Coefficient Of Thermal Expansion Mismatch Research Articles

Thermal cycling characterization of an integrated low-inductance GaN eHEMT power module

To exploit the potential of wide-bandgap semiconductors in high-frequency applications, innovative packaging designs are developed to minimize the parasitic inductance of power modules. This study presents an integrated power module with a hybrid PCB/DBC structure, which uses top-side cooling prepackaged GaN enhancement-mode high-electron-mobility transistors. The module achieves a remarkably low parasitic inductance of 2.65 nH. However, there is relatively scarce research on the reliability of this heterostructure, particularly its sensitivity to thermomechanical stress due to the coefficients of thermal expansion mismatch among material interfaces. In this work, the thermal cycling characteristics of the integrated power module are comprehensively investigated. Electrical and thermal parameters were periodically and separately measured offline on a simplified package to monitor the health conditions and decouple possible synergy and competition effects among the failure modes from all packaging components. A thorough failure analysis was conducted using nondestructive visual inspections and scanning acoustic microscopy, complemented by destructive cross-sectional examination and scanning electron microscopy. The findings identified the delamination of the DBC upper copper layer, which exhibited a conchoidal fracture interface, as the primary factor that contributed to the failure of the power module with increased thermal resistance. Furthermore, the study dissected its initiation and propagation mechanisms. This investigation provides valuable insights for the development of more reliable low-inductance power module designs.

High-performance GaN ultraviolet polarization-sensitive photodetector based on ferroelectric polarization LiNbO3

High responsivity ultraviolet (UV) photodetectors (PDs) are essential for abundant civilian and military applications. Gallium nitride (GaN) has emerged as an ideal material for UV PD fabrication due to its favorable properties. However, the quality of GaN epitaxial layers significantly impacts device performance and reliability. Sapphire-based GaN epitaxial growth technology enables the realization of high-quality GaN epitaxial layers, making it the preferred choice for GaN substrates. Nonetheless, the thermal expansion coefficient mismatch between sapphire and GaN can lead to crystal mismatch and stress accumulation at high temperatures, affecting device performance and reliability. In contrast, lithium niobate (LiNbO3) exhibits similar coefficients of thermal expansion to GaN, mitigating crystal mismatch and stress accumulation issues. Here, we report the realization of a GaN UV PD by laminating GaN membrane onto ferroelectric LiNbO3 through selective electrochemical etching of the sapphire-based GaN epitaxial film. The LiNbO3-based GaN PD achieves a specific high on/off ratio of 107. At a 5 V bias voltage, the device exhibits a high peak responsivity of 1.712 × 103 A/W under 325 nm laser illumination. Furthermore, the device demonstrates excellent performance for polarization light detection, with a polarization ratio of approximately 54.95. Exploiting the local ferroelectric polarization of x-cut LiNbO3, the photogenerated electron–hole pairs in GaN are efficiently separated by the electrostatic field from the polarization of ferroelectric LiNbO3, resulting in enhanced light-to-electric conversion efficiency. Our work presents a method for fabricating high responsivity GaN-based UV PD, showcasing the potential of integrating ferroelectric LiNbO3 to enhance device performance.

The effect of in situ-synthesized Y2SiO5 on the thermal shock resistance of Y2O3 ceramic materials

Y2O3 ceramics are increasingly recognized for their excellent vacuum stability and high-temperature chemical stability in the field of functional materials research. However, their poor thermal shock resistance renders them susceptible to spalling and damage during use, thus restricting further applications. To address this issue, the low thermal expansion coefficients of Y2SiO5 materials were leveraged. Through an in situ reaction between SiO2 and Y2O3, a Y2SiO5 phase was generated that induced a thermal expansion mismatch with Y2O3, thereby enhancing the thermal shock resistance of the ceramic. Using Y2O3 fine powder as the primary material, silica sol and nano-SiO2 were selected as reactive silicon sources to prepare Y2O3–Y2SiO5 composite ceramics at 1750 °C. The impact of the different silicon sources and Y2SiO5 phase content on the microstructure, mechanical, and thermal properties of the composite ceramics was studied. The results demonstrated that the in situ formation of Y2SiO5 significantly improved the thermal shock resistance of the composite ceramic. Specifically, increasing the SiO2 content led to a gradual rise in the volume fraction of Y2SiO5 formed between Y2O3 grains, thereby increasing the residual flexural strength and enhancing the hardness and elastic modulus. The low thermal expansion coefficient of Y2SiO5 reduced the overall thermal expansion coefficient of the composite material, thereby improving the thermal shock resistance. Moreover, the thermal expansion coefficient mismatch between the Y2O3 and Y2SiO5 phases induced numerous microcracks within the material, providing thermal stress relief within the microcracks and markedly improving the resistance of the ceramic to thermal shock.

