Low Threading Dislocation Density Research Articles

Defect analysis in AlGaN layers on AlN templates obtained by epitaxial lateral overgrowth

The defect distribution in thick AlN layers obtained by epitaxial lateral overgrowth (ELO-AlN) has been analyzed as a function of the miscut direction of the patterned sapphire substrate. A 0.25° miscut toward the sapphire a-plane leads to formation of smooth ELO-AlN layers containing vertical coalescence grain boundaries and exhibiting an almost homogeneous threading dislocation (TD) distribution with a TD density ranging from 5×108cm−2 to 8×108cm−2. In contrast, a 0.25° miscut toward the sapphire m-plane results in formation of periodically arranged macrosteps on the surface of the coalesced ELO-AlN layers as well as formation of inclined coalescence grain boundaries leading to an inhomogeneous TD distribution. A subsequent AlxGa1−xN deposition onto ELO-AlN template with surface macrosteps leads to Ga enrichment on the step sidewalls and, for lower Al-contents (e.g. x=0.5), even to additional defect formation. For higher Al contents (e.g. x=0.8) no additional threading dislocations are formed in the AlGaN layers and the observed TD density corresponds to that of the ELO-AlN template: less than 108cm−2 in the wing regions and from 6×108cm−2 to 9×108cm−2 above the ridges. Compressive strain during growth of Al0.8Ga0.2N on ELO-AlN tends to be compensated by threading dislocation inclination. However, due to the low TD densities the inclination angles are more than 3 times larger than those observed in Al0.8Ga0.2N layers on planar AlN/sapphire templates.

High-electron-mobility GaN grown on free-standing GaN templates by ammonia-based molecular beam epitaxy

The dependence of electron mobility on growth conditions and threading dislocation density (TDD) was studied for n−-GaN layers grown by ammonia-based molecular beam epitaxy. Electron mobility was found to strongly depend on TDD, growth temperature, and Si-doping concentration. Temperature-dependent Hall data were fit to established transport and charge-balance equations. Dislocation scattering was analyzed over a wide range of TDDs (∼2 × 106 cm−2 to ∼2 × 1010 cm−2) on GaN films grown under similar conditions. A correlation between TDD and fitted acceptor states was observed, corresponding to an acceptor state for almost every c lattice translation along each threading dislocation. Optimized GaN growth on free-standing GaN templates with a low TDD (∼2 × 106 cm−2) resulted in electron mobilities of 1265 cm2/Vs at 296 K and 3327 cm2/Vs at 113 K.

GaN-based high-electron-mobility transistor structures with homogeneous lattice-matched InAlN barriers grown by plasma-assisted molecular beam epitaxy

Metal-polar In0.17Al0.83N barriers, lattice-matched to GaN, were grown under N-rich conditions by plasma-assisted molecular beam epitaxy. The compositional homogeneity of these barriers was confirmed by plan-view high-angle annular dark-field scanning transmission electron microscopy and atom probe tomography. Metal-polar In0.17Al0.83N/(GaN)/(AlN)/GaN structures were grown with a range of AlN and GaN interlayer (IL) thicknesses to determine the optimal structure for achieving a low two-dimensional electron gas (2DEG) sheet resistance. It was determined that the presence of a GaN IL was necessary to yield a 2DEG sheet density above 2 × 1013 cm−2. By including AlN and GaN ILs with thicknesses of 3 nm and 2 nm, respectively, a metal-polar In0.17Al0.83N/GaN/AlN/GaN structure regrown on a GaN-on-sapphire template yielded a room temperature (RT) 2DEG sheet resistance of 163 Ω/□. This structure had a threading dislocation density (TDD) of ∼5 × 108 cm−2. Through regrowth on a free-standing GaN template with low TDD (∼5 × 107 cm−2), an optimized metal-polar In0.17Al0.83N/GaN/AlN/GaN structure achieved a RT 2DEG sheet resistance of 145 Ω/□ and mobility of 1822 cm2 V−1 s−1. High-electron-mobility transistors with output current densities above 1 A mm−1 were also demonstrated on the low-TDD structure.

