Nonvolatile Random Access Memory Research Articles

Investigation on self-rectifying properties of Pt/HfO2/Ti with rivet-like structure based on ALD conformal technology

This work explores an architecture for nonvolatile resistive random-access memory (RRAM) systems. The study proposes a self-rectifying RRAM device utilizing a two-terminal 1R selector that harmonizes the gate control efficacy of transistors with the inherent simplicity of diode structures. A rivet-like HfO2-based RRAM array is meticulously constructed through atomic layer deposition (ALD), aiming to enhance device performance and retention stability. The conformal fabrication technique of ALD method is critical in achieving uniform coverage of isolation layers and precise electrode placement, which is instrumental in the fabrication of high-performance memory cells. Empirical analyses indicate significant improvements in rectification and ON/OFF ratios compared to existing RRAM models, bolstered by compatibility with established CMOS processes. It reveals that these advances are conducive to scalable, high-density memory integration, positioning the RRAM as a viable contender for future computational applications that require high efficiency and neuromorphic computing capabilities.

Random telegraph noise characteristic of nonvolatile resistive random access memories based on optical interference principle

The influence of random telegraph noise (RTN) could reduce the reading margin, which would cause computational errors in data recognition. This paper proposes a current sensor based on the principle of optical fiber interference, which can avoid the interference generated during the RTN testing process and improve the accuracy due to its passive characteristics. In this study, a hafnium oxide based memristor was fabricated, the switching voltages of Cu and TiN as the top electrodes are 0.2 V and 0.15 V, respectively. In addition, the RTN spectral density of the two device structures in LRS increases from 10−5 to 10−1 A2 Hz−1 and from 10−5 to 101 A2 Hz−1 with increasing applied voltage. While the RTN in high resistance state is independent of the applied voltage. Furthermore, based on the analysis of the experimental data, the generation mechanism of the RTN is attributed to local defects and the capture or emission of carriers by traps.

Memory device based on a nano-granulars and nano-worms structured MoS2 active layer: The origin of resistive switching characteristics

This study systematically demonstrates resistive switching (RS) functionality of MoS2 nanostructured [nano-granulars (NGs) and nano-worms (NWs)] based non-volatile resistive random access memory (ReRAM) device. Interestingly, the SET and RESET voltage sharply changes from NGs to NWs device. The RS behavior of devices is interpreted by proposing and discussing a model. In the Ag/MoS2(NGs)/ITO device, a high resistance state (HRS) and low resistance state (LRS) could be ascribed due to the formation/disruption of conducting filament via trapping-detrapping of electrons across the NGs active layer. In contrast, the RS behavior of Ag/MoS2(NWs)/ITO device is caused by forming of an Ag metallic filamentary route between the electrodes. The NWs structured device show substantially better endurance and homogeneity than the device with an NGs structure. This nanostructural-dependent device functionality allows extended RS properties and establishes a relationship between the material's nano-level structural and electrical features.

Roadmap for ferroelectric domain wall memory

Commercial nonvolatile Ferroelectric Random Access Memory employs a destructive readout scheme based on charge sensing, which limits its cell scalability in sizes above 100 nm. Ferroelectric domain walls are two-dimensional topological interfaces with thicknesses approaching the unit cell level between two antiparallel domains and exhibit electrical conductivity, distinguishing them from insulating matrices that are uniformly ordered. Recently, novel research has been devoted to utilizing this extraordinary interface for the application in nonvolatile memory with nanometer-sized scalability and low energy consumption. Here, we pay more attention to the development of the domain wall memory technologies in the future with challenges and opportunities to design planar and vertical arrays of the memory cells in the CMOS platform.

