Insulated Gate Bipolar Transistor Model Research Articles

Turn-Off Switching Analysis Considering Dynamic Avalanche Effect for Low Turn-Off Loss High-Voltage IGBTs

An avalanche generation phenomenon has a large influence on turn-off switching loss and reverse-biased safe operating area of high-voltage insulated gate bipolar transistors (IGBTs). The purpose of this paper is to clarify the correlation between the avalanche multiplication phenomenon and the turn-off characteristics. We introduce a turn-off switching analytical model of IGBTs that considers the avalanche multiplication effect. It is concluded that the criterion of dynamic avalanche depends on the gate resistance. In the case of 4.5-kV IGBTs, the gate resistance of more than 200 /spl Omega//spl middot/cm/sup 2/ is needed to suppress the dynamic avalanche generation under a clumped inductive load circuit. On the contrary, the turn-off switching loss increases in the case that the gate resistance R/sub G/ is increased to more than approximately 100 /spl Omega//spl middot/cm/sup 2/. Theses results show that to realize low turn-off switching loss, it is necessary to ensure that the gate resistance is below a constant value, such as 100 /spl Omega//spl middot/cm/sup 2/. However, at high current density, such as 80 A/cm/sup 2/, the dynamic avalanche will generate under such small gate resistance condition. Therefore, it is important to develop IGBTs without destruction even under the condition of dynamic avalanche generation.

New distributed model of NPT IGBT dedicated to power circuits design

In this paper, a new one-dimensional (1D) insulated gate bipolar transistor (IGBT) model is presented. The heart of this model is based on the analogical resolution of the ambipolar equation of diffusion. Indeed, carriers transport to broad areas and little doped power components is of a distributed nature. Approximation of the localised constants is no longer a valid solution. By taking into account, in the model, the side current into the P/P+ well, the 2D phenomenon, IGBT latch-up can be reviewed. The complete model developed under SABER as well as the static, dynamic results of simulation and the use in current converter are presented and compared to Hefner’s IGBT model. Simulation results of a inverter will be also presented to show the good behaviour of this IGBT model.

Circuit simulator models for the diode and IGBT with full temperature dependent features

The problems faced in generating analytical models for the insulated gate bipolar transistor (IGBT) and power diode are devising correct equations and determining realistic boundary conditions, especially for two-dimensional (2-D) features, while ensuring convergence of the models. These issues are addressed in this paper in relation to the temperature dependent modeling of NPT IGBTs and diodes. Simulation and experimental results are presented and compared to validate the modeling approach.

Characterization and modeling of high-voltage field-stop igbts

The high-voltage field-stop (FS) insulated gate bipolar transistor (IGBT) is a promising power device for high-power applications thanks to the robust characteristics offered by the FS technology, which combines the inherent advantages offered by punch-through and nonpunch-through structures while overcoming the drawbacks of each structure. In this paper, an electrothermal physics-based model for the FS IGBT is developed. The model contains a detailed description of the FS layer and it is validated using experimental results for a commercial 1200-V/60-A FS IGBT over the entire temperature range specified in the data sheets. The validated model is then used to simulate a 6.5-kV FS IGBT. The simulation results are compared with experimental results published in the literature and good agreement is obtained.

On-state analytical modeling of IGBTs with local lifetime control

A two-dimensional on-state analytical model of the insulated gate bipolar transistor (IGBT) with local lifetime control is developed. The model accounts for the effect of local lifetime killing in particular the effective value of the lifetime and the position of the local lifetime control region on the excess carrier distribution in the IGBT during its on-state operation. It is shown that the local lifetime killing in the vicinity of the anode junction causes a reduction in the anode injection efficiency leading to improved on-state/turn-off behavior. The accuracy of the analytical model is verified through numerical simulations carried out using the MEDICI device simulator.

IGBT model validation for soft-switching applications

Techniques are described for validating the performance of insulated gate bipolar transistor (IGBT) circuit simulator models for soft-switching circuit conditions. The circuits used for the validation include a soft-switched boost converter similar to that used in power-factor correction, and a new half-bridge testbed that is specially designed to examine the details of IGBT soft-switching waveforms. The new testbed is designed to emulate the soft-switching circuit conditions of actual applications circuits, while allowing the easy change of IGBT operating conditions. The testbed also eliminates the problems of commutating diode noise and IGBT temperature rise found in actual application circuits. Simulations of IGBT models provided in circuit simulator component libraries are compared with measurements obtained using these test circuits for the soft-switching conditions of zero-voltage turn-on, zero-voltage turn-off, or zero-current turn-off. Finally, the results are summarized by comparing the switching energies for the various measurements and simulations presented in this work.

