Development Of Microelectronics Research Articles

Applications and Future Developments of Microelectronics and Integrated Circuit Technologies in Smart Home Systems

Applications and Future Developments of Microelectronics and Integrated Circuit Technologies in Smart Home Systems

Investigating the Incipient Dynamics of Nucleation and Growth in Electrodeposition: Uncovering Key Relationships for Strategic Exploitation

The objective of this study is to tailor the structure and properties of electrodeposited coatings through real-time parameter variations. Electrodeposition has been used for centuries to apply both functional and aesthetic coatings to a range of materials. This process is, in general, relatively simple, robust, and cost-effective for depositing films of one material onto another. These favorable characteristics though, have resulted in a deficiency in the fundamental understanding of time-dependent microstructural control and key relationships between process parameters and the resulting coating performance. The development of microelectronics and other devices that require increasingly tighter tolerances on coating deposition and performance, pushing the limits of what is currently achievable, has facilitated a resurgence in the advancement of electrodeposition technologies.While it is generally understood how changing parameters (e.g. potential, electrolyte composition, temperature, pH, etc.) affects the developing coating, much of this work has been done through empirical research and post-mortem correlations. Herein, we develop a methodology for tailoring coating structure (size, shape, and texture) to exploit different physical properties (hardness, ductility, electrical conductivity, etc.) of electrodeposited coatings through parameter variation and direct linkage to observable events and physical characteristics in real-time. Modern instruments such as transmission electron microscopy (TEM) and small-angle electron scattering (SAXS) theoretically have the ability to observe these phenomena, with both time and spatial resolution falling in range of physical requirements. However, few studies have developed or demonstrated these techniques for in-situ measurements.In this presentation, preliminary experiments utilizing nickel (Ni) and silver (Ag) salt electrolytes as model systems for the investigation of incipient nucleation and growth behavior of electrodeposited Ni and Ag coatings will be defined, as well as confirmation of SAXS as a complementary technique for characterizing island growth in the first stages of deposition. Electrochemical techniques including cyclic voltammetry and chronoamperometry were applied to study the nucleation mechanisms for these materials. Additionally, potentiostatic electrodeposition was used to deposit the nanoparticle islands. For this study, we artificially promoted instantaneous growth of the coating using an initial “seed” pulse, followed by a subsequent growth pulse. This serves to improve the monodispersity of the islands that are deposited on the substrate surface, simplifying the analysis of the initial SAXS measurements.Utilization of a laboratory-source SAXS and wide-angle x-ray scattering (WAXS) instrument for physical and chemical characterization of island growth allowed us to quickly characterize the deposited particles. A comparison of these measurements to equivalent SEM/EDS imaging of the samples for size, shape, number density, and elemental composition confirmation of the deposited particles will also be described. Additionally, we will briefly discuss the state of the literature and our current plans for transitioning these post-mortem experiments to in-situ measurements, allowing for time resolved data, directly observing nucleation and growth of electrodeposited coatings to be collected.

Compatibility of LiPON with Different Current Collector Materials for Anode-Free Configuration

