Multilayer Ceramic Modules Research Articles

Binder Film을 이용한 LTCC Sheet 적층

In the lamination process of multi-layer ceramic modules, the occurrence of delamination comes into repeatedly. To completely improve the lamination process of LTCC sheets, a binder film was introduced between the layers. The binder film did not originate the delamination until the thickness under 40 μm. After lamination, the thickness of the binder film was determined by the infiltration of binder by the pressure, and after the bake-out, was dependent on the decomposition of binder resin. Any detectable defect was not observed in the multilayer structure with Ag inner electrodes.

The effect of Mn on the microstructure and properties of BaSrTiO 3 with B 2O 3–Li 2CO 3

Integration of ferroelectric tunable components into dielectric layers of low temperature co-fired ceramic (LTCC) systems enables the realization of more functional multilayer ceramic modules (MCMs) for telecommunication applications. A composition designed for the low temperature sintering of ferroelectric BST material has been developed based upon previous work. Small amount of manganese is introduced to modify the properties of ferroelectric BaSrTiO 3 LTCC compositions. The effects of manganese on sintering behaviour, microstructure, relative permittivity, dissipation factor and tunability are studied. Manganese enhances the sintering of the BST due to an increase in the amount of oxygen vacancies and which yields an improvement in the electrical properties of BST.

Improving the Heat Dissipation of Multilayer Ceramic Modules by the Use of CBGA Connections on HTCC and LTCC

By the use of ceramic ball grid array connections, the number of I/Os can be increased substantially in comparison with PGA (pin grid array) while maintaining an unchanged module size. In most cases, this also signifies a higher packing density and thus a higher power density, which must be dissipated as occurring heat. The fact that the dissipation of heat can also be improved considerably by the use of modules with CBGA (ceramic ball grid array) connections instead of PGA connections is demonstrated on a simulation model. Moreover, the use of chip carriers made of different ceramics (LTCC or Al2O3) has a substantial influence on the possible heat dissipation (LTCC= low temperature cofired ceramic).

Removal of Carbonaceous Residue with Wet Hydrogen in Greensheet Processing for Multilayer Ceramic Module: II, Reaction in Large Modules Influenced by Pore Diffusion and Mass Transfer

An experimental and mathematical investigation of the removal of carbonaceous residue deposited on the ceramic substrate in the fabrication of multilayer ceramic modules has been conducted. Such carbonaceous residue is formed when the organic binder is pyrolyzed during the firing of greensheets. This paper is the second of a two‐part series that reports on and discusses the principal findings of the investigation. In this paper we describe the removal of carbonaceous residue from large blocks of the multilayer ceramic module in which the diffusion of gaseous species may play a role. A mathematical model is developed using the Law of Additive Reaction Times for fluid‐solid reactions, which incroporates the effects of intrinsic chemical kinetics, pore diffusion, and external mass transfer. This law gives an approximate solution to the governing equations which describe the removal of carbonaceous residue from the MLC module during firing.

Removal of Carbonaceous Residue with Wet Hydrogen in Greensheet Processing for Multilayer Ceramic Module: I, Residue Formation and Intrinsic Chemical Kinetics

An experimental and mathematical investigation of the removal of carbonaceous residue deposited on the ceramic substrate in the fabrication of multilayer ceramic modules has been conducted. Such carbonaceous residue is formed when the organic binder is pyrolyzed during the firing of greensheets. This Part I is concerned specifically with the formation of carbonaceous residue and the intrinsic kinetics of its subsequent removal in a mixture of water vapor with hydrogen. The reaction is of first order with respect to the amount of the carbonaceous residue and depends on the water vapor and hydrogen partial pressures according to a Langmuir‐Hinshelwood kinetic expression.

Background and applications of electron beam test techniques

The use of electron beams for contactless testing of electrical functions and electrical integrity of different active devices in VLSI chips has been demonstrated over the past years. This method of testing electronic networks is based on an electron probe which is deflected from point to point in the network. A current of secondary electrons emitted in response to the impingement of the electron probe is converted to a signal indicating the presence of a voltage or varying potential at the different points. Voltage contrast, electron beam induced current, dual potential approach, stroboscopic techniques and other methods have been developed and are used to detect different functional failures in devices. Besides the VLSI application, the contactless testing of three-dimensional conductor networks of a 10 cm x 10 cm x 0.8 cm multilayer ceramic module poses a different and new application for the electron beam test technique as reported in [1–5]. A dual potential electron beam test system allows to generate electron beam induced voltage contrast and also to detect this voltage contrast over the large area without moving the substrate and test for the electrical integrity of the networks. Less attention in most of the applications has been paid to the electron optical environment; mostly, SEMs were upgraded or converted to do the job of a “voltage contrast” machine. This by no means will satisfy all requirements and more thoughts have to be given to aspects such as: low voltage electron guns: thermal emitter, Schottky emitter, field emitter; low voltage electron optics; two-lens systems; different means of detection; signal processing; storage and others.

Advanced Printed-Circuit Board Design for High-Performance Computer Applications

A new integrated circuit packaging structure was needed to support the new 90-mm multilayer ceramic modules, known as Thermal Conduction Modules (TCMs), used in the IBM 3081 computers. The structure developed eliminates one level of packaging (the card level) and allows up to nine TCMs to be plugged directly into a large multilayer printed-circuit board using a new zero-insertion-force connector system. The board has 18 internal circuit planes for signal and power distribution and accommodates new signal cabling, power bus, terminating resistors, decoupling capacitors, and cooling hardware, forming a packaged unit of up to a quarter million logic gates and half a million bits of memory. This paper focuses on the detailed design of the printed-circuit board and on its signal and power transmission characteristics.

IBM multichip multilayer ceramic modules for LSI chips — design for performance and density: B. T. Clark and Y. M. Hill IEEE Trans. Components, Hybrids Mfg Technology. Chmt-3(1), 89 (March 1980)

IBM multichip multilayer ceramic modules for LSI chips — design for performance and density: B. T. Clark and Y. M. Hill IEEE Trans. Components, Hybrids Mfg Technology. Chmt-3(1), 89 (March 1980)

IBM multichip multilayer ceramic modules for LSI chips—design for performance and density : Bernard T. Clark and Yates M. Hill. IEEE Trans. Components, Hybrids Mfg Technology. Chmt-3, (1) 89 (March 1980)

Driven by the need for high device reliability in MESFET power transistors operating at elevated temperatures, and more recently the development of self-aligned gate structures, high stability contacts are being investigated in many laboratories. This paper will consider two classes of metallisations that have proved very promising. These include the refractory metals such as W, Ta and Ti together with the refractory silicides such as TaSix TiSix and WSix. The work carried out in this area will be reviewed and appraised. The basic interface has been characterised by the use of RBS and SIMS studies. More recent studies have been concerned with the use of these results in the fabrication and evaluation of transistor structures.

Electron beam processing of interconnection structures in multi-layer ceramic modules

An electron beam is used as a source of energy directly on green Al2O3 to form patterns of holes and channels for subsequent conductive filling. Holes of 0.003 to 0.006 in. diam, and channels of 0.001 to 0.006 in. width and controlled depth were formed in 0.008 in. thick green A12O3 sheets. A channel forming speed of 200 in. per sec was achieved. The mechanism of material removal is discussed. This process is capable of high density interconnection structures needed for high performance module fabrication, and it is adaptable to automation.