Low Barrier Height Research Articles

Exploration of High‐Pressure Annealing and Microwave Annealing in Palladium Germano‐Silicide Formation for Si0.8Ge0.2‐Based Complementary Metal‐Oxide–Semiconductor Transistors

In this study, forming palladium germano‐silicide on Si0.8Ge0.2‐based complementary metal‐oxide semiconductor (CMOS) transistors by high‐pressure annealing compared to microwave annealing is investigated. Boron‐doped Si0.8Ge0.2 layers are epitaxially grown on n‐type Si wafers, achieving an initial boron concentration of 5 × 1015 cm−3, which increase to ≈6 × 1020 cm−3 after microwave annealing, reducing sheet resistance. Palladium is deposited using electron beam evaporation to form a 15 nm layer on Si0.8Ge0.2 (200 nm)/Si (100) substrates. High‐pressure annealing is conducted from 300 to 500 °C in N2 ambiance at 5 kg cm−3, while microwave annealing is performed at 5.8 GHz and 1800–3000 W for 100 s. X‐ray diffractometer confirms high‐intensity Pd2Si phase formation, but scanning electron microscope and atomic force microscope reveal increased surface roughness and clustering after annealing. Sheet resistance increases from 10.35 Ω sq−1 (unannealed) to 131.8 Ω sq−1 (high‐pressure annealing at 300 °C) and 85.8 Ω sq−1 (microwave annealing at 1800 W). In these results, the trade‐offs between annealing methods and metal choices for achieving low contact resistance and Schottky barrier heights in p‐type Si0.8Ge0.2 CMOS circuits are highlighted.

Waveguide-integrated aluminum-MoTe2 Schottky photodetectors for the wavelength band extended to 2 µm.

Transition metal dichalcogenide (TMDC) materials with excellent optoelectronic properties have attracted much attention in the fields of reconfigurable electronic devices, next-generation FETs, and photodetectors (PDs). While normal TMDC PDs have a bandgap-limited absorption edge of ∼1.3 µm, metal-TMDC Schottky PDs based on internal photoemission provide an operation band extension strategy. In this study, we demonstrate that a TMDC PD can even operate at the wavelength band as long as 2.0 µm by judiciously choosing TMDC and metal materials to construct a low barrier height Schottky PD. Specifically, a silicon waveguide-integrated Al-MoTe2 Schottky PD was measured with responsivities of 18 mA/W and 5.5 mA/W at 1.6 µm and 2 µm, respectively. Meanwhile, the dark current is as low as 2 µA. The linear response can be maintained when the input optical power is in the mW scale. A measured 3 dB bandwidth is much larger than 1.75 MHz. These findings offer a promising avenue for expanding the detection range of the TMDC-based PDs with overall good performance in responsivity, bandwidth, sensitivity, and linearity.

Numerical analysis of Gaussian potential patches model depending on the substrate doping in inhomogeneous Schottky barrier diodes over a wide temperature range

The current-voltage (I-V-T) characteristics of an inhomogeneous n-type GaAs Schottky barrier diode have been investigated by numerical analysis using the modified thermionic emission (TE) current equation by Tung in the 40–320 K range at 40 K intervals. This total current (TC) equation consists of TE current and the patch current components. The patch current dominates through the low Schottky barrier height patches at low temperatures. From the I-V-T characteristics given for three different standard deviations (σ) at each substrate doping value Nd, we have determined the temperatures at which the patch current begins to dominate. The starting temperature of the patch current has decreased as the σ and Nd values decrease. It has been seen that the temperature at which the patch current component begins to dominate is about 120, 80, and 60 K for σ4, σ3, and σ2 at Nd=1.0×1014cm−3 or Nd=1.0×1015cm−3, respectively; 160, 120, and 80 K at Nd=5.0×1015cm−3; and 200, 160, and 80 K at Nd=1.0×1016cm−3, respectively. Moreover, for the substrate with high doping, it has been observed that the I-V curve of the patch current component or the TC shifts toward higher voltages than the expected position at low temperatures. Thus, from the I-V-T characteristics, it has appeared that Tung’s pinch-off model tends to be more applicable to lightly doped semiconductors. Moreover, the TC equation should be used at high temperatures because the I-V curves at high temperatures belong to the TE component, and the patch current expression without the TE component should be especially used for fit to the experimental curves at low temperatures.