Thermodynamic properties and switching dynamics of perpendicular shape anisotropy MRAM

The power consumption of modern random access memory (RAM) has been a motivation for the development of low-power non-volatile magnetic RAM (MRAM). Based on a CoFeB/MgO magnetic tunnel junction, MRAM must satisfy high thermal stability and a low writing current while being scaled down to a sub-20 nm size to compete with the densities of current RAM technology. A recent development has been to exploit perpendicular shape anisotropy along the easy axis by creating tower structures, with the free layers’ thickness (along the easy axis) being larger than its width. Here we use an atomistic model to explore the temperature dependent properties of thin cylindrical MRAM towers of 5 nm diameter while scaling down the free layer from 48 to 8 nm thick. We find thermal fluctuations are a significant driving force for the switching mechanism at operational temperatures by analysing the switching field distribution from hysteresis data. We find that a reduction of the free layer thickness below 18 nm rapidly loses shape anisotropy, and consequently stability, even at 0 K. Additionally, there is a change in the switching mechanism as the free layer is reduced to 8 nm. Coherent rotation is observed for the 8 nm free layer, while all taller towers demonstrate incoherent rotation via a propagated domain wall.

Ultralow Voltage Resistive Switching in Hafnium–Zirconium Oxide

AbstractUltralow SET and RESET voltage are essential for high‐density, low‐power, and small heat dissipation nonvolatile random‐access memory (NVRAM) elements. A nanoscale polycrystalline Hf0.75Zr0.25O2 (HZO) thin films on Pt/Si substrate are fabricated and investigated for suitability for bipolar resistive switching. The device illustrates monoclinic and tetragonal/orthorhombic phases with weak ferroelectricity and robust resistive switching. Small remanent polarization (≈0.1 μC cm−2) may assist in the height reduction of barrier height and ease the electron for transport. Remarkably, the Al/HZO/Pt/Si device, consisting of thin films with 10 and 5 nm thicknesses, exhibits a switching voltage below −30 mV from a low‐resistance state (LRS) to a high‐resistance state (HRS). It shows a significant ROFF/RON ratio of 106, making it suitable for low power consumption and minimal heat dissipation devices. Moreover, the utilization of an ultrathin film (5 nm) results in an improved reduction (< 0.7 V) of the operating window at the positive voltage. Direct tunneling and the Fowler–Nordheim tunneling model are performed in current–voltage (I–V) data to study the charge transportation behavior over a trapezoidal and triangular potential barrier. These results of the HZO candidate may stimulate the futuristic nonvolatile resistive random‐access memory (ReRAM) in the optoelectronic industry.

Near Room Temperature Multilevel Resistive Switching Memory with Thin Film Ionic Liquid Crystal

In this study, we demonstrate multilevel operation of nonvolatile resistive random-access memory (ReRAM) devices using thin films of an ionic liquid crystal (ILC), 1-dodecyl-3-methylimidazolium tetrafluoroborate ([C12mim][BF4]), as a resistive switching...

Strain engineering of Bi2OS2 ultrathin films: electronic and ferroelectric properties

The non-monotonous relationship of ferroelectric polarization with strain can be attributed to distinct atomic coordination environments in Bi2OS2, which is different from a nearly monotonous trend of ferroelectricity-stabilized energy.

First-principles prediction of two-dimensional Rare-earth intrinsic ferrovalley materials: Non-Janus GdXY (X≠Y=Cl,Br,I) monolayers

Two-dimensional ferrovalley magnetic materials have attracted much attention due to the applications in valley-based nonvolatile random access memories and valley filters. In this work, using first-principles calculations, we predict a promising class of bipolar magnetic semiconductors, namely non-Janus GdXY(X≠Y=Cl,Br,I) monolayers, which exhibit excellent mechanical and thermal stability, large magnetic moment (8 μB/Gd), and high Curie temperature (above 450 K). When magnetized along the ±z direction, a spontaneous valley polarization can be observed in non-Janus GdXY. Due to the non-zero Berry curvature, the anomalous Hall effect will be able to be observed in non-Janus GdXY. In addition, the system transforms into a semi-semiconductor from a bipolar magnetic semiconductor with increasing biaxial tensile strain. Under the strain of -4%∼+4%, the ferrovalley characteristics can be well maintained. Our findings not only reveal that non-Janus GdXY is a novel room-temperature ferrovalley semiconductor material, but also provide a new platform for designing spintronics and valley electronics devices.

Electron-Sponge Nature of Polyoxometalates for Next-Generation Electrocatalytic Water Splitting and Nonvolatile Neuromorphic Devices.

