Thermal characterization for dual side SiP module technology

Abstract

The trends with the development of electronic products toward smaller size, higher speed, higher effect and lower price. The size of package is getting smaller at the present stage. Not merely package but also the SIP (System in package) module is getting the same trends. There are many devices used in the SIP with limited volume side by side. That function of module is the WI-FI switch between the 2.4G and 5G. The WI-FI SIP module is large number used in the mobile device and cell phone. So, we are focus on the performance of SIP module with 2.4G and 5G. There is more and more function setting in a very small structure, it's also mean the SIP module need more than before power on drive the device. The more power dissipation accompanies the concern of thermal performance will become poor. So far, we talk about the SIP module that the device just on a single side structure. For the present single side structure can't meet the requirements of light. In the train of the new structure double side modeling can reduce the SIP module area about 28% than single side. The biggest challenge for reduce the module area is the device will be overlapping. The device overlapping will bring the impact for temperature rises higher than itself power dissipation effect. The poor thermal performance will let SIP module shut down when it working in high ambient temperature. So, we design a few structures for fix the poor thermal performance and max improve about 30 degree C. In this study, we used the thermal simulation to analysis the thermal performance on SIP module. We also did the thermal measurement for SIP module by the IR camera and thermocouple at the same time. The error amount can be about 8.4% for the verification between simulation and measurement. This will be a confidence in predicting the simulation results in the future.