A comparative study of optical property on unintentionally doped and Sn-Doped β-Ga2O3 crystals by EFG method with a cylindrical Ir die

In this work, we carried out a comparative study of optical property on unintentionally doped and Sn-doped β-Ga2O3 crystals by edge-defined film-fed growth (EFG) method with a cylindrical iridium (Ir) die. The non-polarized Raman spectra showed the anisotropy in Raman peak position and intensity for three different planes (i.e., (100), (010) and (001)) of β-Ga2O3 crystals, independent of the Sn dopant. A difference in the Raman spectra between the unintentionally doped and Sn-doped β-Ga2O3 crystals was observed in the (001) plane. The strong in-plane anisotropy of the monoclinic β-Ga2O3 crystal related to the crystallographic orientation was demonstrated by the angle-resolved polarized Raman spectroscopy. The Sn dopant cannot change the optical transmittance and bandgap values of the unintentionally doped and Sn-doped β-Ga2O3 crystals with the (100), (010) and (001) orientations. However, the Sn-doped β-Ga2O3 crystal with the (010) orientation showed the higher valence band maximum and lower surface barrier height values. The X-ray photoelectron spectroscopy of the unintentionally doped and Sn-doped β-Ga2O3 crystals with the (010) orientation was also measured, which showed no obvious difference. The different luminescence centers and level of electron ionization of the unintentionally doped and Sn-doped β-Ga2O3 crystals were observed by the cathodoluminescence spectroscopy and electron paramagnetic resonance, respectively. Based on the comprehensive comparison, it can be concluded that the anisotropy in optical property of the unintentionally doped and Sn-doped β-Ga2O3 crystals with (100), (010) and (001) orientations apparently exist.

Electrical contact property and control effects for stable T(H)-TaS2/C3B metal-semiconductor heterojunctions.

Metal-semiconductor heterojunctions are the basis for developing new electronic devices. Here, T(H)-TaS2/C3B metal-semiconductor heterostructures are constructed by different phase T- and H-TaS2 monolayers combined with the C3B monolayer. The calculated corrected binding energies, phonon band structures, elastic constants, and molecular dynamics simulations indicated that both heterojunctions are highly stable, meaning that T(H)-TaS2/C3B heterojunctions possibly exist in experiments. The electronic property calculations showed that the intrinsic T(H)-TaS2/C3B heterojunction is an n(p)-type Schottky contact with a low Schottky barrier height (SBH), which is very important for the design of high-performance field-effect transistors. The electronic properties of the T(H)-TaS2/C3B heterojunctions can be controlled by varying the vertical strain and external electric field; however, the strain only resulted in a small change in the heterojunction SBH. Nevertheless, under external electrical field control, the T-TaS2/C3B heterojunction could manage a transition from an n-type Schottky contact to an n-type Ohmic contact and the H-TaS2/C3B heterojunction could be altered from a p-type Schottky contact to a p-type Ohmic contact. These findings provide theoretical insights into the electronic and electrical contact properties of the T(H)-TaS2/C3B heterojunction, which could be beneficial for developing n-type MOS and p-type MOS transistors.

Low-Defect-Density Monolayer MoS2 Wafer by Oxygen-Assisted Growth-Repair Strategy.