Designing next-generation molecular devices typically necessitates plentiful oxygen-bearing sites to facilitate multiple-electron transfers. However, the theoretical limits of existing materials for energy conversion and information storage devices make it inevitable to hunt for new competitors. Polyoxometalates (POMs), a unique class of metal-oxide clusters, have been investigated exponentially due to their structural diversity and tunable redox properties. POMs behave as electron-sponges owing to their intrinsic ability of reversible uptake-release of multiple electrons. In this review, numerous POM-frameworks together with desired features of a contender material and inherited properties of POMs are systematically discussed to demonstrate how and why the electron-sponge-like nature of POMs is beneficial to design next-generation water oxidation/reduction electrocatalysts, and neuromorphic nonvolatile resistance-switching random-access memory devices. The aim is to converge the attention of scientists who are working separately on electrocatalysts and memory devices, on a point that, although the application types are different, they all hunt for a material that could exhibit electron-sponge-like feature to realize boosted performances and thus, encouraging the scientists of two completely different fields to explore POMs as imperious contenders to design next-generation nanodevices. Finally, challenges and promising prospects in this research field are also highlighted.

Growth and characterization of sputter-deposited Ga2O3-based memristive devices

In the last few years, there has been significant interest in gallium oxide devices for resistive switching technologies due to its remarkable sensitivity to oxygen. In this study, we present the growth and resistive switching of a (2¯01) oriented (75 ± 3) nmβ-Ga2O3 thin film on a Ru/Al2O3 substrate using magnetron radio frequency sputtering. The observed resistive switching was attributed to the formation and rupture of conductive filaments constituted by oxygen vacancies in the β-Ga2O3 film as confirmed by x-ray photoelectron spectroscopy and energy-dispersive x-ray spectroscopy. The electrical conduction was found to be of Ohmic nature in the low-resistance ON state, while the high-resistance OFF state was governed by the Poole–Frenkel transport mechanism. Exhibiting stable endurance cycles, long retention times, and ON/OFF ratios of up to 104, the devices can be considered as promising prototypes for future nonvolatile resistive switching random access memory with respect to both switching performance and device stability.

Ionic Liquid Crystal Thin Film as Switching Layer in Nonvolatile Resistive Memory.

In this study, we propose the use of an ionic liquid crystal (ILC) as a new resistive switching layer in nonvolatile resistive random-access memory (ReRAM) devices. The high-quality vacuum-deposited ILC films of 1-hexadecyl-3-methylimidazolium hexafluorophosphate ([C16mim][PF6]) enabled to demonstrate the first operation of ReRAM devices with a low set voltage of ∼1 V and stable switching behavior for up to ∼44 cycles. The key to the successful operation is that the ILC layer is in the liquid crystal phase (smectic A), where the electric double layers formed at the electrode-ILC interfaces play a significant role. The results of basic electrical properties and I-V curve fittings suggested the following operation principle: the formation and rupture of charge-composed filaments within the ILC film, where the current conduction is primarily governed by the trap charge limited current (TCLC) mechanism. These achievements will pave the way for advanced studies of ILC-based electronic devices.

Effect of Hf alloying on magnetic, structural, and magnetostrictive properties in FeCo films for magnetoelectric heterostructure devices

Materials with high magnetoelectric coupling are attractive for use in engineered multiferroic heterostructures with applications such as ultra-low power magnetic sensors, parametric inductors, and non-volatile random-access memory devices. Iron–cobalt alloys exhibit both high magnetostriction and high saturation magnetization that are required for achieving significantly higher magnetoelectric coupling. We report on sputter-deposited (Fe0.5Co0.5)1−xHfx (x = 0 – 0.14) alloy thin films and the beneficial influence of Hafnium alloying on the magnetic and magnetostrictive properties. We found that co-sputtering Hf results in the realization of the peening mechanism that drives film stress from highly tensile to slightly compressive. Scanning electron microscopy and x-ray diffraction along with vibrating sample magnetometry show reduction in coercivity with Hf alloying that is correlated with reduced grain size and low film stress. We demonstrate a crossover from tensile to compressive stress at x ∼ 0.09 while maintaining a high magnetostriction of 50 ppm and a low coercive field of 1.1 Oe. These characteristics appear to be related to the amorphous nature of the film at higher Hf alloying.