Growth of low-defect-density nonpolar a-plane GaN on r-plane sapphire using pulse NH_3 interrupted etching

Nonpolar a-plane (11-20) GaN (a-GaN) layers with low overall defect density and high crystalline quality were grown on r-plane sapphire substrates using etched a-GaN. The a-GaN layer was etched by pulse NH3 interrupted etching. Subsequently, a 2-µm-thick Si-doped a-GaN layer was regrown on the etched a-GaN layer. A fully coalescent n-type a-GaN layer with a low threading dislocation density (~7.5 × 10(8) cm(-2)) and a low basal stacking fault density (~1.8 × 10(5) cm(-1)) was obtained. Compared with a planar sample, the full width at half maximum of the (11-20) X-ray rocking curve was significantly decreased to 518 arcsec along the c-axis direction and 562 arcsec along the m-axis direction.

Sputter Epitaxial Growth of Flat Germanium Film with Low Threading-Dislocation Density on Silicon (001)

Fast epitaxy of Ge on Si(001) was realized by DC sputtering at 2.1 nm·s−1 and 360°C; the resulting film was optically flat without a cross-hatch structure. After annealing at 700°C, 90°-full-edge dislocations dominated the Ge–Si interface and the threading-dislocation density (TDD) of the Ge film was below 104 cm−2, which is three orders of magnitude lower than the value of Ge films prepared by other methods. The extremely low TDD might be attributable to the spaces vacated by desorbed Ar within the film that served as dislocation sinks during sputtering. Acceptor-band conduction, which was at 0.02 eV above the valence band and was induced by dislocations, was observed with a hole mobility of 3–10 cm2·V−1·s−1 in the film prepared without annealing. After annealing at 700°C, the ionized-defect scattering in the film was considerably decreased and a mobility of 1180 cm2·V−1·s−1 was obtained. The direct band gap energy of the film prepared without annealing was 0.81 eV, and became 0.79 eV after annealing.

Growth of Thick Ge Epilayers on Si(100) Substrates Utilizing Two-Step Approach by Ultrahigh Vacuum Chemical Vapor Deposition

Ge epilayers on low temperature (LT) Ge buffer layers were grown by ultrahigh vacuum chemical vapor deposition using the two-step approach. Effects of the growth temperature and the thickness of the low temperature Ge buffers were studied. It was demonstrated that it was unable to obtain flat LT Ge buffers just through lowering the growth temperature due to the ultraslow grow rate that 3D islands formation couldnt be prohibited. However, the rough LT Ge surface was smoothed by subsequent growth at elevated temperature if the LT Ge layer was thick enough and the compressive strain was relaxed largely, and the detrimental Si-Ge intermixing was effectively prohibited as well. When using proper growth conditions for the low temperature Ge buffer, thick Ge epilayer with a low threading dislocation density and a smooth surface was obtained.

The influence of atomic ordering on strain relaxation during the growth of metamorphic solar cells

The occurrence of single variant CuPtB ordering during growth of InGaP graded buffer layer structures on offcut (001) GaAs substrates for inverted metamorphic solar cells is found to have a strong influence on strain relaxation mechanisms. Since the surface-induced CuPtB ordering is metastable in the bulk of the material, a strong preference is observed for the nucleation and glide of 60° type misfit dislocations with Burgers vectors that introduce an antiphase boundary into the ordered structure. This results in an overall epitaxial layer tilt in the opposite sense to that normally observed for the direction of substrate offcut. Furthermore, in InGaP buffer layers graded to InP, a switch in the dislocation glide plane preference back to that normally observed for the direction of substrate offcut is observed as the degree of atomic ordering falls below a critical value. This results in the nucleation and glide of new misfit dislocations resulting in an increase in the threading dislocation density that is found to have a deleterious effect on device efficiency. Understanding the materials science behind this behavior will enable the engineering of more effective, lower threading dislocation density strain relief buffer layers resulting in improved performance of subsequently grown devices.