Atomic chalcogen vacancy is the most commonly observed defect category in two dimensional (2D) transition-metal dichalcogenides, which can be detrimental to the intrinsic properties and device performance. Here a low-defect density, high-uniform, wafer-scale single crystal epitaxial technology by in situ oxygen-incorporated "growth-repair" strategy is reported. For the first time, the oxygen-repairing efficiency on MoS2 monolayers at atomic scale is quantitatively evaluated. The sulfur defect density is greatly reduced from (2.71 ± 0.65) × 1013 down to (4.28 ± 0.27) × 1012 cm-2, which is one order of magnitude lower than reported as-grown MoS2. Such prominent defect deduction is owing to the kinetically more favorable configuration of oxygen substitution and an increase in sulfur vacancy formation energy around oxygen-incorporated sites by the first-principle calculations. Furthermore, the sulfur vacancies induced donor defect states is largely eliminated confirmed by quenched defect-related emission. The devices exhibit improved carrier mobility by more than three times up to 65.2 cm2 V-1 s-1 and lower Schottky barrier height reduced by half (less than 20 meV), originating from the suppressed Fermi-level pinning effect from disorder-induced gap state. The work provides aneffective route toward engineering the intrinsic defect density and electronic states through modulating synthesis kinetics of 2D materials.

Study on the interface electronic structure, strain modulation and transport properties of composite heterojunction of 2D semimetal TiS2 and MX2 (M=Mo, W, Cr, Zr, Hf; X=S, Se, Te) semiconductor

Ohmic contacts play a crucial role in realizing high-performance electronic devices based on two-dimensional materials. The contact between semimetals and semiconductors can mitigate the formation of metal-induced gap states (MIGS), thereby reducing the SBH, enhancing the efficiency of high charge injection, and facilitating the establishment of ohmic contacts. This study involves a systematic exploration of the contact characteristics between the two-dimensional semimetal TiS2 and semiconductor MX2 (M = Mo, W, Cr, Zr, Hf; X = S, Se, Te) through first-principles calculations. It is found that the TiS2/MoSe2 and TiS2/WSe2 heterojunction achieve ohmic contact. Investigations into their transport properties reveal that significant currents can be observed at relatively low voltages, indicating excellent transport performance of these heterojunctions. The TiS2/CrSe2 and TiS2/HfSe2 contact heterojunctions also show low Schottky barrier height (SBH), with the barrier height being adjustable under strain. The SBH of TiS2/CrSe2 and TiS2/HfSe2 heterojunctions are very close to zero under stresses of 4 % and −4%, respectively. This also implies that our research can offer valuable guidance for the development of adjustable Schottky nano-devices and high-performance optoelectronic devices.

Evidence as conformational molecular switch of 1,4-bis(4-vinylpyridyl)benzene adsorbed on a nanostructured silver surface: A synergetic study of femtosecond transient absorption spectra, electrochemical SERS records and DFT calculations

The electrochemical surface-enhanced Raman spectra (SERS) of 1,4-bis(4-vinylpyridyl)benzene (bvpb) recorded at different electrode potentials with three excitation wavelengths (785, 532 and 473 nm) point out there exists a resonance process involved at more negative voltage with the 785 nm line, giving two strongly enhanced SERS bands at about 1500 and 1150 cm−1. This result agrees with the VIS-NIR transient absorption spectrum characterized by a strong band at 607 nm and a weaker one at 1163 nm, corresponding to the first singlet (S1) and triplet (T1) excited electronic states. The DFT potential energy curve corresponding to the trans–cis (E-Z) isomerization in the S0 state and in the two lowest S1 and T1 excited states, indicates that the S1 state exhibits a significant lower barrier height than S0 state, showing also a S1/S0 conical intersection at a structural conformation in which the vinyl double bond twists by 90°. TD-DFT resonance Raman spectra of the planar and twisted conformation in a simple model of surface complex, Ag20-bvpb, yield that the twisted molecule is able to predict the selected enhancement of the two SERS bands. Therefore, bvpb could act as an electroactive conformational molecular switch under a selected wavelength in nanoelectronic devices.

Janus MoSH/WSi2N4 van der Waals Heterostructure: Two-Dimensional Metal/Semiconductor Contact.