Bio-Organic Based Resistive Switching Random-Access Memory

A non-volatile memory is a solid-state device that can retain data even power supply is terminated. It is an essential data storage device that serves as a backbone for the advancement of Internet-of-Things. There are various emerging non-volatile memory technologies in different technology-readiness levels, to replace the existing technologies with limited memory density, operating speed, power consumption, manufacturability, and data security. Of the emerging technologies, resistive switching technology is one of the most promising next generation non-volatile random-access memories. The fundamental working principle of the resistive-switching random-access memory (ReRAM) is based on memristor characterises with metal-insulator-metal stacking structure. Same as other solid-state devices, ReRAM is also facing issue of electronic waste when the memory device is discarded. To overcome this issue, bio-organic materials as green and sustainable engineering materials have been used to fabricate ReRAM. In this review, development of bio-organic based ReRAM, in particular the resistive switching mechanisms and device performance, have been discussed and challenging and future applications of this memory have been provided.

Room-temperature orbit-transfer torque enabling van der Waals magnetoresistive memories

The non-volatile magnetoresistive random access memory (MRAM) is believed to facilitate emerging applications, such as in-memory computing, neuromorphic computing and stochastic computing. Two-dimensional (2D) materials and their van der Waals heterostructures promote the development of MRAM technology, due to their atomically smooth interfaces and tunable physical properties. Here we report the all-2D magnetoresistive memories featuring all-electrical data reading and writing at room temperature based on WTe2/Fe3GaTe2/BN/Fe3GaTe2 heterostructures. The data reading process relies on the tunnel magnetoresistance of Fe3GaTe2/BN/Fe3GaTe2. The data writing is achieved through current induced polarization of orbital magnetic moments in WTe2, which exert torques on Fe3GaTe2, known as the orbit-transfer torque (OTT) effect. In contrast to the conventional reliance on spin moments in spin-transfer torque and spin–orbit torque, the OTT effect leverages the natural out-of-plane orbital moments, facilitating field-free perpendicular magnetization switching through interface currents. Our results indicate that the emerging OTT-MRAM is promising for low-power, high-performance memory applications.

Effect of ZnSnO3 on dielectric and ferroelectric properties of Sr2Bi4Ti5O18 ceramics

AbstractSr2Bi4Ti5O18 is one of the promising candidates for ferroelectric nonvolatile random access memory device applications. Albeit, this ceramic material is not suitable for certain ferroelectric device applications because of the merits and demerits associated with this material. Solid‐solution or composite ceramics in bulk configuration is the better choice to overcome the drawbacks associated with the individual compounds. Concurrently, solid‐solution of functional electro‐ceramics comprising Aurivillius family‐based lead‐free bismuth‐layered structured ceramics (1 − x) Sr2Bi4Ti5O18 (SBT) and x mol% of ilmenite structured ZnSnO3 (ZS) (where x = 0, 5, 10, and 20 mol%) were synthesized via conventional solid‐state reaction route to investigate the effect of ZS on the physical properties of SBT. X‐ray diffraction diffractograms revealed that a single phase was formed maximum up to 5 mol% of ZS in SBT and scanning electron microscopy studies suggested platelike microstructure of the samples. Intriguingly, positive‐up and negative‐down results indicated that the true switchable polarization for the 10 mol% ZS in SBT (10.87 μC/cm2), 33% higher than that of pure SBT ceramics in addition to the lower leakage current density and enhanced dielectric response in the SBT–ZS samples. The observed enhancement in electrical characteristics of SBT–ZS composite ceramics compared to pure SBT highlights the decisive role played by the ZS in lowering the thermodynamic barrier resulting in ease of polarization switching and mitigating the leakage current of SBT ceramics.

