Abstract

Heat rejection from electronic devices such as processors necessitates a high heat removal rate. The present study focuses on liquid-cooled novel heat sink geometry made from four channels (width 4 mm and depth 3.5 mm) configured in a concentric shape with alternate flow passages (slot of 3 mm gap). In this study, the cooling performance of the heat sink was tested under simulated controlled conditions.The lower bottom surface of the heat sink was heated at a constant heat flux condition based on dissipated power of 50 W and 70 W. The computations were carried out for different volume fractions of nanoparticles, namely 0.5% to 5%, and water as base fluid at a flow rate of 30 to 180 mL/min. The results showed a higher rate of heat rejection from the nanofluid cooled heat sink compared with water. The enhancement in performance was analyzed with the help of a temperature difference of nanofluid outlet temperature and water outlet temperature under similar operating conditions. The enhancement was ~2% for 0.5% volume fraction nanofluids and ~17% for a 5% volume fraction.

Highlights

  • Miniaturization of electronic devices faces heat rejection problems

  • Uses of heat sinks with micro/mini-channels have emerged as a feasible solution, which was first proposed by Tukerman and Pease [2]

  • Khameneh et al [7] carried out a numerical study on laminar flow and forced convective heat transfer in water-cooled rectangular-shaped microchannel sections that had specific hydraulic diameters and distinct geometric configurations

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Summary

Introduction

Miniaturization of electronic devices faces heat rejection problems. Advancement in fabricating these devices has resulted in them becoming smaller in size. Khameneh et al [7] carried out a numerical study on laminar flow and forced convective heat transfer in water-cooled rectangular-shaped microchannel sections that had specific hydraulic diameters and distinct geometric configurations. Choi et al [21] introduced the concept of nanofluid and presented that thermal conductivity of base fluid can be increased with the addition of nanoparticles of sizes less than 100 nm [22] The use of such nanofluids in mini-channel heat sinks (MCHSs) has been reported in some studies. Ijam and Saidur [26] analytically investigated the effect of nanoparticle concentration and Reynolds number in MCHSs. Based on the studies above, most of the investigations were carried out on the characteristics of heat transfer and fluid flow in circular or rectangular straight mini-channel heat sinks. Thermal performance of a concentric channel heat sink with an alternate slot for the fluid flow is presented

Circulatory Flow Multi-Channel Heat Sink
Nanofluid Properties
Governing Equation and Boundary Conditions
Numerical Scheme and Validation
Discussion
Findings
Conclusions
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