Effects of substrate miscut on threading dislocation distribution in metamorphic GaInAs/AlInAs buffers

Metamorphic GaInAs/AlInAs buffers with a total mismatch of 2 % with respect to GaAs have been grown by metal organic chemical vapor deposition on GaAs substrates with miscuts of 2°, 7° and 15° toward (111)A. The buffer grown on 2° miscut substrate exhibits a dislocation pile-up formation which increases the threading dislocation density greatly. However, using 7° and 15° off substrates eliminates the dislocation pile-up and decreases the dislocation density by an order of magnitude compared with that on the 2° substrate miscut, and the best crystalline quality of buffer is obtained on the 15° substrate miscut. Experimental results show that the buffers grown on the 7° and 15° miscut substrate exhibit shallower trenches on the surface and a weaker strain field in the InGaAs cap layers, and these help to suppress the occurrence of dislocation pile-up, leading to a lower threading dislocation density.

High performance thin quantum barrier InGaN/GaN solar cells on sapphire and bulk (0001) GaN substrates

We demonstrate high performance InGaN/GaN multiple quantum well solar cells with thin quantum barriers and spectral response extending to 460 nm. Devices grown on bulk (0001) GaN substrates with up to 50 quantum wells (QWs) outperform those grown simultaneously on sapphire due to the lower threading dislocation density. Increasing the number of QWs eventually leads to performance degradation of devices grown on both substrates. Solar cells are demonstrated with peak external quantum efficiencies up to 60%, open circuit voltages up to 2.28 V, fill factors up to 80%, and conversion efficiencies up to 2.4% under 1 sun AM0 equivalent illumination.

High quality relaxed germanium layers grown on (110) and (111) silicon substrates with reduced stacking fault formation

Epitaxial growth of Ge on Si has been investigated in order to produce high quality Ge layers on (110)- and (111)-orientated Si substrates, which are of considerable interest for their predicted superior electronic properties compared to (100) orientation. Using the low temperature/high temperature growth technique in reduced pressure chemical vapour deposition, high quality (111) Ge layers have been demonstrated almost entirely suppressing the formation of stacking faults (< 107 cm−2) with a very low rms roughness of less than 2 nm and a reduction in threading dislocation density (TDD) (∼ 3 × 108 cm−2). The leading factor in improving the buffer quality was use of a thin, partially relaxed Ge seed layer, where the residual compressive strain promotes an intermediate islanding step between the low temperature and high temperature growth phases. (110)-oriented layers were also examined and found to have similar low rms roughness (1.6 nm) and TDD below 108 cm−2, although use of a thin seed layer did not offer the same relative improvement seen for (111).

Design of Dislocation-Compensated ZnS y Se1−y /GaAs (001) Heterostructures

The understanding of lattice relaxation and dislocation dynamics in lattice-mismatched semiconductors makes it possible to design metamorphic device structures utilizing the dislocation compensation mechanism for reduced defects, improved performance, and enhanced reliability. We have developed a dislocation dynamics model accounting for misfit–threading interactions and have applied it to ZnSySe1−y/GaAs (001) heterostructures.1 Dislocation compensation involves the removal of threading dislocations associated with one sense of misfit dislocations by bending them over to create misfit dislocations of the opposite sense at an intentionally mismatched interface. Here we investigated the design of dislocation-compensated ZnSySe1−y/GaAs (001) heterostructures and considered the sulfur mole fraction tolerances applicable to such structures. We considered two types of structures: type A involved a uniform-composition (ungraded) layer on top of a uniform-composition buffer, while type B involved a uniform-composition layer on a linearly graded buffer. For each structure type we studied the requirements on the thickness and compositional profile of the buffer layer to optimize the removal of mobile threading dislocations from the top uniform (device) layer as well as the allowed tolerance in compositional overshoot to achieve structures with low threading dislocation density. We show for both types of structure that (i) for given compositional overshoot at the buffer–device layer interface, there is an optimum buffer thickness which minimizes the dislocation density; and (ii) for given buffer thickness there is an optimum overshoot which minimizes the dislocation density.