Constructing heterostructures from already synthesized two-dimensional materials is of significant importance. We performed a first-principles study to investigate the electronic properties and interfacial characteristics of Janus MoSH/WSi2N4 van der Waals heterostructure (vdWH) contacts. We demonstrate that the p-type Schottky formed by MoSH/WSi2N4 and MoHS/WSi2N4 has extremely low Schottky barrier heights (SBHs). Due to its excellent charge injection efficiency, Janus MoSH may be regarded as an effective metal contact for WSi2N4 semiconductors. Furthermore, the interfacial characteristics and electronic structure of Janus MoSH/WSi2N4 vdWHs can not only reduce/eliminate SBH, but also forms the transition from p-ShC to n-ShC type and from Schottky contact (ShC) to Ohmic contact (OhC) through the layer spacing and electric field. Our results can offer a fresh method for optoelectronic applications based on metal/semiconductor Janus MoSH/WSi2N4 vdW heterostructures, which have strong potential in optoelectronic applications.

Blurred interface induced control of electrical transport properties in Josephson junctions

The interfacial microstructures of Josephson junctions are vital for understanding the microscopic mechanism to improve the performance of superconducting qubits further. However, there remain significant concerns about well understanding the correlation between atomic structures and electrical behaviors. Here, we propose a new method to define the interface of the barrier in Josephson junctions, and investigate the factors that affect the electrical properties of junctions using material analysis techniques and first principles. We find that the aluminium–oxygen ratio of the interface contributes greatly to the electrical properties of junctions, which is consistent with the conclusions obtained by utilizing the generative adversarial network for data augmentation. When the aluminium–oxygen ratio of the interface is 0.67–1.1, the model exhibits a lower barrier height and better electrical properties of the junction. Moreover, when the thickness of the barrier is fixed, the impact of the aluminium–oxygen ratio becomes prominent. A detailed analysis of Josephson junctions using a microscopic model has led to identifying of process defects that can enhance the yield rate of chips. It has a great boost for determining the relationship between microstructures and macroscopic performances.

Interface Characterization of Graphene‐Silicon Heterojunction Using Hg Probe Capacitance–Voltage Measurement

AbstractInvestigating the intrinsic properties of the Schottky interface between graphene and 3D bulk silicon is crucial. However, the semiconductor technology introduces extra doping and defects in graphene, which significantly disturbs the property of the graphene‐silicon interface. Here, the interface parameters of graphene/n‐Si heterojunction are derived by the damage‐free Hg‐probe capacitance–voltage measurement. Due to its low‐density states, the Fermi level of graphene can be pushed upward, which results in a lower Schottky barrier height (ΦB0) of Hg/graphene/n‐Si (HGS) heterostructure than that of Hg/n‐Si (HS) structure. Additionally, the series resistance (Rs) of HGS becomes lower than that of HS, which can be attributed to the narrowed depletion layer width (WD) and the decreased interface state density (Nit). Furthermore, the frequency characteristic is also investigated. Because of the weak interface state charge trapping–detrapping process and the decreased Nit at high frequency, electrons will accumulate in graphene, and the Fermi level will be pushed up. Hence, the ΦB0 and Rs will decrease with increasing frequency. This study contributes to a deep understanding of the graphene/silicon heterojunction interfaces, which is crucial for designing and optimizing the new electronic and optoelectronic devices based on 2D/3D heterostructure.

Pyrolysis mechanistic study on sulfated polysaccharide from marine algal biomass with density functional theory method

Sulfated polysaccharide (SPS) derived from marine algae represents a promising renewable carbon biomass source. Through pyrolysis, SPS can be converted into C5 platform chemicals, including furfural (FF) and 5-methylfurura (5-MF). Understanding the fundamental reaction mechanisms during pyrolysis is essential for the advancing pyrolysis techniques. This work presents a detailed reaction mechanism that reveal new pathways leading to the most important products and intermediates. Simulations focusing on the initial steps in SPS pyrolysis showed that the unimolecular degradation of SPS is dominated by SO3 elimination, with a barrier height of 157.2 kJ/mol; ring-opening and glycosidic bond fission were identified as important competitive reactions, both of which have a barrier height of 207.6 kJ/mol and 260.1 kJ/mol, respectively. The 4,5-unsaturated acyclic rhamnose derived from the glycosidic bond fission of acyclic reducing end group can transform into 5-MF with high selectivity. In addition, the acyclic reducing end group is readily dehydrated to form a 2,3-unsaturated acyclic reducing end group, a reactive unsaturated intermediate. Its decomposition involves an 8-membered ring transition state that requires a low barrier height and results in the formation of a C5 fragment, which can be cyclized directly and dehydrated to form 5-MF. The majority of CO2 is mostly formed by the synergistic breakage of C-Ccarboxyl bonds and glycosidic bonds, with a barrier height of 197.9 kJ/mol. Moreover, a mechanism is uncovered for the formation of formic acid (FA) from a 4,5-unsaturated no-reducing end group. The major pyrolysis channel is initiated by a retro Diels-Alder reaction and followed by a retro-ene reaction to produce a 3,4-unsaturated non-reducing end group, which further decomposes into FA and a new 4,5-unsaturated non-reducing end group.