The current development of microelectronics requires mature micro energy storage devices. Such devices include, among others, micro batteries. The working principle of such micro batteries does not differ from traditional batteries. However, there are some particular aspects that distinguish them. The first one is that organic liquid electrolytes should be avoided due to their flammability and risk of leakage. Additionally, a great attention must be paid to the energy density of the included materials, since the final aim is the miniaturization [1]. In this sense, the use of thin film deposition techniques becomes crucial for micro batteries fabrication [2,3]. Among these techniques, sputtering constitutes an interesting choice, due to the possibility it offers to transfer the composition of a source target material to a substrate. As a result, thin compact layers with a well-controlled thickness can be obtained.Regarding the solid-state electrolyte, LiPON is an interesting candidate due to the stability it reportedly offers for lithium plating-stripping [4]. A stable lithium cycle is fundamental for its use as metallic lithium anode or, taking a step further, for an anode-free configuration. Indeed, such king of configuration allows a great degree of device compactness, which is convenient when the miniaturization prosecuted [5].This works aims at shed some light into the compatibility of LiPON thin films with different current collector materials. Sputtered LiPON thin films have been deposited in contact with different metals, and the produced samples have been characterised with electrochemical techniques such as Charge-Discharge, combined with materials characterization ones such as SEM. The obtained results have allowed to individuate how the plating-stripping of lithium is sustained by LiPON coupled with the different materials. 1] L. Y. e. al, "On-Chip Batteries for Dust-Sized Computers," Advanced Energy Materials, vol. 12, p. 2103641, 2022. [2] B. J. Neudecker, N. J. Dudney and J. B. Bates, ""Lithium‐Free" Thin‐Film Battery with In Situ Plated Li Anode," J. Electrochem. Soc., vol. 147, no. 517, 200. [3] T. Yamamoto, H. Iwasaki, Y. Suzuki, M. Sakakura, Y. Fujii, M. Motoyama and Y. Iriyama, "A Li-free inverted-stack all-solid-state thin film battery using crystalline cathode material," Electrochemistry Communications, vol. 105, 2019. [4] P. Albertus, S. Babinec, S. Litzelman, A. Newman, “Status and challenges in enabling the lithium metal electrode for high-energy and low-cost rechargeable batteries,” Nature Energy, pp 16-21, 2018 [5] A.G.A.M.S. Nanda, “Anode-Free Full Cells: A pathway to High-Energy Density Lithium-Metal Batteries,” Advanced Energy Materials, vol. 11, 2021.

Influence of the Sputtering and Annealing Conditions in the Obtained LiFePO4 Thin Film Cathodes

The current development of microelectronics requires mature micro energy storage devices. Such devices include, among others, micro batteries. The working principle of such micro batteries does not differ from traditional batteries. However, there are some particular aspects that distinguish them. The first one is that organic liquid electrolytes should be avoided due to their flammability and risk of leakage. Additionally, a great attention must be paid to the energy density of the included materials, since the final aim is the miniaturization [1]. In this sense the use of thin film deposition techniques becomes crucial for micro batteries fabrication [2,3]. Among these techniques, sputtering constitutes an interesting choice, due to the possibility it offers to transfer the composition of a source target material to a substrate. As a result, thin compact layers with a well-controlled thickness can be obtained. Regarding the cathodic element of the battery, LiFePO4 thin film layers have been attracting some attention due to their compromise between cost, performance, and material availability [4]. In this study, LiFePO4 thin film cathodes have been sputtered on silicon wafers. Electrochemical characterization techniques (Cyclic Voltammetry and Charge-Discharge) have been combined with material characterization ones (XRD) with the aim of understanding how a potential contact with air during the deposition process could affect the amount of olivine LiFePO4 phase in the film, and, subsequently, the capacity of the cathodic layer. The obtained results have facilitated a better understanding of the material’s performance according to the obtained composition. 1] L. Y. e. al, "On-Chip Batteries for Dust-Sized Computers," Advanced Energy Materials, vol. 12, p. 2103641, 2022. [2] B. J. Neudecker, N. J. Dudney and J. B. Bates, ""Lithium‐Free" Thin‐Film Battery with In Situ Plated Li Anode," J. Electrochem. Soc., vol. 147, no. 517, 200. [3] T. Yamamoto, H. Iwasaki, Y. Suzuki, M. Sakakura, Y. Fujii, M. Motoyama and Y. Iriyama, "A Li-free inverted-stack all-solid-state thin film battery using crystalline cathode material," Electrochemistry Communications, vol. 105, 2019. [4] V. A. Sugiawati, F. Vacandio, C. Perrin-Pellegrino, A. Galeyeva, A. P. Kurbatov, T. Djenizian "Sputtered Porous Li-Fe-P-O Film Cathodes Prepared by Radio Frequency Sputtering for Li-ion Microbatteries" Scientific Reports, vol. 9, 2019.

