Abstract
Efficient microchannel cooling is the key to the development of microelectronics. The key to solving this problem is the geometry of the microchannel heat sink and the thermophysical properties of the fluid. We combined the cantor fractal principle with the microchannel heat sink to design a new type of three-dimensional microchannel structure. Thermal resistance is treated as a single objective function, and the simulated annealing process is utilized to minimize it and achieve satisfying results. When the Reynolds number (Re)[Formula: see text]100, the aspect ratio of the microchannel entrance ([Formula: see text]), the aspect ratio of the Cantor fractal baffle ([Formula: see text] and the ratio of the width of the entrance of the microchannel to the length of the mixing unit ([Formula: see text] are optimized. The important factors that affect the thermal resistance of the microchannel are the size and spacing of the baffle. Then the pressure drop and heat transfer under different Res were analyzed. The study found that the structure of the groove and baffle based on the cantor fractal principle will cause chaotic flow and greatly enhance the heat transfer performance. Compared with the reference microchannel, the comprehensive heat transfer coefficient PEC is greater than 1, the thermal resistance is reduced by 19.82%.
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