Comparative Analysis of Ni/Ag and Ni/Au Contacts on GaN/AlGaN/GaN Platform

Herein, the electrical characteristics and Schottky barrier of Ni/Au and Ni/Ag contacts on the GaN/AlGaN/GaN heterojunction are investigated. Both contacts on the p‐GaN contact layer (Mg: ≈3 × 1019 cm−3) exhibit weak Schottky characteristics. The nonlinear current–voltage (I–V) characteristics are observed, leading to variations in contact resistance (RC) and sheet resistance (Rsh) with changing bias voltage. The Ni/Ag contact achieves a lower Schottky barrier height calculated by using the I–V method. Furthermore, when employing a p++‐GaN layer (Mg: ≈1 × 1020 cm−3) as the contact layer, the Ni/Ag contact forms an Ohmic contact without Schottky characteristics, achieving a satisfactory RC of 30.31 Ω mm. This result demonstrates its viability as a competitive candidate for p‐channel field‐effect transistors’ fabrication.

Impact of Rh, Ru, and Pd Leads and Contact Topologies on Performance of WSe2 FETs: A First Comparative Ab Initio Study.

2D field-effect transistors (FETs) fabricated with transition metal dichalcogenide (TMD) materials are a potential replacement for the silicon-based CMOS. However, the lack of advancement in p-type contact is also a key factor hindering TMD-based CMOS applications. The less investigated path towards improving electrical characteristics based on contact geometries with low contact resistance (RC) has also been established. Moreover, finding contact metals to reduce the RC is indeed one of the significant challenges in achieving the above goal. Our research provides the first comparative analysis of the three contact configurations for a WSe2 monolayer with different noble metals (Rh, Ru, and Pd) by employing ab initio density functional theory (DFT) and non-equilibrium Green's function (NEGF) methods. From the perspective of the contact topologies, the RC and minimum subthreshold slope (SSMIN) of all the conventional edge contacts are outperformed by the novel non-van der Waals (vdW) sandwich contacts. These non-vdW sandwich contacts reveal that their RC values are below 50 Ω∙μm, attributed to the narrow Schottky barrier widths (SBWs) and low Schottky barrier heights (SBHs). Not only are the RC values dramatically reduced by such novel contacts, but the SSMIN values are lower than 68 mV/dec. The new proposal offers the lowest RC and SSMIN, irrespective of the contact metals. Further considering the metal leads, the WSe2/Rh FETs based on the non-vdW sandwich contacts show a meager RC value of 33 Ω∙μm and an exceptional SSMIN of 63 mV/dec. The two calculated results present the smallest-ever values reported in our study, indicating that the non-vdW sandwich contacts with Rh leads can attain the best-case scenario. In contrast, the symmetric convex edge contacts with Pd leads cause the worst-case degradation, yielding an RC value of 213 Ω∙μm and an SSMIN value of 95 mV/dec. While all the WSe2/Ru FETs exhibit medium performances, the minimal shift in the transfer curves is interestingly advantageous to the circuit operation. Conclusively, the low-RC performances and the desirable SSMIN values are a combination of the contact geometries and metal leads. This innovation, achieved through noble metal leads in conjunction with the novel contact configurations, paves the way for a TMD-based CMOS with ultra-low RC and rapid switching speeds.