Experimental investigation on the start-up and thermal performance of nanofluid-based pulsating heat pipe

The increasing demand of efficient heat dissipation especially for high heat flux and is essential due to the rapid development of microelectronics. Pulsating heat pipe with simple structure, fast response and excellent heat transfer performance plays an important role in this area of thermal management. In this study, a three-turns pulsating heat pipe using nanofluids of PbS/H2O, Au/H2O, Graphene/H2O is investigated experimentally. The flow pattern is described and the thermal behavior of nanofluid-based pulsating heat pipe is compared with deionized water. Then, main factors affecting the heat transfer performance are studied comprehensively. Results show that pulsating heat pipe using nanofluids exhibits superior start-up characteristics and heat transfer performance compared to deionized water. The addition of nanoparticles facilitates the phase transition within the pulsating heat pipe, which increasing both the transient velocity and driving force of oscillatory motion, thereby improving the heat transfer efficiency. Furthermore, Graphene/H2O presents the highest heat transfer performance among three nonfluids and the maximum is achieved at concentration of 1.0 wt%, filling ratio of 80% and tilt angle of 60°. The most inefficient process is located at the heat transfer from condensation to the environment, highlighting the improvement of cooling conditions for nanofluid-based pulsating heat pipe.

First experimental results on Ignite0: A prototype pixel front-end ASIC with timing in 28 nm

This contribution presents the results of the first test activity on the Ignite-0 ASIC. The main challenge of this microelectronics development is to reach an overall time resolution of at least 50 ps, on a pixel front-end ASIC within the constraints defined by high-luminosity HEP experiments.Ignite-0 has been developed during 2023 in order to test individually the building blocks for the future developments on the front-end ASIC. It contains mainly the pixel front-end electronics such as the Analog Front-End and the Time to Digital Converter, but it also integrates various service blocks. All the integrated blocks have been designed to satisfy the desired requirements and constraints both in terms of power, performance and form-factor.

Design and Implementation of an Intelligent Ultrasonic System based on 51 Microcontroller

With the rapid development of microelectronics and intelligent technology, microcontroller units (MCUs) are increasingly applied in various fields. This paper proposes the design and implementation of an intelligent ultrasonic system based on a 51 microcontroller, integrating ultrasonic sensors, an LCD display, and a 51 MCU to achieve real-time distance measurement, data display, and intelligent control functions. The system utilizes a CD4069 ultrasonic sensor to transmit and receive ultrasonic waves, measuring the distance between the sensor and an object by calculating the time difference between transmission and reception. The measured distance data is processed and displayed on an LCD screen in real-time. Furthermore, the system features intelligent control capabilities, automatically adjusting and controlling devices based on the measured data, thereby enhancing the system's level of intelligence. The intelligent ultrasonic system based on the 51 microcontroller offers advantages such as low cost, high precision, and strong versatility. It can be widely used in various fields, including intelligent robots, obstacle avoidance systems, and automatic parking systems. The design and implementation of this system not only demonstrate innovative applications of ultrasonic ranging technology but also provide valuable references for the extensive application of microcontroller units in intelligent technology fields.

Versatile Landscape of Low-k Polyimide: Theories, Synthesis, Synergistic Properties, and Industrial Integration.