Excitonic emission dynamics in homoepitaxial AlN films studied using polarized and spatio-time-resolved cathodoluminescence measurements

Excitonic emission dynamics in homoepitaxial AlN films grown on a freestanding substrate prepared by the physical-vapor-transport method were examined. Reflecting the low threading dislocation density (<104 cm−2), room-temperature cathodoluminescence intensity images mapped at the free A-exciton energy exhibited homogeneous contrasts. Low-temperature cathodoluminescence peaks at 6.0415 and 6.0287 eV, which were polarized parallel and perpendicular, respectively, to the c-axis, exhibited identical risetimes and short lifetimes; the latter coincided with the temporal delay of neutral donor-bound exciton emissions. These results support the assumption that the two peaks originate from the recombination of free A-excitons of irreducible representations Γ1 and Γ5, respectively.

The effect of dislocations on the efficiency of InGaN/GaN solar cells

Two solar cells based on an InGaN/GaN p–i–n hetero-junction, but having different dislocation densities, were fabricated and characterized. The structures were grown on c-plane (0001) GaN-on-sapphire templates with different threading dislocation (TD) densities of 5×108 and 5×109cm−2. Structural characterization revealed the presence of V-defects in the InGaN epilayer. Since each V-defect was associated with a TD, the structural as well as the optical properties worsened with a higher TD density in the GaN/sapphire template. It was also found that additional dislocations were generated in the p-GaN layer over the V-defects in the InGaN layer. Because of its superior structural quality, the peak external quantum efficiency (EQE) of the low TD density sample was three times higher than that of the high TD density sample.

Reduction of carbon proximity effects by including AlGaN back barriers in HEMTs on free‐standing GaN

High-electron-mobility transistor (HEMT) structures were regrown by molecular beam epitaxy on GaN-on-SiC templates and free-standing (FS) GaN substrates with very low threading dislocation density (TDD). To ensure a high buffer breakdown voltage, the thickness of the unintentionally doped (UID) GaN buffer layer, d UID, was reduced to 200 nm for the HEMTs regrown on FS GaN. A reduction in TDD entailed an increase in the three-terminal breakdown voltage for passivated HEMTs. With a low d UID, the proximity effects of the carbon-doped GaN buffer were evident. A power-added efficiency (PAE) of 37% and continuous-wave power output (P out) of 4.2 W/mm were measured at 4 GHz with a drain bias of 40 V for a HEMT on FS GaN without a back barrier. By including a 5 nm Al0.3Ga0.7N back barrier, PAE and P out improved to 50% and 6.7 W/mm, respectively, at a drain bias of 40 V.

Structural, morphological, and defect properties of metamorphic In0.7Ga0.3As/GaAs0.35Sb0.65 p-type tunnel field effect transistor structure grown by molecular beam epitaxy

Structural properties of metamorphic In0.7Ga0.3As/GaAs0.35Sb0.65 p-type tunnel field effect transistor (TFET) structure grown by molecular beam epitaxy were comprehensively investigated. High resolution x-ray diffraction revealed symmetric strain relaxation and pseudomorphic In0.7Ga0.3As/GaAs0.35Sb0.65 active layers with respect to the In0.7Al0.3As buffer, indicating a low dislocation density within the active region. The surface morphology of this structure exhibited a typical two-dimensional cross-hatch pattern with a low root-mean-square roughness of 2.58 nm. Cross-sectional transmission electron microscopy demonstrated a low threading dislocation density within the active region, suggesting high crystalline quality of this p-type TFET structure. Dynamic secondary ion mass spectrometry exhibited an abrupt doping profile over the In0.7Ga0.3As/GaAs0.35Sb0.65 source/channel junction as well as minimal level of intermixing between As and Sb atoms. Thus, these structural properties showed high quality of this structure and provided critical guidance for the fabrication of As/Sb based staggered gap complementary TFETs for ultra-low standby power and energy efficient logic applications.

Multijunction Solar Cell Designs Using Silicon Bottom Subcell and Porous Silicon Compliant Membrane

A novel approach to the design of multijunction solar cells on silicon substrates for 1-sun applications is described. Models for device simulation, including porous silicon layers, are presented. A silicon bottom subcell is formed by diffusion of dopants into a silicon wafer. The top of the wafer is porosified to create a compliant layer, and a III-V buffer layer is then grown epitaxially, followed by middle and top subcells. Because of the resistivity of the porous material, these designs are best suited to high-efficiency 1-sun applications. Numerical simulations of a multijunction solar cell that incorporates a porous silicon-compliant membrane indicate an efficiency of 30.7% under AM1.5G, 1-sun for low-threading dislocation density, decreasing to 23.7% for a TDD of 10 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">7</sup> cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">-2</sup> .