Low-Power Transistors with Ideal p-type Ohmic Contacts Based on VS2/WSe2 van der Waals Heterostructures.

Achieving low-resistance Ohmic contacts with a vanishing Schottky barrier is crucial for enhancing the performance of two-dimensional (2D) field-effect transistors (FETs). In this paper, we present a theoretical investigation of VS2/WSe2-vdWHs-FETs with a gate length (Lg) in the range of 1-5 nm, using ab initio quantum transport simulations. The results show that a very low hole Schottky barrier height (-0.01 eV) can be achieved with perfect band offsets and reduced metal-induced gap states (MIGS), indicating the formation of p-type Ohmic contacts. Additionally, these FETs also exhibit an impressive low subthreshold swing (SS) (69 mV/dec) and high Ion/Ioff (>107) with an appropriate underlap (UL) structure consisting of pristine WSe2. Furthermore, even when the Lg is scaled down to 3 nm, the device can still meet the low-power (LP) requirements of the International Technology Roadmap for Semiconductors (ITRS) by controlling the UL. Consequently, this study provides valuable insights for the future development of LP 2D FETs.

Pt/GaN Schottky Barrier Height Lowering by Incorporated Hydrogen

Changes in the hydrogen-induced Schottky barrier height (Φ B) of Pt/GaN rectifiers fabricated on free-standing GaN substrates were investigated using current–voltage, capacitance–voltage, impedance spectroscopy, and current–time measurements. Ambient hydrogen lowered the Φ B and reduced the resistance of the semiconductor space–charge region while only weakly affecting the ideality factor, carrier concentration, and capacitance of the semiconductor space–charge region. The changes in the Φ B were reversible; specifically, the decrease in Φ B upon hydrogen exposure occurred quickly, but the recovery was slow. The results also showed that exposure to dry air and/or the application of a reverse bias to the Schottky electrodes accelerated the reversion compared with the case without the applied bias. The former case resulted in fast reversion because of the catalytic effect of Pt. The latter case, by contrast, suggested that hydrogen was incorporated into the Pt/GaN interface oxides as positive mobile charges. Moreover, both exposure to dry air and the application of a reverse bias increased the Φ B of an as-loaded sample from 0.91 to 1.07 eV, revealing that the Φ B of Pt/GaN rectifiers was kept lower as a result of hydrogen incorporation that likely occurred during device processing and/or storage.

Characterization of Mn5Ge3 Contacts on a Shallow Ge/SiGe Heterostructure.

Mn5Ge3 is a ferromagnetic phase of the Mn-Ge system that is a potential contact material for efficient spin injection and detection. Here, we investigate the creation of Mn5Ge3-based contacts on a Ge/SiGe quantum well heterostructure via solid-state synthesis. X-ray diffraction spectra fitting indicates the formation of Mn5Ge3-based contacts on bulk Ge and Ge/SiGe. High-resolution scanning transmission electron microscopy imaging and energy dispersive X-ray spectroscopy verify the correct Mn5Ge3-based phase formation. Schottky diode measurements, transmission line measurements, and Hall measurements reveal that Mn5Ge3-based contacts serve as good p-type contacts for Ge/SiGe quantum well heterostructures due to having a low Schottky barrier height of 0.10eV (extracted from a Mn5Ge3/n-Ge analogue) and a contact resistance in the order of 1 kΩ. Furthermore, we show that these electrical characteristics have a gate-voltage dependence, thereby providing tunability.

Theoretical Studies of 2D Electron Gas Distributions and Scattering Characteristics in Double‐Channel n‐Al0.3Ga0.7N/GaN/i‐AlxGa1−xN/GaN High‐Electron‐Mobility Transistors

