In this research, an experimental investigation was carried out to investigate the interaction between various turning parameters and different minimum quantity lubrication (MQL) flow rates and compare their effects on chip shape and surface integrity characteristics in low speed turning and high speed turning of AA6061-T6. The turning parameters included cutting speed, feed rate, and depth of cut. The flow rates comprised 3.5 $$\mathrm{ml}/\mathrm{min}$$ , 10 $$\mathrm{ml}/\mathrm{min}$$ , and 15 $$\mathrm{ml}/\mathrm{min}$$ , and the surface integrity characteristics consisted of average arithmetic surface roughness, height peak from the valley, and axial and hoop surface residual stresses. The results showed that cutting conditions including cutting speed, feed rate, and depth of cut affected chip shape, while MQL flow rate had no impact on chip shape. The lowest values of cutting speed, feed rate, and depth of cut, equal to 145 $$\mathrm{m}/\mathrm{min}$$ , 0.07 $$\mathrm{mm}/\mathrm{rev}$$ , and 0.66 $$\mathrm{mm}$$ , respectively, resulted in the smallest residual stresses for all the flow rates. Moreover, the smallest surface roughness parameters were obtained at the lowest feed rate (0.07 $$\mathrm{mm}/\mathrm{rev}$$ ) for all the flow rates, whereas there were high interaction effects between cutting speed and flow rate and depth of cut and flow rate. Finally, turning with the minimum quantity lubrications of 3.5 $$\mathrm{ml}/\mathrm{min}$$ and 10 $$\mathrm{ml}/\mathrm{min}$$ , respectively, is suggested to obtain the best overall surface integrity characteristics. These lower values of flow rate are suitable to reduce machining costs, protect the environment, and preserve the machinist’s health. Since most of the previous research studies focused on the comparison of the turning environments including dry, MQL, wet, and cryogenic and only a few research works on the comparative analysis of MQL turning with different flow rates were carried out, the results of the present research can be utilized as a reference for future works in this field.