Effects of substrate miscut on dislocation glide in metamorphic (Al)GaInP buffers

The effects of miscut toward (111)A of (001) GaAs substrates on α dislocation glide in compositionally step-graded (Al)GaInP buffers grown by metal-organic chemical vapor deposition have been investigated. The full width at half maximum of X-ray rocking curves and the tilt obtained from symmetric (004) reciprocal space mappings suggest that the average misfit glide length of α dislocations is longer in samples on 15° off substrates than that on 7° off substrates. Compared to the 7° sample, the larger miscut 15° more significantly weakens the blocking effect of the β dislocations on the motion of α dislocations, and it also provides a much stronger driving force on α dislocations in (111) slip planes, which greatly enhances the misfit dislocation glide. Eventually, the two effects collectively lead to a longer average misfit glide length of α dislocations and a lower threading dislocation density in the active layer on the 15° off substrates, which is critical for improving the performances of devices based on lattice mismatched materials.

Molecular beam epitaxy for high-performance Ga-face GaN electron devices

Molecular beam epitaxy (MBE) has emerged as a powerful technique for growing GaN-based high electron mobility transistor (HEMT) epistructures. Over the past decade, HEMT performance steadily improved, mainly through the optimization of device fabrication processes. Soon, HEMT performance will be limited by the crystalline quality of the epistructure. MBE offers heterostructure growth with highly abrupt interfaces, low point defect concentrations, and very low carbon and hydrogen impurity concentrations. Minimizing parasitic leakage pathways and resistances is essential in the growth of HEMTs for high-frequency and high-power applications. Through growth on native substrates with very low threading dislocation density, low-leakage HEMTs with very low on-resistance can be realized. Ga-rich plasma-assisted MBE (PAMBE) has been studied extensively, and it is clear that this technique has inherent limitations, including a high density of leakage pathways and a very small growth parameter space. Relatively new MBE growth techniques—high-temperature N-rich PAMBE and ammonia-based MBE—are being developed to circumvent the shortcomings of Ga-rich PAMBE.

Growth, microstructure, and luminescent properties of direct-bandgap InAlP on relaxed InGaAs on GaAs substrates

Direct-bandgap InAlP alloy has the potential to be an active material in nitride-free yellow-green and amber optoelectronics with applications in solid-state lighting, display devices, and multi-junction solar cells. We report on the growth of high-quality direct-bandgap InAlP on relaxed InGaAs graded buffers with low threading dislocation densities. Structural characterization reveals phase-separated microstructures in these films which have an impact on the luminescence spectrum. While similar to InGaP in many ways, the greater tendency for phase separation in InAlP leads to the simultaneous occurrence of compositional inhomogeneity and CuPt-B ordering. Mechanisms connecting these two structural parameters are presented as well as results on the effect of silicon and zinc dopants on homogenizing the microstructure. Spontaneous formation of tilted planes of phase-separated material, with alternating degrees of ordering, is observed when InAlP is grown on vicinal substrates. The photoluminescence peak-widths of these films are actually narrower than those grown on exact (001) substrates. We find that, despite phase-separation, ordered direct-bandgap InAlP is a suitable material for optoelectronics.

Preparation of Substrates Intended for the Growth of Lower Threading Dislocation Densities within Nitride Based UV Multiple Quantum Wells

In this study a variety of nano-patterning techniques were applied to III-N device fabrication. A block co-polymer/metal oxide novel surface texturing method was utilised to achieve a long ranged ordered template. Nano-sphere lithography was also applied to UV multiple quantum well (MQW) structural growth using a silica nanoparticle monolayer as the mask. The monolayer was produced by a self-assembly technique without the need for either a spin coater or Langmuir-Blodgett trough resulting in a low cost arrangement. Using these nano-sized masks allows for the production of nano-rods in a much simpler method than previously used techniques. For comparison nano-rods were made by electron beam lithography at various diameters and lengths for a comprehensive investigation of crystal defects, in particular threading dislocations (TDs).