The development of microelectronics and large-scale intelligence nowadays promotes the integration, miniaturization, and multifunctionality of electronic and devices but also leads to the increment of signal transmission delays, crosstalk, and energy consumption. The exploitation of materials with low permittivity (low-k) is crucial for realizing innovations in microelectronics. However, due to the high permittivity of conventional interlayer dielectric material (k ∼ 4.0), it is difficult to meet the demands of current microelectronic technology development (k < 3.0). Organic dielectric materials have attracted much attention because of their relatively low permittivity owing to their low material density and low single bond polarization. Polyimide (PI) exhibits better application potential based on its well permittivity tunability (k = 1.1-3.2), high thermal stability (>500 °C), and mechanical property (modulus of elasticity up to 3.0-4.0 GPa). In this review, based on the synergistic relationship of dielectric parameters of materials, the development of nearly 20 years on low-k PI is thoroughly summarized. Moreover, process strategies for modifying low-k PI at the molecular level, multiphase recombination, and interface engineering are discussed exhaustively. The industrial application, technological challenges, and future development of low-k PI are also analyzed, which will provide meaningful guidance for the design and practical application of multifunctional low-k materials.

Dielectric thermally conductive boron nitride/silica@MWCNTs/polyvinylidene fluoride composites via a combined electrospinning and hot press method

With the development of microelectronics towards integration, miniaturization and high power, the accumulation of heat in this small space has become a serious problem. Therefore, polymer matrix composites with high thermal conductivity and electrical insulation need to be developed urgently. Here, an ordered oriented boron nitride/silicon dioxide (silica) coated multiwalled carbon nanotubes (BN/SiO2@MWCNTs) thermally conductive network was constructed in a polyvinylidene fluoride (PVDF) matrix by electrostatic spinning technique, and subsequently the PVDF composites were prepared by hot-pressing. The synergistic effect of two-dimensional BN and one-dimensional MWCNTs in PVDF was investigated. It was found that the out-of-plane thermal conductivity of BN30/SiO2@MWCNTs composites reached 0.4693 Wm−1 K−1, which was 209% higher than that of pure PVDF and 10% higher than that of BN/PVDF composites. The in-plane thermal conductivity of BN30/SiO2@MWCNts) composites reached 1.5642 Wm−1 K−1, which was 1055% higher than pure PVDF and 40% higher than BN/PVDF composites. This is attributed to the synergistic effect of BN on SiO2@MWCNTs. Meanwhile, the volume resistivity and breakdown strength of the BN/SiO2@MWCNTs/PVDF composites reached 3.6 × 1013 Ω m and 47.68 kV/mm, respectively. The results indicate that the BN30/SiO2@MWCNTs/PVDF composites have excellent thermal conductivity and electrical insulating properties, which are promising for microelectronics applications.

Modern technologies of early diagnosis of wound infection

The article presents an analysis of the data of modern literature devoted to the study of early diagnosis of wound infection. It is well known that wound healing is a very complex and dynamic mechanism of wound re-epithelialization. At the same time, the normal microflora of the skin plays an important function for maintaining homeostasis and the formation of the skin. There are about 1000 species of microorganisms belonging to the normal flora of human skin and do not cause any harm to healthy people. At the same time, there are microorganisms that, when they enter the wound, lead to the development of infectious complications of wounds as a result of a violation of the integrity of the skin. They include both gram-positive (Staphylococcus aureus, Staphylococcus epidermidis) and gram-negative bacteria (Escherichia coli, Proteus mirabilis, Pseudomonas aeruginosa, Enterobacter spp., Morganella spp., etc.). Early detection of these microorganisms will contribute to timely and high-quality treatment of wound infection. Currently, there are certain conditions that limit the use of microbiological research methods used to establish a clinical diagnosis of wound infection (long duration, labor intensity, required level of qualification of specialists, etc.). This dictates the need to develop new, fast and easy-to-use methods for diagnosing wound infection. To this end, a group of researchers from Russia (Skolkovo Institute of Science and Technology) and the USA (University of Texas at Austin) have recently developed wearable sensors for the diagnosis of wound infection. These sensors can be embedded in wound dressings and are able to detect certain biomarkers indicating the presence of wound infection. Among these biomarkers, pH and uric acid are the most commonly used, but there are many others (lactic acid, oxygenation, inflammatory mediators, bacterial metabolites or the bacteria themselves). Currently, the development of microelectronics, the emergence of biochemical sensors, active microfluidics and painless microneedles have led to the creation of new generations of wearable biosensors that provide completely new opportunities in the fight against wound infection.

