Abstract
This work explores an architecture for nonvolatile resistive random-access memory (RRAM) systems. The study proposes a self-rectifying RRAM device utilizing a two-terminal 1R selector that harmonizes the gate control efficacy of transistors with the inherent simplicity of diode structures. A rivet-like HfO2-based RRAM array is meticulously constructed through atomic layer deposition (ALD), aiming to enhance device performance and retention stability. The conformal fabrication technique of ALD method is critical in achieving uniform coverage of isolation layers and precise electrode placement, which is instrumental in the fabrication of high-performance memory cells. Empirical analyses indicate significant improvements in rectification and ON/OFF ratios compared to existing RRAM models, bolstered by compatibility with established CMOS processes. It reveals that these advances are conducive to scalable, high-density memory integration, positioning the RRAM as a viable contender for future computational applications that require high efficiency and neuromorphic computing capabilities.
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