A kinetic model of reactive sputtering is proposed to modify Berg’s model by taking into account the true chemical interaction at solid surfaces of the target, substrate, and chamber wall having different temperatures. Any chemical reaction is correctly characterized by the rate constant k(T) rather than the sticking coefficient α, as it was previously done by Berg and other authors. Such a coefficient is solely inherent in the physical adsorption as an initial stage preceding the chemical interaction at the solid surfaces. Appropriate kinetic equations are derived by examining in detail the particle fluxes sputtered from the target and deposited onto the substrate and wall, as well as the surface chemical reactions. The kinetic equation for the target process has proved fully identical in form with that for the nonisothermal physical adsorption, whereas the kinetic equation for the substrate and wall processes are of a more complicated form. Analysis of the steady-state situation shows an advantage of the developed nonisothermal model over the isothermal Berg model for fitting to experimental data.