Mechanical property analysis and optimization of nano-hydroxyapatite coated carbon fiber reinforced hydroxyapatite composites

Carbon fiber (CF) is one of ideal reinforcements to hydroxyapatite (HA) owing to its unique structure, excellent biocompatibility and high mechanical properties. However, the mechanical property of CF reinforced HA (CF/HA) composites cannot be effectively improved due to the mismatch in surface properties and thermal expansion coefficients between CF and HA. In order to solve the problems, nano-hydroxyapatite (nHA) coating with different thickness was fabricated on the CF surface. The effect of the coating thickness on mechanical property of nHA-coated CF/HA composites was studied by finite element analysis. The CF with proper nHA coating thickness was subsequently used to reinforce HA. The compressive strength of nHA-coated CF/HA composites was approximately 97.3 % and 164.6 % higher than those of the uncoated CF/HA composites and pure HA ceramics, respectively. The interface properties and crack propagation were analyzed by cohesive element in the finite element analysis. The toughening mechanism of the composites included interfacial debonding, crack deflection, crack branching, and crack bridging. The mechanical properties of nHA-coated CF/HA composites were enhanced due to the strong interfacial bonding strength and reducing cracking in HA matrix. The prepared nHA-coated CF/HA composites satisfy the requirement of the mechanical properties of human load-bearing bone. It can be used to prepare cages, plates, screws, pins and other compact bone substitute parts in bone grafting. The study provided a method for construction of nHA-coated CF/HA composites with the designed properties by adjusting the nHA coating on the fiber and can be used to design other fibers reinforced ceramic matrix composites.

Microstructural Modifications and Failure Mechanisms of an Aluminum‐Based Abradable Coating System during Isothermal and Cyclic Aging

Abradable systems are used in the aeronautical industry to improve the efficiency of gas turbine. Those materials are exposed in service to temperature up to 450 °C. The increase in gas turbine efficiency requires to increase the operating temperature and therefore the service temperature of abradable coating. The present study focuses on the isothermal and cyclic thermal aging of the Al–Si abradable coating system in a laboratory air at high temperature up to 500 °C. The investigation encompasses the microstructural evolution, phase transformation, and the formation of cracks, along with their interrelated effects. During aging, silicon particles precipitate in the abradable top coat. In addition, coarsening of those particles is observed and the coarsening kinetics appears to be faster in cyclic thermal aging conditions compared to isothermal aging. During cyclic and isothermal aging, brittle aluminides develope at the abradable top–coat/bond–coat interface, due to the interdiffusion of Al and Ni species. During cyclic aging, thermal cycles create thermomechanical stress at the top‐coat/bont‐coat interface due to coefficient of thermal expansion mismatch between the Al‐Si deposit and intermetallic phases. The stress generated results in the formation of cracks and porosities at the top–coat/bond–coat interface resulting in a dramatic failure of the system.

Photo‐Directed Growth of Surface Micro‐Patterns on Photosensitive Semicrystalline Polymers

AbstractPatterning polymeric materials with controllable microstructures can meet diversified requirements and realize promising applications. Exploring micro‐/nano‐pattern methodology offers possibilities for future techniques, however, the self‐organized growth of polymeric materials has some limitations and the development of direct and noncontact patterning processes is still challenging. In this work, the study presents a facile strategy for endowing polymers with spatially regulated microstructures by direct photo‐printing, which incorporates both advantages of typical top‐down and bottom‐up approaches. By employing the photodimerization of anthracene‐containing semi‐crystallized polymers, the gradient crosslinking results in a mismatch of thermal expansion coefficients between the crosslinked surface and the uncrosslinked bottom layer. After heating treatment, constrained by the crosslinked surface, the uncrosslinked bottom polymer of the molten state in the exposed region tends to flow and migrate toward the unexposed region, similar to a volcanic eruption, which accurately determines the height and morphology of pattern. Besides, the well‐defined patterns can controllably grow upon thermal treatment due to phase transformation and migration. The versatility of the proposed strategy not only provides a brand‐new reliable platform to pattern functional materials with photo‐regulated and reversible microstructures, but also promotes the development of smart materials that can find applications in information safety, reversible microfluidics, and electronic devices.

