Abstract
Transient Liquid Phase (TLP) has been a potential bonding technique for high temperature application solder alloy. TLP bonding for solder is a soldering method that using a low and high temperature metal layer for solid form solder, and a mixing of low and high temperature metal powder in flux medium, for paste form solder. Transient Liquid Phase bonding process involved thoroughly consumption of low melting point metal into high melting point metal and results in the formation of high temperature melting point peritectic intermetallic compound (IMC) which enables the solder to be soldered at typical low soldering temperature but, the solder connection can be applied in the high temperature application. The morphology of the peritectic IMCs mainly consist two solids, which is primary α as well as peritectic β together with liquid phase at peritectic temperature. The growth formation of those primary α and peritectic β phases has resulted with a variety of possible peritectic microstructure’s morphology as will be discussed further.
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