Hybrid effect on mechanical and thermal performance of copper matrix composites reinforced with SiC whiskers

The rapid development of micro-electronics has a growing demand on the heat dissipation performance of devices, especially thermal management materials. However, recent researches focus on the improvement of single ability, such as thermal or mechanical properties. Herein, a strategy that simultaneously improves thermal and mechanical performance of thermal manager material was proposed, which was achieved by preparing Cu-SiCw composites via the co-electrodeposition technology. The influence of electroplating parameters, such as temperature, current density and reinforcement contents, on the microstructure evolution, mechanical and thermal conductivity were investigated systematically. The fabricated SiCw composite displayed excellent shear strength up to 420 MPa, which is resulted from the Orowan strengthening and load transferring. Additionally, the thermal conductivity of 340 W/(m·K) was obtained, owing to the uniform distribution of whiskers and good interface between the Cu matrix and whiskers. Therefore, the presented work provided an effective method for fabricating comprehensive thermal-mechanical properties and homogeneous heat dissipation capacity Cu-SiCw composites and paved the way for the practical application in the field of the connector between the power devices and heat sinks.

A review of microfabrication approaches for the development of thin, flattened heat pipes and vapor chambers for passive electronic cooling applications

With the rapid development of microelectronics and the telecommunication industry, a variety of high performance, portable and slim electronic devices have become available. Miniaturization of devices and increased packing density of electronics can generate “hot spots” i.e. a high heat flux on a small area. Thus, in such devices the heat management requirements go beyond the limits of typical approaches and the development of miniaturized, high-performance thermal management concepts to cool high-performance, compact electronic devices is urgently required. To this direction, micro and nanofabrication methods can provide solutions in both miniaturizing existing concepts of passive cooling as well as in improving their performance. In this review, we start by introducing the most commonly used metrics used to evaluate the performance of passive cooling devices (i.e. vapor chambers and flattened heat pipes) together with the most prominent performance limitations. Then, in the main part, we present state of the art examples of microfabricated, thin vapor chambers and flattened heat pipes on rigid substrates (i.e. using metals and silicon), but also vapor chambers on thin and flexible polymeric or composite materials. Finally, the main conclusions and the steps which should be followed to further enhance the performance of such devices are summarized in the conclusions and future perspectives section.

Morphological, electrical, and electromagnetic characterization of nanometric films of Cu and Ni and their combination in bilayers

Modern developments in telecommunication and microelectronics have resulted in spurious radiation, which can promote electromagnetic interference and environmental pollution. To minimize this problem, this work studied nanometric metallic films (65 nm/layer) based on Cu and Ni and their combinations in bilayers deposited on a polyethylene terephthalate substrate by magnetron sputtering. Field emission gun scanning electron microscopy analyses showed that the films have different morphological textures, due to the processing parameters and the free energy of the metals. Electrical measurements by the 4-point method and dielectric spectroscopy showed that the films have low conductivity values, due to oxides formed on the surfaces of the films and defects. X-ray diffraction confirmed the formation of metallic oxides in the films. Electromagnetic characterization (8.2-12.4 GHz) of the monolayer films showed poor performance. Meanwhile, the bilayer films (Ni/Cu and Cu/Ni) showed different behaviors with reflection and absorption contributions. Attenuation values close to 95 % for the Cu/Ni film were obtained.

Dual-Effect Coupling for Superior Dielectric and Thermal Conductivity of Polyimide Composite Films Featuring "Crystal-Like Phase" Structure.