Microstructure evolution and mechanical properties of SiC and Nb joint brazed with AgCuTi/(Sr0.2Ba0.8)TiO3–Cu/AgCuTi composite fillers

In this study, robust silicon carbide (SiC)-niobium (Nb) joints were obtained using a composite filler consisting of a novel type of negative thermal expansion (Sr0.2Ba0.8)TiO3 particle–reinforced Cu composites (SBT-Cu) and an AgCuTi active filler. A systematic investigation was conducted to analyze the brazing temperatures and SBT-Cu thickness affect the microstructure and mechanical properties of brazed joints. The results indicated that the shear strength of SiC–Nb joints brazed with AgCuTi +80 μm SBT-Cu composite filler increased to 64 MPa at 900 °C for 15 min, which was an improvement of 146 % over the strength of joints brazed without SBT-Cu. The addition of the SBT-Cu interlayer relieved the coefficient of thermal expansion mismatch among SiC, AgCuTi and Nb. Meanwhile, the calculation results verified that the residual stresses in the joints were substantially reduced and that the coefficient of thermal expansion of the composite filler was reduced.

A comprehensive analysis of cermet design and thermal cyclic stability via elasto-viscoplastic crystal plasticity modeling

Ceramic-metal composites, or cermets, exhibit beneficial properties resulting in their use in many industrial applications. One challenge with cermets is mismatches in the coefficient of thermal expansion (CTE) values between the ceramic and metal phases that lead to residual stresses after processing, plasticity in the metal phase, internal stresses, and instability after thermal cycling. In order to make predictions of these properties to inform the design of cermets, we employ an incremental elasto-viscoplastic, self-consistent formulation to calculate the thermal, elastic, and plastic strains in two-phase polycrystalline cermet materials. This framework is extended to include temperature dependent properties, which are called implicitly within the temperature-dependent, incremental elasto-viscoplastic, self-consistent (TE-VPSC) model. Temperature-induced cooling and thermal cycling simulations are conducted using the TE-VPSC framework to study the residual stresses and plastic strains in the metal phases. Two materials are discussed in detail exhibiting stark differences based on the CTE between their ceramic and metal phases, WC/57-vol% Cu (exhibiting a pronounced CTE mismatch) and Y2O3/27-vol% Nb (exhibiting a negligible CTE mismatch). The model demonstrates high residual stresses in the Cu phase during processing and reverse plasticity leading to recovery of plastic strain during thermal cycling of the WC/Cu cermet. Moreover, the model demonstrates relatively low residual stresses and plasticity in Y2O3/Nb and a thermal stability point of 1251 °C, below which no plasticity develops in the cermet. We employ the TE-VPSC model as a design tool for cermets to systematically investigate the effects of process-induced microstructure variations (volume fraction, grain aspect ratio, and crystallographic texture are investigated) and compositional differences (19 compositions are explored) on the residual stress, degree of plasticity in the metal phase, and thermal stability point. The computational efficiency of the TE-VPSC framework makes it a desktop design tool that can be used to quantify the impact of changing composition, processing, and thermo-mechanical loading on the performance of the cermet, which can help reduce the number of time intensive and costly high temperature experiments.

