This study introduces a novel high-Q Lamé mode MEMS resonator, optimized through support beam structures and etching hole distributions to minimize anchor losses and thermal elastic dissipation (TED). Fabricated using a Silicon-On-Insulator (SOI) process, the resonators achieved Q values of 129,200 and 102,100 in different designs, demonstrating significant improvements in vacuum conditions and highlighting air damping as a key loss mechanism. Nonlinear analysis revealed material nonlinearity dominance. These findings offer valuable guidelines for developing high-end MEMS devices, such as low phase noise oscillators and high-resolution sensors, by showcasing substantial reductions in energy dissipation and enhanced Q factors through structural optimizations.
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