Abstract
In the lamination process of multi-layer ceramic modules, the occurrence of delamination comes into repeatedly. To completely improve the lamination process of LTCC sheets, a binder film was introduced between the layers. The binder film did not originate the delamination until the thickness under 40 μm. After lamination, the thickness of the binder film was determined by the infiltration of binder by the pressure, and after the bake-out, was dependent on the decomposition of binder resin. Any detectable defect was not observed in the multilayer structure with Ag inner electrodes.
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