First-principles study on thermal expansion of W-Re sigma and chi phases

We investigate how the Re content affects the coefficient of thermal expansion (CTE) of the non-stoichiometric W-based σ and χ phases, forming upon neutron irradiation of W, to explore and quantify its mismatch between precipitates (W-Re) and matrix (W). To this end, we have conducted first-principles calculations using two approaches: the Debye-Grüneisen (DG) model and the quasi-harmonic approximation (QHA). The two approaches yield different results: the QHA, which is deemed to be the most accurate of the two, predicts substantial changes with Re content, while the acoustic-modes based DG model does not. The CTE of the σ and χ at stable Re contents is compared to experimental values for bcc-W and bcc-W-Re containing 25 at.% Re. Taking bcc-W as a reference, we find a significant mismatch in CTE of up to 37% and 62% for σ and χ, respectively, which may contribute to thermal stress buildup in the material at elevated temperatures. The mismatch is shown to increase with the temperature and Re content for both phases. The produced data are used to fit a temperature and Re concentration-dependent analytical function of the CTE for both phases, which can be employed as input for continuum mechanical modeling.

Fabrication of penetrating pores in epitaxial Ge-on-Si through preferential etching along threading dislocations

Epitaxial Ge-on-Si possesses a high density of threading dislocations (TDs) due to the lattice mismatch and difference in thermal expansion coefficient. By employing the lattice distortion at the TDs, we demonstrate that penetrating pores along TDs can be formed in both p- and n-type heteroepitaxial Ge layers through a preferential etching. It has been found that the preferential etching at TD sites takes place in the porosification process of Ge-on-Si samples and is independent of the doping type and concentration. The penetrating pores follow the path of the TD lines and can penetrate the entire Ge layer of 1.3 μm to further porosificate the Si substrate. The effects of anodic current density and total etching duration have been thoroughly investigated on forming penetrating pores at TD sites. The dissolution mechanism in the porosification process has been revealed by dissolution valence calculation and recorded potential curves. Our findings shed light on Ge perforation in both p- and n-type Ge-on-Si and show great potential in Si-based integrated photonics and microelectronics.

Development of Ag@Si composite sinter joining with ultra-high resistance to thermal shock test for SiC power device: Experiment validation and numerical simulation

Owing to its cost-effectiveness and low coefficient of thermal expansion (CTE), micron Si is incorporated into sintered Ag matrix to develop an Ag@Si composite sintering strategy. The Si integration helps reduce cost and alleviate CTE-mismatch of Ag-sintered die attachments. An innovative Ag@Si composite sintering structure is achieved by low-temperature and pressure-less sintering process, where a possibly slight diffusion of native SiO2 on the Si surface toward Ag is indicated by TEM observation, enabling the integration of Ag and Si into one continuous network. Owing to the robust well-bonded composite sintering, the Ag@Si joining strategy provides mechanical/microstructural reliability far beyond the pure Ag sinter joining, demonstrating significant prospects in high-temperature interconnection applications. During the harsh thermal cycling (−50–250 °C), the mitigating effect of the Si addition on CTE mismatch is manifested through the substantial suppression of microstructure deterioration in Ag@Si joint that occurs in pure-Ag-sintered joint, while the shear strength retention rate is doubled. Detailed investigation into the mechanism for elevated performance was conducted by material property and Missies stress analysis. The incorporation of Si helps modify the CTE, elastic properties, and stress distribution of Ag@Si-sintered material, synergistically contributing to the satisfactory joining reliability.

Mechanically induced optical loss mechanism due to thermal expansion coefficient mismatch in micro-cavities with all-around stressor layers

Various excitation-induced loss mechanisms have been identified during the development of direct-gap semiconductor lasers. Recently, indirect-gap laser sources, particularly germanium (Ge) or GeSn based, have emerged due to silicon industry compatibility. Tensile strain is crucial for optical gain or low-threshold room-temperature operation in such media. This study investigates an excitation-induced optical loss mechanism of mechanical origin in Ge-based micro-cavities with all-around stressor layers, a popular platform for strain-engineered laser sources. Using Raman spectroscopy, photoluminescence, and simulations, we find that excitation lowers the optical gain by altering the strain profile. Heating causes Ge micro-cavities to expand within a constraining stressor layer, inducing compressive strain, which is explained by the mismatch in thermal expansion coefficients.

Exploring mounting solutions for cryogenically cooled thin crystal optics in high power density x-ray free electron lasers.