A detailed analysis of self‐consistent potentials, electric fields, electron distributions, and transport properties of dual‐channel (DC) n‐Al0.3Ga0.7N/GaN/i‐AlxGa1−xN/GaN high‐electron‐mobility transistors (HEMTs) is performed in this article. The 2D electron gas (2DEG) densities and mobility states limited by different scattering mechanisms in channel 1 and channel 2 are obtained, with varying values of doping concentrations, ambient temperatures, Al components, and thicknesses of the back barrier layer. The reduced and increased 2DEG densities are respectively observed in channel 1 and channel 2 with growing Al fractions and thicknesses of the AlxGa1−xN layer. Alloy disorder scattering exhibits a superior effect on carriers in channel 2 due to the lower barrier height and higher permeable electrons, which together with the interface roughness scattering severely depends on the thicknesses and Al fractions of the back barrier layer. Polar optical phonon scattering becomes important at higher temperatures. The trend of individual mobility in channel 1 is exactly opposite to that in channel 2. The parameter variation of the back barrier layer can effectively change the scattering characteristics of the main channel. Low‐temperature mobilities of n‐Al0.3Ga0.7N/GaN/i‐AlxGa1−xN/GaN HEMTs under varied doping concentrations are also obtained. Finally, the results are verified by comparison with the technology computer‐aided design simulations for DC HEMTs.

Analysis of barrier inhomogeneities in Ti/p–type strained Si0.95Ge0.05 Schottky diodes using reverse current-voltage characteristics

Extracting electrical parameters such as barrier height inhomogeneities (BHi) from the forward bias can be very challenging in metal/semiconductor (M/Sc) contacts characterized by low barrier height and high series resistance. In this work we demonstrate that the reverse bias characteristics can be used as an efficient alternative method to investigate the inhomogeneity of low barrier height in M/Sc contacts. In particular, the BHi in Ti/p-strained Si0.95Ge0.05 Schottky barrier diodes (SBD) has been investigated using reverse current–voltage-temperature (IR-VR-T) characteristics over the temperature range of 100–300 K. The temperature dependence of the measured barrier heights (ΦRBp) using reverse-bias is successfully explained in terms of a thermionic emission (TE) current transport associated with Gaussian distribution of the barrier height due BHi. The mean homogeneous barrier height (Ф‾RBp) and its corresponding standard deviation (σRs) were determined for different reverse voltages. A decrease in Ф‾RBp and an increase in σRs with increasing reverse bias are observed, indicating a large barrier height distribution upon high applied reverse bias. The deduced average zero-field barrier height (ФFBp≈0.59eV) from IR-VR agrees well with the corresponding value determined from the forward characteristics. Moreover, the reverse bias extracted values for Richardson constant A* based on BHi model, are found in fair agreement with the reported theoretical value of 32 A cm−2 K−2 for our p-type strained Si0.95Ge0.05 alloy. Finally, the results obtained on Pd/n-type Si0.90Ge0.10 structure shown in this work fully support the utilization of such reverse bias method.

Influence of the substrate conductivity type on the electroluminescence properties of PP+IN and PIN+N diodes based on amorphous silicon carbide (a-Si1-xCx:H) / crystalline silicon (c-Si) heterostructures

The study of the conduction and light emission mechanisms of PIN diodes based on amorphous silicon-carbide (a-Si1-xCx:H) thin film and crystalline silicon (c-Si) substrates is reported in this work. Using the same low-temperature process (200 °C), PP+IN and PIN+N structures were fabricated on p-type and n-type silicon (Si) substrates, respectively. The plasma enhanced chemical vapor deposition (PECVD) technique was employed for the active layers deposition where two different CH4/SiH4 flow rates ratios of 30 sccm/6 sccm and 30 sccm/1 sccm were used. All structures show red-orange light emission in forward bias (FB). The structures with the active layer deposited with a lower SiH4 flow rate, display light emission with a higher intensity at a lower voltage bias.In addition, we related the current-voltage measurements with different conduction models and the dominant charge transport mechanisms in the PIN structures were proposed. The highest Si content structures were related to Fowler-Nordheim (F-N) tunneling, because of its active layer with lower barrier height. On the other hand, the lowest Si content structures were associated with the Poole-Frenkel (P-F) emission, due to a higher density of defects in localized tail states. The results showed the same conduction and emission mechanisms for the PP+IN and PIN+N diodes with the same active layer, regardless of the conduction type of substrate, proving that it is feasible to use the same process for developing light emission devices on p-type and n-type Si substrates.