Current heat sink designs typically assume uniform heat flux densities. However, applications such as integrated circuit chips and aircraft power modules often face nonuniform or even time-varying heat fluxes. Under these conditions, conventional fixed-configuration heat sinks are inadequate, and corresponding research is insufficient. This paper presents an adjustable-configuration heat sink with a rotatable fin and explores its flow and heat transfer characteristics under water cooling via simulations and experiments. Genetic algorithms optimize the fin angles for various heat flux densities to reduce the substrate temperatures, and compute numerical control (CNC) technology is used to fabricate and adjust the experimental components for optimal performance under different conditions. The proposed adjustable-configuration heat sink exhibited superior temperature uniformity and cooling performance under various heat flux density conditions. Under uniform heating, peak substrate temperatures are reduced by 15.68 and 14.01 K for the I-type and Z-type adjustable configuration heat sinks, respectively, compared to conventional multi-channel heat sink. For non-uniform heating, the optimized configurations lowered the temperatures in the high-heat regions by 2.8 to 5.1 K. This design, which incorporates an adjustable heat sink configuration, effectively adapts to varying heat flux density scenarios, making it a strong candidate for advanced thermal management applications.
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