This study investigates three mounting methods-clamping, soldering, and a hybrid clamping-soldering approach-for cryogenically cooled thin diamond crystals crucial to stable operation of X-ray Free Electron Laser (XFEL) systems. While clamping methods exhibit temperature resilience and flexibility, meticulous design is required to prevent stress-induced warping and reduce thermal contact area. Soldering methods offer reliable mechanical and thermal bonding but encounter challenges due to the coefficient of thermal expansion mismatch at cryogenic temperatures. The hybrid method, integrating clamping and soldering with strain relief cuts, effectively mitigates overall distortion caused by mounting and XFEL thermal loads. These findings offer a novel mounting solution for high-performance x-ray optics in XFEL research and applications, ensuring stability and optimal functionality in cryogenic conditions.

Analysis of Cu-decorated Ti particles as a reinforcement for AZ91 alloys prepared using the powder metallurgy method

Magnesium (Mg) matrix composites (Mg-MMCs) with high strength and ductility properties are crucial for the development of lightweight automobiles. In this study, a novel method is proposed for fabricating Mg-MMCs by incorporating nanocopper (Cu) decorated titanium (Ti) particles (Cu@Ti) to reinforce AZ91 alloys. The in-situ generation of the AlCuMg phase at the interface between the Ti particles and the Mg matrix enhances interface integration and promotes the formation of massive twins. The 5.0 wt% Cu@Ti/AZ91 composite exhibits notable mechanical properties, with a yield strength of 238 MPa, ultimate tensile strength of 368 MPa, elongation of 12%, and modulus of elasticity of 46 GPa. These values represent increases of 8.9%, 5.3%, 50.0%, and 2.0%, respectively, compared to those of AZ91 alloys. The strengthening mechanism is mainly attributed to grain refinement strengthening, thermal expansion coefficient mismatch strengthening, Orowan strengthening, and load transfer strengthening. The plasticity improvement benefits from the optimization of the interface structure, grain refinement and twin formation.

Comprehensive material study of Ge grown by aspect ratio trapping on Si substrate

High-quality monolithic Ge-on-Si is sought for CMOS-compatible optoelectronic devices. We examine the structural characteristics of Ge-on-Si grown by the aspect ratio trapping (ART) method on a SiO2/Si(001) template in pre-patterned holes. Transmission electron microscopy and surface topography analysis revealed high-quality Ge islands overgrown from the ART holes in SiO2. The superior crystal quality of Ge ART growth was also confirmed by comparing x-ray diffraction (XRD) data of Ge ART and Ge planar epilayer samples. The XRD and micro-Raman data additionally show a small residual strain in the islands which vanishes by reducing the hole diameter from 280 nm to 180 nm, while leading to only a minor increase in the crystallographic inclinations of the Ge islands from 0.34 deg to 0.54 deg. With finite element method simulations, we find that the small residual strain in Ge originates during the cool-down from growth to room temperature because of thermal expansion coefficient mismatch between Ge and SiO2. A tensile force develops along the [001] axis of the Ge pillar whose faster shrinkage to the room temperature volume is restricted by the oversized surface island.

Microstructural development and oxidation resistance of MSi2-type multicomponent silicide coatings on Nb alloys by spark plasma sintering

MSi2-type multicomponent silicide coatings were prepared on Nb alloys by spark plasma sintering using mixed powders of Mo, Ta, W, Zr, Ti and Si. The coatings were composed of thick outer layers and thin inner layers (interdiffusion zone). A two-phase structure consisting of C11b (Mo,Ta,W,Ti)Si2 and C40 (Ti,Ta,Zr)Si2 was observed in the outer layers of all the coatings sintered for holding times ranging from 15 s to 5 min, but the distribution of these elements in each phase gradually became uniform with increasing holding time. The coatings demonstrated excellent protection during oxidation at 1300 °C for 100 h, and a continuous dense oxide scale mainly composed of ZrSiO4 and SiO2 was generated. The alternation of heating and cooling during oxidation caused cracks to appear at the interface between the outer layer and inner layer due to a mismatch of thermal expansion coefficients. However, crack extension was observed only along the inner layer toward the interior due to the multicomponent structure of the outer layer of the coating. The microstructural development and oxidation behavior of the coatings were discussed.

