Abstract

This study investigates three mounting methods-clamping, soldering, and a hybrid clamping-soldering approach-for cryogenically cooled thin diamond crystals crucial to stable operation of X-ray Free Electron Laser (XFEL) systems. While clamping methods exhibit temperature resilience and flexibility, meticulous design is required to prevent stress-induced warping and reduce thermal contact area. Soldering methods offer reliable mechanical and thermal bonding but encounter challenges due to the coefficient of thermal expansion mismatch at cryogenic temperatures. The hybrid method, integrating clamping and soldering with strain relief cuts, effectively mitigates overall distortion caused by mounting and XFEL thermal loads. These findings offer a novel mounting solution for high-performance x-ray optics in XFEL research and applications, ensuring stability and optimal functionality in cryogenic conditions.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.