reducing packaging waste. By analyzing the range of items and their contribution to sales-relevant order structures of a globally operating mail order company, a simplified packing algorithm is proposed. In combination with well-known methodologies, this heuristic provides near optimal solutions improving current packaging of eCommerce companies. It is shown that simple, practical heuristics are sufficient to achieve average material savings of more than 10 %. In order to find efficient packaging sizes, a set of them is generated by discretization of packaging dimensions. Given the set of orders and the set of packaging sizes, a p-median approach is applied to find a specified number of optimal, demand-related packaging sizes.

Impact of Top Die Thickness on Cu Pillar Fatigue in Exposed Die 3D Packages

Customer demand for more powerful, faster, and multifunctional electronic devices in lighter and smaller form factors is forcing the electronics industry to expand the edges of the packaging envelope. 3D packaging is a result of such initiatives. Logic and memory dice (or logic and logic dice) are stacked on top of one another and connected through vertical Through Silicon Vias (TSVs). 3D integration has several well documented benefits such as lower power consumption, higher bandwidth, and low latency, to name a few. An added benefit of such a packaging scheme is that it reduces overall package dimensions compared to Multi-Chip Modules (MCMs). However, since the dies are stacked, total package height generally increases. One of the methods to minimize this effect is to use exposed die package construction. In this paper, exposed die 3D packages are examined and challenges associated with stacking thin dies with exposed molding are discussed. Exposed die package construction is of high importance to customers in mobile markets where power requirements and heat generation are low, but package thickness is of utmost importance. Data has been generated using a 20nm CPI (Chip Package Interaction) die which is packaged in a 3D format to study the impact of die stacking along with the presence of TSVs on Ultra Low-k (ULK) dielectrics. ULKs are commonly used in the Back End of Line (BEoL) during Si device wafer fabrication. Via middle TSV integration scheme is used to integrate TSVs in the CPI chip and a face-to-back (F2B) approach is used to assemble the top die on the CPI chiplet. The top die is mechanical in nature with Cu micro pillars and a few metal layers to form daisy chain structures when joined to the backside of TSV die. The CPI wafers are bumped on the frontside using Cu pillars and the wafers are then thinned to ~50um. The TSVs are carefully exposed from the wafer backside and wettable landing pads are patterned on the backside of the thinned wafer so as to align with the Cu micro pillars on the front side of top die. Two different thicknesses of top dies are used to study the impact of top die thickness on overall package warpage and Si-to-substrate interconnect reliability. Assembly is performed by first bonding the front side of TSV CPI chip to a substrate, and then by bonding the front of the top dies to the back of the bottom (TSV) die. The 3D packages were subjected to a variety of package level stresses and the reliability results will be presented. The effect of top die thickness is analyzed using two die thicknesses. As the packages are stressed, it is evident that packages with thinner top die show higher package level warpage and greater Cu pillar fatigue. Various mold compounds are used to improve the package warpage and data will be presented.

Developing Criteria for Complementary Health Insurance (CHI) Benefit Packages for a Medical Service Insurance Organization in Iran: A Qualitative Content Analysis

Introduction: Development of Complementary Health Insurance (CHI) benefit packages has always been one of the main challenges of Health Insurance Organizations in Iran. Records related to developing a health insurance package in Iran show that there is no specific criterion for developing such packages. This study aimed at developing criteria for providing CHI benefit packages presented by the Medical Service Insurance Organization in Iran. Methods: The current research is a qualitative and applied research which has been conducted in 2014. The sample size included 24 authorities in the domain of CHI, and a semi-structured interview was used for collecting data. Data analysis was based on framework method applying Atlas-Ti 5.2 software. Results: Nineteen main themes and 53 sub-themes and finally 20 criteria were identified for four main dimensions of the benefit package including the insured, commitments of insurance services, financial resources and Medical Service Insurance Organization special priorities. Conclusion: In this study, various criteria were identified for developing CHI. It seems that applying important criteria such as equity, clinical guidelines, effectiveness, and efficiency of CHI benefit package presented by Medical Service Insurance Organization can decrease the shortcomings of the current system and using standardization can lead to targeting the service benefit package, removing its defects and improving the health of insured people.

An Investigation into the Package and Printed Circuit Board Assembly Solutions of an Ultrathin Coreless Flip-Chip Substrate

Flip-chip technology has been widely accepted as a solution for electronic packaging of high-pin-count devices. Due to the demand for smaller and thinner package dimensions, coreless build-up substrates will be used in industry to carry the die by solder bumps due to the advantages of shorter transmission route and lower inductance and thermal resistance. However, coefficient of thermal expansion (CTE) mismatch between the Cu trace and the laminate often causes the coreless substrate to warp, which leads to failures such as nonwetted solder bumps and interfacial cracking during assembly and reliability tests. In a previous study, assembly of a six-layer polyimide-based coreless flip-chip package was achieved by a 17 mm × 17 mm die with 4355 Sn-37Pb solder bumps, an amide-based underfill, and 1521 Sn-3.0Ag-0.5Cu solder balls. For determination of its board-level reliability characteristics, the component was mounted on a printed circuit board (PCB) using a conventional surface mount technology, and 10 test vehicles were assembled for assessment of their reliability under a temperature cycling environment. The experimental results show that the characteristic life of the PCB assembly exceeded 1500 cycles and that failure resulted from fracture of the outermost solder balls on the substrate side. This was different from the failure mode of die cracking when the package experienced hundreds of temperature cycles at the component level because the rigid PCB, through solder balls, moderated the deformation of the coreless flip-chip package. Hence, the concentrated bending stress at the die edge region was lowered. Finally, the local CTE mismatch between the stiffener and the PCB dominated the fatigue fracture of the outermost solder balls to become the main failure mode.