In-situ monitoring of carbon fiber/epoxy composite with FBG sensors under curing and thermal cycling conditions

Residual strains from curing process as well as thermal expansion behaviors in application process are critical to structural design of composites. Here we demonstrate the applicability of fiber Bragg grating (FBG) sensors for in-situ measurements of strain evolution in epoxy resin and unidirectional (UD) laminate under curing and thermal cycling conditions. The validity of the FBG sensors was verified by the TMA tests. From the data recorded by the sensors, the information about real-time gel point, strain/temperature evolution and residual strains during curing can be obtained. The epoxy resin and UD laminates have distinct curing histories and characteristics under the same curing conditions because of the exothermic reaction. During thermal cycling, we found that the coefficient of thermal expansion (CTE) of the UD laminate is directional dependent as is the residual strain, i.e., it increases with fiber orientation angle. In addition, the relaxation of partial residual strains, attributed to the mismatch in CTE between the specimen and the mold, was captured by FBG sensors around the glass transition temperature during the first thermal cycle.

Effect of Dew Point on the Selective Oxidation and Reactive Wetting of DP980 Steel during Hot‐Dip Galvanizing

The hot‐dip galvanizing behavior of an advanced high‐strength steel DP980 is investigated, focusing on selective oxidation and reactive wetting, as compared with interstitial‐free (IF) steel. The steels are annealed with varying dew points of −50, −25, and 0 °C, and then immersed in a galvannealing bath containing 0.13 wt% dissolved Al. The results show that higher concentrations of Mn and Si elements in DP980 steel result in an increase of nonwettable Mn2SiO4/MnSiO3. The increase in dew point does not promote the internal oxidation of alloying elements in DP980 as in IF steel, and DP980 displays the lowest external oxidation at −50 °C. After galvanizing, Mn and Si oxides are observed above the inhibition layer, which is due to the oxide cracking caused by the mismatch of thermal expansion coefficient between the surface oxides and the steel, and then the oxide flaking and incorporation are caused by the interfacial infiltration through cracks and the formation of intermetallic crystals of Fe–Al and subsequent Fe–Zn. Therefore, IF steel maintains good wetting in the presence of external oxides, while DP980 steel exhibits more external film oxides and poor coating quality at high dew points.

Production-related effects on the adhesive bondline performance of structural adhesives joining dissimilar materials

Adhesive bonding is a commonly used technology for joining dissimilar materials. However, production-related effects on the performance of the bondline have to be considered for an accurate joint design. In case of an adhesive joint in an automotive multi-material body in white, these effects arise from the so-called mismatch in thermal expansion coefficients, which leads to distortions of the adhesive in an uncured state or even damage in the cured one. The distortion of the uncured adhesive in the normal direction is called the ‘viscous fingering effect’, which reduces the adhesively bonded cross section by changing the adhesive bondline's shape to thin ‘fingers’ and therefore influences the materials properties. To investigate the effect of viscous fingering on the modulus, strength and energy release rate, linear butt bonded specimens and Tapered Double Cantilever Beams (TDCB) with different elongations of the adhesive bondline in the viscous state are investigated. The results are used to parameterize a cohesive zone model (CZM) and perform numerical analysis of the TDCB specimen for validation and to build up a model of a dissimilar joint consisting of a steel hatprofile and an adhesively bonded aluminum panel subjected to thermal distortions.

Numerical Study on the Influence of Polyimide Thickness and Curing Temperature on Wafer Bow in Wafer Level Packaging

In wafer level packaging, polyimide and electroplated copper are dielectric and conducting materials respectively in the so-called redistribution layers. During the wafer fabrication process large amount of stress is generated in those layers due to curing shrinkage of the polyimide and the coefficient of thermal expansion mismatch of both materials to silicon which can lead to severe wafer bow after a high temperature curing. In different applications polyimide can be used either only as passivation layer over electroplated copper, or polyimide is applied before the redistribution layer and then a second polyimide layer is applied as passivation. In the current study the effect of different polyimide integrations is investigated. In-situ wafer bow measurements and finite element method studies were conducted with samples, with and without polyimide below redistribution layer, exposed to different curing temperatures to understand the change in wafer bow and copper residual stress. It is observed that wafers with polyimide before redistribution layer show higher stress relaxation in copper with decreasing curing temperature, resulting therefore in a lower wafer bow. A good agreement is achieved between the experimentally measured and the simulated wafer bow.