Novel EMI shielding methodology on highly integration SiP module

Abstract

SiP (System-in-Package) modules play an important role to make electronic portable devices thinner, integrate more functions and reduce time to market. However, the high density of electrical functions usually causes electromagnetic noise interference (EMI) on nearby components and high level of total radiated EMI from the system product. Traditional SiP modules use a metal can to reduce EMI and this often results in an increase in both module footprint and thickness. Conformal shielding is a novel methodology to reduce EMI on molded SiP modules by using a sputtered thin metal layer on the module's top and side. In previous work, we evaluated the shielding effectiveness for single compartment module for both near field and far field conditions. As modules may contain multiple functionalities which may need to be shielded from one another, we have developed a process to construct shielded compartments by the conductive barrier inside the package, providing a way to reduce the product design area requirement. We have prepared a test vehicle with two compartments separated and with antenna coupons inside each compartment. In the paper, we present the process characterization result and measurements of the shielding effectiveness of the entire module as well as between the compartments and thereby demonstrate the advantages of SiP modules with compartment shielding.