SiP Technology for Wireless Module Miniaturization

Abstract

SiP (System in package) module provide a integrate functions, smaller and thinner package solution on electronic portable devices. For the wireless application, the advanced AoP (Antenna on package) and compartment shielding has been proposed and developed by Advanced Semiconductor Engineering (ASE), Inc. to be the next request for complex application and miniaturization solution. For AoP package, more focus on near field/wireless connection to have specific metal antenna design and attached on package surface to achieve SiP module miniaturization and perform required antenna efficiency on low frequency application. Advanced compartment shielding provide the simple method on function isolation area to prevent the electromagnetic noise interference (EMI) and high level of total radiated EMI from system product due to more complex package performance. The major benefit of novel AoP package is transfer the antenna designed on PCB to directly attached on package to reduce the PCB X/Y dimension but still keep antenna efficiency performance. The fabrication of AoP consists of following factors: 1) special substrate design to have antenna connection pads; 2) specific 3D metal frame design for antenna; 3) antenna frame attachment and over mold for package. Following these processes, AoP provide a simple process on package assembly and smaller dimension of package. For compartment shielding development in ASE, previously we design a metal can on module package to reduce EMI but induce a thickness increase. The novel compartment shielding more focus on shielding frame design inside the package to achieve simple process flow and good shielding performance, their fabrication consists the following factors: 1) specific tooth-type frame design to have shielding function for different zone in package and provide suitable slot width/pitch ratio for mold flow; 2) adhesion material for metal frame attached on substrate ; 3) over mold and laser trenching; 4) conductive material sputtering on package surface. This novel compartment shielding solution provides a simplified shielding and more reliable process on SiP module package. Wireless module was designed RF/power/Switch/Bluetooth function inside the package, the high density of electrical function is usually designed in the portable devices with small/thinner size. Advanced AoP or compartment shielding technology provides more competitive solution on SiP module miniaturization. In the paper, we will present the design for AoP and compartment shielding, process characterization and measurement of antenna and shielding performance of module to present the advantage of SiP modules with this technology application.