A review of IGBT models

In this paper, insulated gate bipolar transistor (IGBT) models published in the literature are reviewed, analyzed, compared and classified into different categories according to mathematical type, objectives, complexity, accuracy and speed. Features of the different models are listed. Different modeling criteria are discussed according to various circuit conditions, structures, thermal considerations and accuracies. Some problems and trends in IGBT modeling are discussed.

A comparison of IGBT models for use in circuit design

In choosing an accurate insulated gate bipolar transistor (IGBT) model for power electronic circuit design, physics-based models are frequently preferred due to their high accuracy and fast simulation speed in comparison to other types of models. In this paper, an experimental comparison of two such models is made, using parameters extracted from experimental measurements. The comparison focuses on two particular IGBTs-the BUP202 and the BUK854-representing the two common types of IGBT, respectively, the nonpunchthrough and the punchthrough IGBT. The models are investigated for the IGBT's operation in three situations typical of low-power (600 V, 10 A) applications.

A new analytical IGBT model with improved electrical characteristics

A new analytical insulated gate bipolar transistor (IGBT) model for improved on-state characteristics prediction is proposed. Two-dimensional (2-D) effects in the forward conduction of an IGBT are studied analytically. These effects significantly in8uence the on-state characteristics of the device and must be accounted for when IGBT modeling. Dynamic characteristics and temperature effects are included in the model. Both three-dimensional (3-D) numerical simulation and experimental results support the theoretical analysis.

Transient temperature measurements and modeling of IGBT's under short circuit

This paper discusses the estimation of possible device destruction inside power converters in order to predict failures by means of simulation. The study of insulated gate bipolar transistor (IGBT) thermal destruction under short circuits is investigated. An easy experimental method is presented to estimate the temperature decay in the device from the saturation current response at low gate-to-source voltage during the cooling phase. A comparison with other classical experimental methods is given. Three one-dimensional thermal models are also studied: the first is a thermal equivalent circuit represented by series of resistance-capacitance cells; the second treats the discretized heat-diffusion equation; and the third is an analytical model developed by building an internal approximation of the heat-diffusion problem. It is shown that the critical temperature of the device just before destruction is larger than the intrinsic temperature, which is the temperature at which the semiconductor becomes intrinsic. The estimated critical temperature is above 1050 K, so it is much higher than the intrinsic temperature (/spl sim/550 K). The latter value is underestimated when multidimensional phenomena are not taken into account. The study is completed by results showing the threshold voltage and the saturation current degradation when the IGBT is submitted to a stress (repetitive short circuit).

A Simplified Spice Model for IGBT

A simplified IGBT (Insulated Gate Bipolar Transistor) SPICE macromodel, based on its equivalent circuit, is proposed. This macromodel is provided to simulate various mechanisms governing the behavior of the IGBT, and it takes into account specific phenomena limiting its SOA (Safe Operating Area), such as forward and reverse biased SOA, as well as latch-up. The validity of this model is confirmed by comparison between simulation and experimental results as well as the data sheets. This comparison is tested for two IGBT devices showing two different powers and switching speeds, and a good agreement is recorded for both IGBT devices.

An experimentally verified IGBT model implemented in the Saber circuit simulator

A physics-based insulated gate bipolar transistor (IGBT) model is implemented in the general-purpose circuit simulator Saber. The IGBT model includes all of the physical effects that have been shown to be important for describing IGBTs, and the model is valid for general external circuit conditions. The Saber IGBT model is evaluated for the range of static and dynamic conditions in which the device is intended to be operated, and the simulations compare well with experimental results for all of the conditions studied. >

Insulated gate bipolar transistor (IGBT) modeling using IG-SPICE

A physics-based model for the insulated gate bipolar transistor (IGBT) is implemented into the widely available circuit simulation package IG-SPICE. Based on analytical equations describing the semiconductor-physics, the model accurately describes the nonlinear junction capacitances, moving boundaries, recombination, and carrier scattering, and effectively predicts the device conductivity modulation. In this paper, the procedure used to incorporate the model into IG-SPICE and various methods necessary to ensure convergence are described. The effectiveness of the SPICE-based IGBT model is demonstrated by investigating the static and dynamic current sharing of paralleled IGBTs with different device model parameters. The simulation results are verified by comparison with experimental results. >