To match the increasing miniaturization and integration of electronic devices, higher requirements are put on the dielectric and thermal properties of the dielectrics to overcome the problems of delayed signal transmission and heat accumulation. Here, a 3D porous thermal conductivity network is successfully constructed inside the polyimide (PI) matrix by the combination of ionic liquids (IL) and calcium fluoride (CaF2 ) nanofillers, motivated by the bubble-hole forming orientation force. Benefiting from the 3D thermal network formed by IL as a porogenic template and "crystal-like phase" structures induced by CaF2 - polyamide acid charge transfer, IL-10 vol% CaF2 /PI porous film exhibits a low permittivity of 2.14 and a thermal conductivity of 7.22 W m-1 K-1 . This design strategy breaks the bottleneck that low permittivity and high thermal conductivity in microelectronic systems are difficult to be jointly controlled, and provides a feasible solution for the development of intelligent microelectronics.

High uncertainty aware localization and error optimization of mobile nodes for wireless sensor networks

&lt;p&gt;The localization of mobile sensor nodes in a wireless sensor network (WSN) is a key research area for the speedy development of wireless communication and microelectronics. The localization of mobile sensor nodes massively depends upon the received signal strength (RSS). Recently, the least squared relative error (LSRE) measurements are optimized using traditional semidefinite programming (SDP) and the location of the mobile sensor nodes was determined using the previous localization methods like least squared relative error and semidefinite programming (LSRE-SDP), and approximate nonlinear least squares and semidefinite programming (ANLS-SDP). Therefore, in this work, a novel high uncertainty aware-localization error correction and optimization (HUA-LECO) model is employed to minimize the aforementioned problems regarding the localization of mobile sensor nodes and enhance the performance efficiency of root mean square error (RMSE) results. Here, the position of target mobile sensor nodes is evaluated based on the gathered measurements while discarding faulty data. Here, an iterative weight updation approach is utilized to perform localization based on Monte Carlo simulations. Simulation results show significant improvement in terms of RMSE results in comparison with traditional LSRE-SDP and ANLS-SDP methods under high uncertainty.&lt;/p&gt;

Current status and applications of photovoltaic technology in wearable sensors: a review

The rapid development of wearable sensor technology can be attributed to developments in materials, microelectronics, fabrication, communication systems, and Artificial Intelligence (AI). The use of wearable sensors enables continuous acquisition and monitoring of the pathophysiological parameters of a person in real time. The global market for health-related wearables has experienced significant growth, particularly in response to the COVID-19 pandemic. A wearable sensor module is comprised of various components, including a powering unit, sensor(s), acquisition unit, communication unit, and processing unit. The non-fluctuating power source with a long life is of utmost significance to the continuous and real-time operation of a wearable sensor. A wearable device can be powered by a rechargeable battery, such as a lithium-ion battery, which can be charged from a standard power source but requires regular recharging after depletion and has a negative environmental impact. This necessitates using green renewable energy sources like photovoltaic cells, piezoelectric generators, wind energy converters, and thermoelectric generators for powering wearable sensor modules. The photovoltaic cell that converts photonics into electrical energy is deemed a viable green energy source for wearable sensor modules. This article reviews the progress and application of photovoltaic technology in wearable sensor modules.

Close-Range Transmission Line Inspection Method for Low-Cost UAV: Design and Implementation

With the rapid development of microelectronics, unmanned aerial vehicles (UAVs) for electric inspection tasks have become popular. Among these tasks, transmission line inspections are more complicated than component and tower inspections owing to the small size, poor functionality, and severe magnetic field interference of transmission lines. Existing solutions invariably use high-precision devices and maintain safety distances during inspections. However, capturing detailed transmission line information over long distances is challenging. Moreover, sophisticated equipment implies high costs and considerable value risks. This work proposes a method using RGB cameras and mm-wave radar to accomplish close-range transmission line inspections. A heading correction and two correction modules address waypoint mission mismatch and wind interference during tracking. In addition, adaptive complementary fusion is designed to solve anomaly identification. Finally, the proposed method validated in a 10 kV transmission line environment demonstrates successful close-range inspection while acquiring high-definition (HD) images. The validation results prove the practical feasibility of the proposed low-cost transmission line inspection method, which is of great significance for reducing inspection costs and promoting the popularization of UAV inspections.

