The development of reliable electronic equipment is a big challenge due to miniaturization and performance characteristics of high speed and high power electronic devices. Thermal control is one of the key roles to meet the above challenge. Thermal Interface Material (TIM) plays a significant role in thermal control. TIM has been extensively used in diverse electronic devices for next generation electronics. To improve or enhance heat transfer performance at the interface region between copper substrates, Low Melting Alloy (LMA) Bi-Sn-Pb is usually used as TIM. In the present work, Thermal contact resistance (TCR) and Temperature variation by TIM is experimentally investigated. In the study, Bi39.4Sn30.8Pb29.8 is used as TIM material. The variation of TCR subjected to heat flow, variation of temperature between the interface and specimen thickness is reported and discussed.
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