A compact high resolution flat panel PET detector based on the new 4-side buttable MPPC for biomedical applications

Compact high-resolution panel detectors using virtual pinhole (VP) PET geometry can be inserted into existing clinical or pre-clinical PET systems to improve regional spatial resolution and sensitivity. Here we describe a compact panel PET detector built using the new Though Silicon Via (TSV) multi-pixel photon counters (MPPC) detector. This insert provides high spatial resolution and good timing performance for multiple bio-medical applications. Because the TSV MPPC design eliminates wire bonding and has a package dimension which is very close to the MPPC׳s active area, it is 4-side buttable. The custom designed MPPC array (based on Hamamatsu S12641-PA-50(x)) used in the prototype is composed of 4×4 TSV-MPPC cells with a 4.46mm pitch in both directions. The detector module has 16×16 lutetium yttrium oxyorthosilicate (LYSO) crystal array, with each crystal measuring 0.92×0.92×3mm3 with 1.0mm pitch. The outer diameter of the detector block is 16.8×16.8mm2. Thirty-two such blocks will be arranged in a 4×8 array with 1mm gaps to form a panel detector with detection area around 7cm×14cm in the full-size detector. The flood histogram acquired with 68Ge source showed excellent crystal separation capability with all 256 crystals clearly resolved. The detector module׳s mean, standard deviation, minimum (best) and maximum (worst) energy resolution were 10.19%, ±0.68%, 8.36% and 13.45% FWHM, respectively. The measured coincidence time resolution between the block detector and a fast reference detector (around 200 ps single photon timing resolution) was 0.95ns. When tested with Siemens Cardinal electronics the performance of the detector blocks remain consistent. These results demonstrate that the TSV-MPPC is a promising photon sensor for use in a flat panel PET insert composed of many high resolution compact detector modules.

SiP Technology for Wireless Module Miniaturization

SiP (System in package) module provide a integrate functions, smaller and thinner package solution on electronic portable devices. For the wireless application, the advanced AoP (Antenna on package) and compartment shielding has been proposed and developed by Advanced Semiconductor Engineering (ASE), Inc. to be the next request for complex application and miniaturization solution. For AoP package, more focus on near field/wireless connection to have specific metal antenna design and attached on package surface to achieve SiP module miniaturization and perform required antenna efficiency on low frequency application. Advanced compartment shielding provide the simple method on function isolation area to prevent the electromagnetic noise interference (EMI) and high level of total radiated EMI from system product due to more complex package performance. The major benefit of novel AoP package is transfer the antenna designed on PCB to directly attached on package to reduce the PCB X/Y dimension but still keep antenna efficiency performance. The fabrication of AoP consists of following factors: 1) special substrate design to have antenna connection pads; 2) specific 3D metal frame design for antenna; 3) antenna frame attachment and over mold for package. Following these processes, AoP provide a simple process on package assembly and smaller dimension of package. For compartment shielding development in ASE, previously we design a metal can on module package to reduce EMI but induce a thickness increase. The novel compartment shielding more focus on shielding frame design inside the package to achieve simple process flow and good shielding performance, their fabrication consists the following factors: 1) specific tooth-type frame design to have shielding function for different zone in package and provide suitable slot width/pitch ratio for mold flow; 2) adhesion material for metal frame attached on substrate ; 3) over mold and laser trenching; 4) conductive material sputtering on package surface. This novel compartment shielding solution provides a simplified shielding and more reliable process on SiP module package. Wireless module was designed RF/power/Switch/Bluetooth function inside the package, the high density of electrical function is usually designed in the portable devices with small/thinner size. Advanced AoP or compartment shielding technology provides more competitive solution on SiP module miniaturization. In the paper, we will present the design for AoP and compartment shielding, process characterization and measurement of antenna and shielding performance of module to present the advantage of SiP modules with this technology application.

How consumers estimate the size and appeal of flexible packaging

The use of flexible packaging by fast moving consumer goods industry is on the increase due to price affordability of the packaging material and logistic benefits when compared to rigid packaging. This work investigated the influence of flexible packaging dimensions and product weight on the size impression and aesthetic appeal of pre-packaged powdered products. Powdered products of different sachet dimensions and product weights were prepared and ranked by panelists based on the quantity of powder contained in the sachet. The appeal of sectional shapes of the sachets used in packaging of the powder was also evaluated using a 9-point semantic scale. Obtained data were subjected to multiple paired comparison, correlation, regression and agglomerative hierarchical clustering analysis. A 27g powder packed in a sachet having an area of 8640mm2 was perceived to be bigger (P<0.0001) than the 30g powder packed in a sachet having an area of 10,560mm2. The result indicated that the size impression and appeal of powdered products in flexible sachets is greatly influenced by the ratio of sachet area-to-powder weight (A:W).