Current Trends and Promising Electrode Materials in Micro-Supercapacitor Printing.

The development of scientific and technological foundations for the creation of high-performance energy storage devices is becoming increasingly important due to the rapid development of microelectronics, including flexible and wearable microelectronics. Supercapacitors are indispensable devices for the power supply of systems requiring high power, high charging-discharging rates, cyclic stability, and long service life and a wide range of operating temperatures (from -40 to 70 °C). The use of printing technologies gives an opportunity to move the production of such devices to a new level due to the possibility of the automated formation of micro-supercapacitors (including flexible, stretchable, wearable) with the required type of geometric implementation, to reduce time and labour costs for their creation, and to expand the prospects of their commercialization and widespread use. Within the framework of this review, we have focused on the consideration of the key commonly used supercapacitor electrode materials and highlighted examples of their successful printing in the process of assembling miniature energy storage devices.

Highly thermal conductive and flame retardant poly(vinyl alcohol) film with synergistic alignments of boron nitride nanosheets/Ti3C2Tx MXene for thermal interface materials

With the development of microelectronics and flexible wearable electronic devices, poly(vinyl alcohol) (PVA) based thermal interface materials (TIMs) have received much attention. However, poor heat dissipation and high flammability have emerged as the key issues that restrict their application. In this work, the directional alignment of phytic acid (PA) modified boron nitride nanosheets (BNNS) and Ti3C2Tx MXene in PVA matrix was achieved by ice-templated assembly, which simultaneously enhanced the flame retardancy and thermal conductivity of PVA composite films (PVA/BTx). Owing to the synergistic effect between oriented BNNS and Ti3C2Tx MXene on forming the thermally conductive network within PVA matrix, the in-plane thermal conductivity of PVA/BTx-30 composite film was increased to 8.54 W m−1 K−1, much higher than that of PVA film (0.30 W m−1 K−1). Meanwhile, the heat dissipation process of PVA films applied as TIMs was simulated, which showed that PVA/BTx-30 films exhibited excellent thermal conduction and significantly decreased the operation temperature of electronic devices. Additionally, the peak heat release rate (PHRR) and total heat release (THR) of PVA/BTx-30 films were reduced by 60.3% and 62.0%, respectively, showing good flame retardancy. Importantly, the flexible Ti3C2Tx nanosheets further enhanced the mechanical properties of PVA/BTx composite films. Therefore, this work provides an effective method for the preparation of high thermal conductivity and flame retardant composite materials, which has important potential applications in the microelectronics industry.

New Insights into the Microchannel Heat Sink with Cantor Fractal Structure by Using Simulated Annealing Algorithm

Efficient microchannel cooling is the key to the development of microelectronics. The key to solving this problem is the geometry of the microchannel heat sink and the thermophysical properties of the fluid. We combined the cantor fractal principle with the microchannel heat sink to design a new type of three-dimensional microchannel structure. Thermal resistance is treated as a single objective function, and the simulated annealing process is utilized to minimize it and achieve satisfying results. When the Reynolds number (Re)[Formula: see text]100, the aspect ratio of the microchannel entrance ([Formula: see text]), the aspect ratio of the Cantor fractal baffle ([Formula: see text] and the ratio of the width of the entrance of the microchannel to the length of the mixing unit ([Formula: see text] are optimized. The important factors that affect the thermal resistance of the microchannel are the size and spacing of the baffle. Then the pressure drop and heat transfer under different Res were analyzed. The study found that the structure of the groove and baffle based on the cantor fractal principle will cause chaotic flow and greatly enhance the heat transfer performance. Compared with the reference microchannel, the comprehensive heat transfer coefficient PEC is greater than 1, the thermal resistance is reduced by 19.82%.