Exploration of the Structural, Dielectric, Ferroelectric, and Piezoelectric Properties in Non-stoichiometric Sr1−XBi2+2X/3Nb2O9 Ceramics

In this study, the authors focused on the preparation and characterization of Lead-free ferroelectric ceramics known as Sr1−XBi2+2X/3Nb2O9: SBBNX, where 0.0≤ × ≤0.4. The ceramics were synthesized using a conventional solid-state reaction route. The researchers performed X-ray diffraction (XRD) analysis to confirm the phase formation and employed the Rietveld refinement technique. The results indicated that the prepared SBBNX ceramics exhibited a single phase with an orthorhombic structure, specifically belonging to the A21am space group. All samples were subjected to analysis using field emission scanning electron microscopy (FESEM) to investigate their surface morphology. The micrographs revealed a uniform distribution of grains (of size 2–4 μm ) on the surface, with distinct grain boundaries. An increasing trend in both the dielectric constant (from 99 to 220 at room temperature) and transition temperature (from 396 °C to 490 °C) was noted with an increase of Bi content in SBN. The researchers estimated the activation energies by analyzing the Arrhenius plots of the ac conductivity. The obtained values ranged from 0.62 to 1.25 eV, indicating the presence of motion of oxygen vacancies in the SBBNX ceramics. The primary objective of this study was to optimize the Sr/Bi ratio in SBBNX ceramics to enhance their potential use in non-volatile random access memory (NVRAM) applications and high-temperature piezoelectric devices.

Room temperature polar and weak-ferromagnetic oxide with low dielectric loss

Single-phase materials that are simultaneously ferroelectric and ferromagnetic at room temperature are promising for devices such as non-volatile random-access memory. Perovskite BiFeO3 which crystallizes in the polar rhombohedral structure (R3c) is ferroelectric and antiferromagnetic at room temperature. Here, we report a family of perovskite oxides in the BiFeO3 – Bi2/3TiO3 – ATiO3 (where A2+ is divalent alkaline earth metal ions e.g., Ca2+, Sr2+, Ba2+) ternary phase diagram that is polar as well as weak ferromagnetic above room temperature. The composition (Bi0.9167A0.075)(Fe0.9Ti0.1)O3 crystallizes in the polar rhombohedral structure space group R3c as corroborated by powder X-ray and neutron diffraction analysis. The nearly pure A-site perovskite possesses a long-range magnetic ordering above room temperature. These perovskites show a low dielectric loss, and the electrical response is dominated by grain contributions below 723 K.

Novel Multi-State QDC-QDG FETs and Gate All Around (GAA) FETs for Integrated Logic and QD-NVRAMs

This paper presents experimental I-V characteristics of a QDC-QDG FET that exhibited 5-states and has the potential to introduce additional states (e.g. 8) by utilizing Ge QDSL mini-energy sub-bands. Mini-energy bands are formed in an asymmetric Si quantum dot channel (QDC) comprising of two silicon oxide cladded Si quantum dots (QDs), where the upper layer has a smaller core diameter and thicker upper oxide cladding serving as tunnel oxide. Quantum simulations are presented to show more states when additional two germanium oxide cladded Ge dots are added on top of Si QD layers in the gate region. This paper also proposes Gate all around (GAA) FETs, when integrated with nonvolatile random access memories (NVRAMs) that have the potential for wafer scale integration, similar to vertical NANDs. Novel Si and Ge Quantum-dot-based device configurations discussed in this paper open the pathway forward to implement hardware platform for emerging applications using low power consumption and smaller footprint.

Enhancing Number of Bits Via Mini-Energy Band Transitions Using Si Quantum Dot Channel (QDC) and Ge Quantum Dot Gate (QDG) FETs and NVRAMs

This paper presents multi-state QDC-QDG FET structures that has the potential to introduce additional states (8 or 16) by utilizing additional mini-energy sub-bands. Mini-energy bands are formed in Si quantum dot channel (QDC) comprising two silicon oxide cladded Si quantum dots (QDs). Quantum simulations are presented to show more states when additional two germanium oxide cladded Ge dots are added on top of two Si QD layers in the gate region. With the addition of a control gate oxide layer, we transform the QDC-QDG-FET into a quantum dot (QD) nonvolatile random access memory (NVRAM). Quantum simulations are presented.